- Marco, Dawood and I
- Prototypes 2-3
- Dawood is working on Rogue 6 updates
- Testing is ongoing
- Scripts will also be ported to rogue 6 and then we will send it to Chris O'grady and Ricciardo
- Status sensor
- Nothing reported today
- Carrier
- Heat syncs arrived, need to modify cooling blocks
- Tungsten protection ?
- we have enough parts for all modules
- 50 ready to be installed
- Mechanics
- Extraction tool: Marco to check the status
- Long pipes length is defined (from Quentin)
- Pipes bent, will be sent out for brazing
- Need to drill transceiver heatsink holes
- Brazing minimum 2, Bob is bending pipes for it
- Action Items
- Marco, Dawood and I
- Prototypes 2-3
- Dawood is working on Rogue 6 updates
- Testing is ongoing
- Scripts will also be ported to rogue 6 and then we will send it to Chris O'grady and Ricciardo
- Status sensor
- Nothing reported today
- Carrier
- Heat syncs arrived, need to modify cooling blocks
- Tungsten protection ?
- we have enough parts for all modules
- 50 ready to be installed
- Mechanics
- Long pipes length is defined (from Quentin)
- Brazing minimum 2, Bob is bending pipes for it
- Action Items
- Prototypes 2-3
- Dawood is back next week then he will test the thin entrance window sensor
- Status sensor
- Sensor are all here
- missing copy of the traveler
- Test devices were not returned from the vendor. This impacts efficiency measurements. Now this needs to be done on actual sensors. Not sure we can do it at ALS
- Radiation damage can still be done
- Carrier
- Delamination problems persist
- Lever arm considered most likely cause. Make tool to insert extract using CK design
- Marco will make 2 sets
- Tungsten protection
- we have enough parts for all modules
- 50 ready to be installed
- Mechanics
- Long pipes length is defined (from Quentin)
- Brazing minimum 2
- Action Items
- Complete the flange installing
- Complete FW & cable
- Pause mechanism implemented by Larry. Dawood needs to test it
- HFE tests - probably the best is to test in the new vacuum setup at the ASC
- Need to remind the ASC team to performa a vacuum test ASAP
- Prototypes 2-3
- Dawood is back next week then he will test the thin entrance window sensor
- Status sensor
- Sensor are all here
- missing copy of the traveler
- Test devices were not returned from the vendor. This impacts efficiency measurements. Now this needs to be done on actual sensors. Not sure we can do it at ALS
- Radiation damage can still be done
- Carrier
- Delamination problems persist
- Lever arm considered most likely cause. Make tool to insert extract using CK design
- Marco will make 2 sets
- Tungsten protection
- we have enough parts for all modules
- 50 ready to be installed
- Mechanics
- Long pipes length is defined (from Quentin)
- Brazing minimum 2
- Action Items
- Complete the flange installing
- Complete FW & cable
- Pause mechanism implemented by Larry. Dawood needs to test it
- HFE tests - probably the best is to test in the new vacuum setup at the ASC
- Need to remind the ASC team to performa a vacuum test ASAP
- Status sensor
- Bump process started
- LF2 - back process has great IvsV curves
- Delivery is about 2months after that if yield is high (high risk activity)
- 115um thick sensor
- LF3 will be processed now
- Entrance face polished to 1nm.
- Last two wafers out for anneal
- 2 L2 will be out and 1 L3 will be out, procurement is ready
- Sent for process
- 90 L3 V2
- 30 V1?
- LF2 - back process has great IvsV curves
- Bump process started
- Testing result
- x-ray we are ready for Cd test (check what the plan is with Lorenzo)
- New carrier
Postpone for 2weeks, focus on TXI mechanics- Change that back to increase the priority here. We need to build a second system for the data systems integration.
- Cooling status
- 5x 0degree and 5x 90 degree in fab ETA 09/18/23
- TBSM (tbsmllc.com) company is working on a quote
- Brazin to be done at Altair
- Brazing shop is open again at SLAC, causing delays. Marco to check on it. How to escalate that?
- Cold plate arrived, brazing will be done by Altair
- Bob is bending the pipes
- Flanges will be installed after thermal tests
- 10 Shells are in fab
- Status of the mechanical parts
- 1 for ePix M 0 degree and 1 for small epix 10kt single
- Chiller and cooling lines
- Storage of HFE to be defined
- Firmware
- FW key components are developed
- Serial number on the carrier are not being readback
- Need to work on support subsystems (Fast ADC, Slow ADC, FW descrambling)
- Thermals tests
- Vacuum tests could be done at the ASC.
- Extend the existing chamber is needed
- Vacuum tests could be done at the ASC.
