Table of Contents |
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ePix
M
readout
IC
Prototype design concept
Mechanical design
Electronics Design
Grounding (pptx)
Tile board
Data concentrator
Mother board
System ground concept
https://confluence.slac.stanford.edu/x/OwGFGQ
Power cable (P&CB_Power_Connector.xlsx)
(This version should be installed by winter 2024)
MPV 8030I | 8 | 0 - 30V | 2.5A | 50W / ch. | 2mV | 0.12mA | <2mVpp |
MPV 8030I | 8 | 0 - 30V | 2.5A | 50W / ch. | 2mV | 0.12mA | <2mVpp |
MPV 4030I | 4 | 0 - 30V | 5A | 100W / ch. | 2mV | 0.12mA | <2mVpp |
MEH – 12/30 | 12V … 30V | 1 | 23A / 550W |
or
MDL | 7… 24V | 2 | +/- 11,5A / 275W (550W total) |
Data communication protocol
Image definition
Register map
Assembly | Software ID | Digital SN | P&CB SN | Carrier SN | Cooling | Location | Notes |
---|---|---|---|---|---|---|---|
Assembly 1 | 0016778240-0176075265-0452984854-4021594881-1962934296-0177446913-0402653206 | C00-03 | BT-02-23 | 24-C00-01 (RX-001) | 16C | Fee Alcove | Thin entrance sensor 4 V4 ASICs |
Assembly 2 | 0016777984-4294967295-4294967295-4032267777-3204448280-0177427457-3053453334 | C00-01 | 26-C01-01 | John Doe | 18 | ASC | not thin 4 ASICs |
Assembly 3 | C00-02 | BT-02-23 | 24-C00-08 (RX-000) | 18 | IC lab | Thin entrance sensor 2 V2 ASICs | |
Assembly 4 | C00-02 | BT-02-23 | 24-C00-01 (RX-001) | At the beam after swapping 6/15
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Assembly 5 | C00-03 | BT-02-23 | 24-C00-08 (RX-000) | At the beam after swapping 6/15
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