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Table of Contents


Detector requirements


ASICs documentation

Detector Design Concept

  • Initial design concept revision A (2019) presentation (pptx, pdf)
  • Initial design concept revision B (2019) presentation (pptx, pdf)
  • Electronic system concept (2020) presentation (pptx, pdf)
  • Electronic system concept (2022) presentation (pptx, pdf)
  • IEEE NSS slides (pptx, pdf)


Prototype design concept

  • Mechanical design

    • Review September 2020 (V1) and (V2)
    • The CAD models are available on Teamcenter :

      • DSG-000053483

      • DSG-000022848

  • Thermal analyses
  • Electronics Design

    • Grounding (pptx)

    • Tile board

    • Data concentrator

    • Mother board

    • System ground concept

Board Design files


Prototype Bring-up

Fpga Documentation

Power distribution box

Conversion box


Cables

  • Fiber optics cable
    • MTP24 1:3 breakout cable (link)
  • Vacuum feed through FO cable
  • Power cable for ePixM (at 22" long cable (to be delivered with one of the detectors)

Image Added

(This version should be installed by winter 2024)


PCIe card firmware

Power Supply

  • Power supply should provide 24V
  • Expected power consumption is 7W per ASIC plus 25W for the readout boards totalling 53W
  • Power supplies capable of single channel 75W or more is acceptable but recommend is  2 channels with 50W each
  • Examples of such supplies
    • HMP4030 bench supply. 3 channels up to 160W each. This is the supply used in the lab for testing
    • MPOD (https://www.wiener-d.com/product/mpod-lv-module/) compatible modules (using 2 channels of 24V)
    • MPV 8030I80 - 30V2.5A50W / ch.2mV0.12mA<2mVpp
MPV 8030I80 - 30V2.5A50W / ch.2mV0.12mA<2mVpp
    • MPOD compatible modules (using 1 or 2 channels of 24V)
MPV 4030I40 - 30V5A100W / ch.2mV0.12mA<2mVpp

Operating the detector


Meetings

  • New site to be used from 02/2023 forward https://confluence.slac.stanford.edu/x/7YBAFg
  • Meeting on 02/18/2021
    • Flex boards and wire thickness discussions (ppt)
    • Next step is simulate the stress caused by 10, 12 and14 layer flex assuming ePixHR flex stack up as reference for each layer definition.
  • Meeting on 09/02/2021
    • Slide from Angelo and Dionisio (ppt)

Mecanical model

  • Team center
    • DSG-000022848
  • Carrier insertion and extraction tool (DSG-000022848_3)
  • Key drawings in pdf
    • TODO

Assembly


Data communication protocol

Image definition

Register map

Timing emulator

Sensors Documentation

  • Design files
  • Test Documents
  • etc.



Detector Modules

Software IDDigital SNP&CB SNCarrier SNCoolingLocationNotes
0016778240-0176075265-0452984854-4021594881-1962934296-0177446913-0402653206C00-03BT-02-2324-C00-01 (RX-001)16CFee AlcoveThin entrance sensor 4 V4 ASICs
0016777984-4294967295-4294967295-4032267777-3204448280-0177427457-3053453334C00-0126-C01-01John Doe18ASCnot thin 4 ASICs

C00-02BT-02-2324-C00-08 (RX-000)18IC labThin entrance sensor 2 V2 ASICs