- Action Items
- Complete the brazing and test the 0-degree
- HFE tests - probably the best is to test in the new vacuum setup at the ASC
- Status sensor
- Bump process started
- LF2 - back process has great IvsV curves
- Delivery is about 2months after that if yield is high (high risk activity)
- 115um thick sensor
- LF3 will be processed now
- Entrance face polished to 1nm.
- Last two wafers out for anneal
- 2 L2 will be out and 1 L3 will be out, procurement is ready
- Sent for process
- 90 L3 V2
- 30 V1?
- LF2 - back process has great IvsV curves
- Bump process started
- Testing result
- x-ray we are ready for Cd test (check what the plan is with Lorenzo)
- New carrier
- Postpone for 2weeks, focus on TXI mechanics
- Cooling status
- 5x 0degree and 5x 90 degree in fab ETA 09/18/23
- TBSM (tbsmllc.com) company is working on a quote
- Brazin to be done at Altair
- Brazing shop is open again at SLAC, causing delays. Marco to check on it. How to escalate that?
- Cold plate arrived, brazing will be done by Altair
- Bob is bending the pipes
- Flanges will be installed after thermal tests
- 10 Shells are in fab
- Status of the mechanical parts
- 1 for ePix M 0 degree and 1 for small epix 10kt single
- Chiller and cooling lines
- Storage of HFE to be defined
- Firmware
- FW key components are developed
- Serial number on the carrier are not being readback
- Need to work on support subsystems (Fast ADC, Slow ADC, FW descrambling)
- Thermals tests
- Vacuum tests could be done at the ASC.
- Extend the existing chamber is needed
- Vacuum tests could be done at the ASC.
- Action Items
- Complete the brazing and test the 0-degree
- HFE tests - probably the best is to test in the new vacuum setup at the ASC
- Status sensor
- Bump process started
- Still in process (expected delivery update by end of the September - quote is for December)
- LF2 - back process has great IvsV curves
- LF3 will be processed now
- Entrance face polished to 1nm.
- Last two wafers out for anneal
- 2 L2 will be out and 1 L3 will be out, procurement is ready
- Sent for process
- 90 L3 V2
- 30 V1?
- Bump process started
- Testing result
- x-ray we are ready for Cd test (need to check with Lozenzo)
- New carrier
- Postpone for 2weeks, focus on TXI mechanics
- Cooling status
- 5x 0degree and 5x 90 degree in fab
- TBSM (tbsmllc.com) company is working on a quote (ETA 09/18)
- We need ~2 weeks to complete the brazing
- Expected hardware ready for 2nd camera by end of September
- Need to order thermal pads
- Need internal power cables
- Brazin to be done at Altair
- Brazing shop is open again at SLAC, causing delays. Marco to check on it. How to escalate that?
- Cold plate arrived, brazing will be done by Altair
- Bob is bending the pipes
- Flanges will be installed after thermal tests
- Status of the mechanical parts
- 1 for ePix M 0 degree and 1 for small epix 10kt single
- Chiller and cooling lines
- Storage of HFE to be defined
- Firmware
- FW key components are developed
- Need to work on support subsystems (Fast ADC, Slow ADC, FW descrambling)
- Thermals tests
- Vacuum tests could be done at the ASC.
- Extend the existing chamber is needed
- Vacuum tests could be done at the ASC.
- Model/ Fabrication
- Out for fab
- 0 degree - 3mm
- 90 degree
- When we will order more?
- Order 5 each type
- Marco to place the order now
- Out for fab
- Action Items
- Complete the brazing and test the 0-degree
- HFE tests - probably the best is to test in the new vacuum setup at the ASC
- Status sensor
- Bump process started
- LF2 - back process has great IvsV curves
- LF3 will be processed now
- Entrance face polished to 1nm.
- Last two wafers out for anneal
- 2 L2 will be out and 1 L3 will be out, procurement is ready
- Ask Chris to paste the plan here
- Bump process started
- Plan for next round of carriers
- 10 carriers with Aluminum
- 10 for the small side entrance window (TXI)
- Carriers arrived
- Cooling simulation
- New pictures need to be taken with visible light. Bonding process needs to be identified. (Nusil or 5 min epoxy)
- Cooling status
- TBSM (tbsmllc.com) company is working on a quote
- Brazin to be done at Altair
- Brazing shop is open again at SLAC, causing delays. Marco to check on it. How to escalate that?
- Cold plate arrived, brazing will be done by Altair
- Bob is bending the pipes
- Flanges will be installed after thermal tests
- Status of the mechanical parts
- 1 for ePix M 0 degree and 1 for small epix 10kt single
- Chiller and cooling lines
- Storage of HFE to be defined
- Firmware
- Without the manual delay we got 21 lanes locked at 35C on the sensor
- Porting scripts are still going on
- Thermals tests
- Vacuum tests could be done at the ASC.
- Extend the existing chamber is needed
- Order has been placed 6/13 - 4-5 weeks lead time.
- Vacuum tests could be done at the ASC.
- Model/ Fabrication
- Cold plate quotes requests are out. Working with the vendor
- 0 degree - 3mm
- requests from 90 will go out.
- Changing 3mm pipes
- -90 is done
- -0 is done
- Fabrication of these detectors will start after thermal test is completed.
- When we will order more?
- Order 5 each type
- Marco to place the order now
- Cold plate quotes requests are out. Working with the vendor
- Action Items
- Complete the brazing and test the 0-degree
- HFE tests - probably the best is to test in the new vacuum setup at the ASC
- Status sensor
- Bump process started
- LF2 - back process has great IvsV curves
- LF3 will be processed now
- Entrance face polished to 1nm.
- Last two wafers out for anneal
- 2 L2 will be out and 1 L3 will be out, procurement is ready
- Ask Chris to paste the plan here
- Bump process started
- Plan for next round of carriers
- 10 carriers with Aluminum
- 10 for the small side entrance window (TXI)
- On order already
- Cooling simulation
- Simulation results
- New pictures need to be taken with visible light. Bonding process needs to be identified. (Nusil or 5 min epoxy)
- Cooling status
- TBSM (tbsmllc.com) company is working on a quote
- Brazin to be done at Altair
- Brazing shop is closed at SLAC, causing delays. Marco to check on it. How to escalate that?
- Cold plate arrived, brazing will be done by Altair
- Bob is bending the pipes
- Flanges will be installed after thermal tests
- Status of the mechanical parts
- 1 for ePix M 0 degree and 1 for small epix 10kt single
- Chiller and cooling lines
- Storage of HFE to be defined
- Firmware
- Without the manual delay we got 21 lanes locked at 35C on the sensor
- Porting scripts are still going on
- Thermals tests
- Vacuum tests could be done at the ASC.
- Extend the existing chamber is needed
- Order has been placed 6/13 - 4-5 weeks lead time.
- Vacuum tests could be done at the ASC.
- Model/ Fabrication
- Cold plate quotes requests are out. Working with the vendor
- 0 degree - 3mm
- requests from 90 will go out.
- Changing 3mm pipes
- -90 is done
- -0 is done
- Fabrication of these detectors will start after thermal test is completed.
- When we will order more?
- Order 5 each type
- Marco to place the order now
- Cold plate quotes requests are out. Working with the vendor
- Action Items
- Complete the brazing and test the 0-degree
- HFE tests - probably the best is to test in the new vacuum setup at the ASC
- Status sensor
- Bump process started
- LF2 - back process has great IvsV curves
- LF3 will be processed now
- Entrance face polished to 1nm.
- Last two wafers out for anneal
- 2 L2 will be out and 1 L3 will be out, procurement is ready
- Ask Chris to paste the plan here
- Bump process started
- Plan for next round of carriers
- 10 carriers with Aluminum
- 10 for the small side entrance window (TXI)
- On order already
- Cooling simulation
- Simulation results
- New pictures need to be taken with visible light. Bonding process needs to be identified. (Nusil or 5 min epoxy)
- Cooling status
- TBSM (tbsmllc.com) company is working on a quote
- Brazin to be done at Altair
- Brazing shop is closed at SLAC, causing delays. Marco to check on it. How to escalate that?
- Cold plate arrived, brazing will be done by Altair
- Bob is bending the pipes
- Flanges will be installed after thermal tests
- Status of the mechanical parts
- 1 for ePix M 0 degree and 1 for small epix 10kt single
- Chiller and cooling lines
- Storage of HFE to be defined
- Firmware
- Without the manual delay we got 21 lanes locked at 35C on the sensor
- Porting scripts are still going on
- Thermals tests
- Vacuum tests could be done at the ASC.
- Extend the existing chamber is needed
- Order has been placed 6/13 - 4-5 weeks lead time.
- Vacuum tests could be done at the ASC.
- Model/ Fabrication
- Cold plate quotes requests are out. Working with the vendor
- 0 degree - 3mm
- requests from 90 will go out.
- Changing 3mm pipes
- -90 is done
- -0 is done
- Fabrication of these detectors will start after thermal test is completed.
- When we will order more?
- Order 5 each type
- Marco to place the order now
- Cold plate quotes requests are out. Working with the vendor
- Action Items
- Complete the brazing and test the 0-degree
- HFE tests - probably the best is to test in the new vacuum setup at the ASC
- Status sensor
- LF2 - back process has great IvsV curves
- LF3 will be processed now
- Entrance face polished to 1nm.
- Last two wafers out for anneal
- 2 L2 will be out and 1 L3 will be out, procurement is ready
- We need to make a decision on what to send out
- Ask Chris to paste the plan here
- Plan for next round of carriers
- 2 carriers are here
- they used the NuSil only epoxy. So they may delaminate.
- New carrier, 10 will be produce
- 2 carriers are here
- Cooling simulation
- Simulation results
- Brazing shop is closed at SLAC, causing delays. Marco to check on it. How to escalate that?
- Cold plate arrived, brazing will be done by Altair
- Bob is bending the pipes
- Flanges will be installed after thermal tests
- Status of the mechanical parts
- New process developed by Marco and Leo
- In glass all test are excellent
- Need to make carriers with ASICS
- When?
- Marco and Leo studies
- presentation
- Etching and bonding with CDMS recipe
- 1 for ePix M 0 degree and 1 for small epix 10kt single
- New process developed by Marco and Leo
- Chiller and cooling lines
- Storage of HFE to be defined
- Firmware
- Without the manual delay we got 21 lanes locked at 35C on the sensor
- Porting scripts are still going on
- Boards
- 1 board had shorts without ASIC. We traced that to decoupling caps
- Show up when ASIC gets wirebonded, what is causing it. See what we get in upcoming 2 carriers
- Thermals tests
- Vacuum tests could be done at the ASC.
- Extend the existing chamber is needed
- Order has been placed 6/13 - 4-5 weeks lead time.
- Vacuum tests could be done at the ASC.
- Model/ Fabrication
- Cold plate quotes requests are out. Working with the vendor
- 0 degree - 3mm
- requests from 90 will go out.
- Changing 3mm pipes
- -90 is done
- -0 is done
- Fabrication of these detectors will start after thermal test is completed.
- When we will order more?
- Order 5 each type
- Marco to place the order now
- Cold plate quotes requests are out. Working with the vendor
- Action Items
- Complete the brazing and test the 0-degree
- HFE tests - probably the best is to test in the new vacuum setup at the ASC
- Status sensor
- LF2 - back process has great IvsV curves
- LF3 will be processed now
- Entrance face polished to 1nm.
- Last two wafers out for anneal
- 2 L2 will be out and 1 L3 will be out, procurement is ready
- We need to make a decision on what to send out
- Ask Chris to paste the plan here
- Plan for next round of carriers
- 2 carriers are here
- they used the NuSil only epoxy. So they may delaminate.
- New carrier, 10 will be produce
- 2 carriers are here
- Cooling simulation
- Did we get the cooling simulation by replacing the strong back with Al instead of Cu?
- Brazing shop is closed at SLAC, causing delays. Marco to check on it. How to escalate that?
- Cold plate arrived, brazing will be done by Altair
- Bob is bending the pipes
- Flanges will be installed after thermal tests
- Status of the mechanical parts
- New process developed by Marco and Leo
- In glass all test are excellent
- Need to make carriers with ASICS
- When?
- Marco and Leo studies
- presentation
- Etching and bonding with CDMS recipe
- 1 for ePix M 0 degree and 1 for small epix 10kt single
- New process developed by Marco and Leo
- Chiller and cooling lines
- Storage of HFE to be defined
- Firmware
- Without the manual delay we got 21 lanes locked at 35C on the sensor
- Porting scripts are still going on
- Boards
- 1 board had shorts without ASIC. We traced that to decoupling caps
- Show up when ASIC gets wirebonded, what is causing it. See what we get in upcoming 2 carriers
- Thermals tests
- Vacuum tests could be done at the ASC.
- Extend the existing chamber is needed
- Order has been placed 6/13 - 4-5 weeks lead time.
- Vacuum tests could be done at the ASC.
- Model/ Fabrication
- Cold plate quotes requests are out. Working with the vendor
- 0 degree - 3mm
- requests from 90 will go out.
- Changing 3mm pipes
- -90 is done
- -0 is done
- Fabrication of these detectors will start after thermal test is completed.
- When we will order more?
- Order 5 each type
- Marco to place the order now
- Cold plate quotes requests are out. Working with the vendor
- Action Items
- Complete the brazing and test the 0-degree
- HFE tests - probably the best is to test in the new vacuum setup at the ASC
- Status sensor
- LF2 - back process has great IvsV curves
- LF3 will be processed now
- Entrance face polished to 1nm.
- Last two wafers out for anneal
- 2 L2 will be out and 1 L3 will be out, procurement is ready
- We need to make a decision on what to send out
- Plan for next round of carriers
- 2 carriers are out for wirebonding, they used the NuSil only epoxy. So they may delaminate.
- New carriers? Suggested 10
- Cooling simulation
- Did we get the cooling simulation by replacing the strong back with Al instead of Cu?
- Brazing shop is closed at SLAC, causing delays. Marco to check on it. How to escalate that?
- Cold plate arrived, brazing will be done by Altair
- Bob is bending the pipes
- Flanges will be installed after thermal tests
- Status of the mechanical parts
- New process developed by Marco and Leo
- In glass all test are excellent
- Need to make carriers with ASICS
- When?
- Marco and Leo studies
- presentation
- Etching and bonding with CDMS recipe
- 1 for ePix M 0 degree and 1 for small epix 10kt single
- New process developed by Marco and Leo
- Chiller and cooling lines
- Storage of HFE to be defined
- Firmware
- Without the manual dela we got 21 lanes locked at 35C on the sensor
- Porting scripts are still going on
- Boards
- 1 board had shorts without ASIC. We traced that to decoupling caps
- Show up when ASIC gets wirebonded, what is causing it. See what we get in upcoming 2 carriers
- Thermals tests
- Vacuum tests could be done at the ASC.
- Extend the existing chamber is needed
- Order has been placed 6/13
- Vacuum tests could be done at the ASC.
- Model/ Fabrication
- Cold plate quotes requests are out. Working with the vendor
- 0 degree - 3mm
- requests from 90 will go out.
- Changing 3mm pipes
- -90 is done
- -0 is done
- Fabrication of these detectors will start after thermal test is completed.
- Cold plate quotes requests are out. Working with the vendor
- Action Items
- Complete the brazing and test the 0-degree
- HFE tests - probably the best is to test in the new vacuum setup at the ASC
- Status sensor
- LF2 - back process has great IvsV curves
- LF3 will be processed now
- Entrance face polished to 1nm.
- Last two wafers out for anneal
- 2 L2 will be out and 1 L3 will be out, procurement is ready
- We need to make a decision on what to send out
- Brazing shop is closed at SLAC, causing delays. Marco to check on it. How to escalate that?
- Status of the mechanical parts
- Delamination
-
- Marco and Leo studies
Flash deposition of metal on copper surface?Which metal?Nickel?Check literature
Can be done on campus- Etching and bonding with CDMS recipe
- Two cold plates on order
- Chiller and cooling lines
- Storage of HFE to be defined
- Firmware
- TXI/SXI common modules integrated
- SW & simulation includes viewer and data receiver
- Boards
- enable signals are ok
- Shorts show up when ASIC gets wirebonded, what is causing it
- Thermals tests
- Vacuum tests could be done at the ASC.
- Extend the existing chamber is needed
- Vacuum tests could be done at the ASC.
- Model/ Fabrication
- Cold plate quotes requests are out. Working with the vendor
- 0 degree - 3mm
- requests from 90 will go out.
- changing 3mm pipes
- -90 is done
- -0 is done
- Fabrication of these detectors will start after thermal test is completed.
- Cold plate quotes requests are out. Working with the vendor
- Action Items
- Test cooling block
- with the boards
- Test cooling block
- Status sensor
- LF2 - back process has great IvsV curves
- LF3 will be processed now
- Entrance face polished to 1nm.
- Last two wafers out for anneal
- Status of the mechanical parts
- wirebonding parts arrived
-
- Flash deposition of metal on copper surface?
- Which metal?
- Nickel?
- Check literature
- Can be done on campus
- Etching and bonding with CDMS recipe
- Which metal?
- Chiller and cooling lines
- Storage of HFE to be defined
- Firmware
- TXI/SXI common modules integrated
- SW & simulation includes viewer and data receiver
- Boards
- enable signals are ok
- Shorts show up when ASIC gets wirebonded, what is causing it
- Thermals tests
- Vacuum tests could be done at the ASC.
- Extend the existing chamber is needed
- Vacuum tests could be done at the ASC.
- Model/ Fabrication
- Cold plate quotes requests are out. Working with the vendor
- 0 degree - 3mm
- requests from 90 will go out.
- changing 3mm pipes
- -90 is done
- -0 is done
- Fabrication of these detectors will start after thermal test is completed.
- Cold plate quotes requests are out. Working with the vendor
- Action Items
- Test cooling block
- with the boards
- Test cooling block
- Status sensor
- LF2 - back process has great IvsV curves
- LF3 will be processed now
- Entrance face polished to 1nm.
- Status of the mechanical parts
- wirebonding parts arrived
- Chiller and cooling lines
- Storage of HFE to be defined
- Firmware
- TXI/SXI common modules integrated
- SW & simulation includes viewer and data receiver
- Boards
- Testing it, investigate power enable signals
- Thermals tests
- Vacuum tests could be done at the ASC.
- Extend the existing chamber is needed
- Nominal load to be done this week. Scott on vacation. We should focus on the results for (thermal images)
- HFE - is here.
- New tech started already, being trained - Stephen
- Vacuum tests could be done at the ASC.
- Model/ Fabrication
- Cold plate quotes requests are out. Working with the vendor
- 0 degree - 3mm
- requests from 90 will go out.
- changing 3mm pipes
- -90 is done
- -0 is done
- Fabrication of these detectors will start after thermal test is completed.
- Cold plate quotes requests are out. Working with the vendor
- Action Items
- Test cooling block
- with the boards
- Test cooling block
- Status sensor
- Entrance face polished to 9nm and was supposed to be 1nm. Fixing that should reduce the noise.
- AFM confirms 9nm roughness.
- Status of the mechanical parts
- wirebonding is out
-
- Chiller and cooling lines
- Storage of HFE to be defined
- Chiller and cooling lines
- Firmware
- PLL solved, clocks are present
- Communication to the FPGA is good
- TXI/SXI common modules being integrated
- Boards
- Testing it, investigate power enable signals
- Thermals tests.
- Nominal load to be done this week. Scott on vacation. We should focus on the results for (thermal images)
- HFE - is here.
- New tech to support our tests in the ASIC lab - Stephen
- Vacuum tests could be done at the ASC. Check with Conny.
- Model/ Fabrication
- Cold plate quotes requests are out
- 0 degree - 3mm
- requests from 90 will go out.
- changing 3mm pipes
- -90 is done
- -0 is done
- Fabrication of these detectors will start after thermal test is completed.
- Cold plate quotes requests are out
- Action Items
- Test cooling block
- with the boards
- Test cooling block
- Status sensor
- Entrance face polished to 9nm and was supposed to be 1nm. Fixing that should reduce the noise.
- AFM confirms 9nm roughness.
- Status of the mechanical parts
- wirebonding is out
-
- Chiller and cooling lines
- Storage of HFE to be defined
- Chiller and cooling lines
- Firmware
- Repository changes, fix bug, closes timing
- Power supply tests work on simulation already
- IBERT already comes up. Loopback to be done next,
- 15Gbps
- Boards
- Digital boards are here
- Thermals tests.
- Nominal load to be done this week.
- Vacuum tests could be done at the ASC. Check with Conny.
- Model
- changing 3mm pipes
- -90 is done
- -0 is done
- Fabrication of these detectors will start after thermal test is completed.
- changing 3mm pipes
- Action Items
- Test cooling block
- with the boards
- Test cooling block
- Status sensor
- Entrance face polished to 9nm and was supposed to be 1nm. Fixing that should reduce the noise.
- Tests will confirm this.
- Status of the mechanical parts
- Two new modules ready for wirebonding
-
- Chiller and cooling lines
- Meeting with Hovanes did not raise any new concerns
- Storage of HFE to be defined
- Chiller and cooling lines
- Firmware
- Repository changes, fix bug, closes timing
- Power supply tests work on simulation already
- IBERT already comes up. Loopback to be done next,
- 15Gbps
- Boards
- Digital boards are here
- Scott bringing up the power supplies
- Thermals tests.
- Nominal load to be done this week.
- Model
- changing 3mm pipes
- -90 is done
- -0 is about 50%
- Carrier
- Adjust routing of the copper pipes to allow for pockets for VR.
- changing 3mm pipes
- Action Items
- Test cooling block
- without the boards
- with the boards
- Test cooling block
- Status sensor
- New process still not providing good measurements
- Chris and Julie will visit the vendor 3/23.
- Status of the mechanical parts
- Need remodel the cold plate 2 day
- Leo assembled a new set with the new strong back
- Needs to confirm fit check
- Need remodel the cold plate 2 day
- Chiller and cooling lines
- Arrived of it 03/23 (https://www.julabo.com/en-us/products/refrigerated-circulators/refrigerated-heating-circulators/corio-cd-1000f)
- Bench on ASICs lab bench next to environmental chamber.
- HFE coolant, shipped 4/10
- Sent slack message to Hovaness about HFE prior to the PJB. Concern HFE outgassing on a small room.
- Chiller and cooling lines
- Firmware
- Simulation works
- Repository changes, fix bug, closes timing
- Need to check common files are aligned by using the same submodules
- Waiting for the power supply tests
- Software common modules need to be integrated with TXI
- Priority on this project over ePixHR10k-2M
- Boards
- Digital boards are here
- Scott bringing up the power supplies
- Model
- changing 3mm pipes
- -90 is done
- -0 is about 50%
- Carrier
- Adjust routing of the copper pipes to allow for pockets for VR.
- changing 3mm pipes
- Action Items
- Test cooling block
- without the boards
- with the boards
- Test cooling block
- Status sensor
- New process good measurements
- Status of the mechanical parts
- New cold plate is fabricated
- Solves the problems identified by the fit check
- 3mm cooling pipes model (Marco to present the changes)
- Chiller and cooling lines
- Arrived of it 03/23 (https://www.julabo.com/en-us/products/refrigerated-circulators/refrigerated-heating-circulators/corio-cd-1000f)
- Bench on ASICs lab bench next to environmental chamber.
- HFE coolant
- Arrived of it 03/23 (https://www.julabo.com/en-us/products/refrigerated-circulators/refrigerated-heating-circulators/corio-cd-1000f)
- Firmware
- Waiting for the power supply tests
- Boards
- Digital boards are here
- Installation
- Action Items
- Status sensor
- New process still not providing good measurements
- Chris and Julie will visit the vendor 3/23.
- Chris could not attend this meeting, I'll follow up with him after the meeting
- Status of the mechanical parts
- Need remodel the cold plate 2 day
- New changes to the 3mm pipes solve the pipe below interface issue. Can we move forward to fabrication?
- Try to modify existing cooling block to get it ready for board testing
- Measure the stack before sending the copper to the machine shop (to be done today)
- We need to make a tool see green notes
- Need remodel the cold plate 2 day
-
- Chiller and cooling lines
- Arrived of it 03/23 (https://www.julabo.com/en-us/products/refrigerated-circulators/refrigerated-heating-circulators/corio-cd-1000f)
- Bench on ASICs lab bench next to environmental chamber.
- HFE coolant
- Chiller and cooling lines
- Firmware
- Repository changes, fix bug, closes timing
- Need to check common files are aligned by using the same submodules
- Waiting for the power supply tests
- Priority on this project over ePixHR10k-2M
- Boards
- Digital boards are here
- Action Items
- Send email to Hovaness about HFE prior to the PJB. Concern HFE outgassing on a small room.
- Test diced ASICs
- Check if we need to make changes
- Status sensor
- New process still not providing good measurements
- Chris and Julie will visit the vendor 3/23.
- Chris could not attend this meeting, I'll follow up with him after the meeting
- Status of the mechanical parts
- Measure the stack before sending the copper to the machine shop (to be done today)
- New changes to the 3mm pipes solve the pipe below interface issue. Can we move forward to fabrication?
- Dionisio to talk with Don/Brandon as follow up.
- Copper block cleaning. Can it be mild etched?
- Chiller and cooling lines
- Arrived of it 03/23 (https://www.julabo.com/en-us/products/refrigerated-circulators/refrigerated-heating-circulators/corio-cd-1000f)
- Bench on ASICs lab bench next to environmental chamber.
- Firmware
- Repository changes, fix bug, closes timing
- Need to check common files are aligned by using the same submodules
- Waiting for the power supply tests
- Priority on this project over ePixHR10k-2M
- Boards
- Digital to arrive by end of the month, parts being loaded now.
- Action Items
- Send email to Hovannes about HFE prior to the PJB. Concern HFE outgassing on a small room.
- Test diced ASICs
- Check if we need to make changes
- Status sensor
- New process still not providing good measurements
- Chris and Julie will visit the vendor 3/23.
- Status of the mechanical parts
- New changes to the 3mm pipes solve the pipe below interface issue. Can we move forward to fabrication?
- Copper block cleaning. Can it be mild etched?
- Chiller and cooling lines
- Delivery of it 03/23 (https://www.julabo.com/en-us/products/refrigerated-circulators/refrigerated-heating-circulators/corio-cd-1000f)
- Bench on lab 1 - New bench
- Firmware
- reuse the core. Can we do better?
- Boards
- Digital to arrive by end of the month, parts being loaded now.
- Action Items
- Get shells fabrication started - not started yet. Pending beamline scientists.
- Test diced ASICs
- Check if we need to make changes
- Status sensor
- sensor back processing did not show the needed quality, but look promising
- Julie and Chris are improving the recipe for the annealing
- Leakage current still high so next test is to try diced devices
- Diced devices are back and will go for leakage current testing
- Concern about wirebonding due to cantilever
- Also the alignment
- Board to strong back aligment
- Symmetric gap from the mesa to the boards
- Asymetric ASIC position
- Importance to have this aligment respected to make sure we can assemble the strong back to the cold plate
- We should make the board and the top edge of the board flush and make counter board slots (if needed)
- Status of electronics boards production
- Digital board are in fab, expected to be back in end of March
- Status of the mechanical parts
- Produce 3 boxes
- base plates are here
- Shell are here
- Leo assembling more hybrids
- Produce 3 boxes
- Copper block cleaning. Can it be mild etched?
- Marco and Leo defined a recipe using citric acid
- Chiller and cooling lines
- Baseline is HFE cooling and we cannot change it until thin sensors are tested at the end of the year.
- Chiller options, should we buy now.
- link for the single detector (needs 3 units)
- link to the larger option (serves all 3 detectors)
- https://www.julabo.com/en-us/products/refrigerated-circulators/refrigerated-heating-circulators/corio-cd-1000f
- Copper block cleaning. Can it be mild etched?
- Action Items
- Get shells fabrication started - not started yet. Pending beamline scientists.
- Test diced ASICs
- Check if we need to make changes
- Status sensor
- sensor back processing did not show the needed quality, but look promising
- Julie and Chris are improving the recipe for the annealing
- Leakage current still high so next test is to try diced devices
- Diced devices are back and will go for leakage current testing
- Vendor to perform scans on 100nm level to see the window properties
- IV scan will be done when Julie is back
- test devices will need to be tested with x-ray thought the back window. May require new boards, or make hole in the existing boards.
- Concern about wirebonding due to cantilever
- Status of electronics boards production
- Digital board still on hold from procurements, but progress was made this week after contacting the procurement team
- Status of the mechanical parts
- New request, transport box. Don will produce initial drawings, similar to TXI, but simpler.
- Produce 3 boxes
- Copper block cleaning. Can it be mild etched?
- chemical etch
- what is the procedure/recipe?
- Marco to reach out to Leo
- We need strong back completed by 03/15 with wirebonds, (transport boxes and assemble done a week before if possible)
- Chiller and cooling lines
- REXS lines have been identified. Test swage lock vs vcr fitting's
- HFE probably not ok for swagelock but water/water-glycol
- Decision to be made with the prototype tests at the earliest in 6 weeks
- Chiller options, should we buy now.
- link for the single detector (needs 3 units)
- link to the larger option (serves all 3 detectors)
- https://www.julabo.com/en-us/products/refrigerated-circulators/refrigerated-heating-circulators/corio-cd-1000f
- Copper block cleaning. Can it be mild etched?
- Action Items
- Get two strong backs assembled with 4 engineer flavor modules 3 units
- Get shells fabrication started - not started yet.
- Board fab
- Dionisio to send email to buyer and his supervisor with Angelo in CC.
Jim, Frank, Maceo Owens, Marco, Dionisio
Proposed design has been adapted by Frank and we need still work on it to make sure it fulfills the vacuum requirements
XAS not approved it, expected to happen this month.
- Detector delivery sequence
- 1st detector needed is chemRIXS (from Angelo's feedback)
- ChemRIXS, qRIXS/REX, XPCS
- Respectively Georgi, Georgi, Josh
- 1st detector needed is chemRIXS (from Angelo's feedback)
- chemRIXS XAS detector – similar to above, that will mount at the end of the beamline; we had some previous mails about this routing
- This design break the water to vacuum rules, I don't think this is an ok option.
- qRIXS REXS detector(ePixHRM-90);
- qRIXS XPCS detector – chamber being designed with Josh and an external company ((ePixHRM-0)
- qRIXS XPCS detector – chamber being designed with Josh and an external company ((ePixHRM-0)
- Detector location (https://lcls.slac.stanford.edu/instruments/neh-2-2)
- Status of electronics boards production
- Digital board still on hold from procurements
- Carriers - boards are with CK, strong back is in fab and expected soon.
- P&C board with Dan
- Status of the mechanical parts
- Chiller and cooling lines
- REXS lines have been identified
- Chiller options
- link for the single detector (needs 3 units)
- link to the larger option (serves all 3 detectors)
- https://www.julabo.com/en-us/products/refrigerated-circulators/refrigerated-heating-circulators/corio-cd-1000f
- Chiller and cooling lines
- Action Items
- Call integration meeting (Dionisio)
- chemRIX seems to be floating and the water to vacuum is broken.
- chiller decision
- Board fab
- Dionisio to send email to buyer and his supervisor with Angelo in CC.
- Call integration meeting (Dionisio)
Overview
Content Tools