Table of Contents |
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ePix M readout IC documentation
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Thermal analyses
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Electronics Desing
Tile board
Data concentrator
Mother board
Tile board
Data concentrator
Mother board
Power cable
Fiber optics cable
design
Electronics Design
Grounding (pptx)
Tile board
Data concentrator
Mother board
System ground concept
https://confluence.slac.stanford.edu/x/OwGFGQ
Power cable (P&CB_Power_Connector.xlsx)
(This version should be installed by winter 2024)
MPV 8030I | 8 | 0 - 30V | 2.5A | 50W / ch. | 2mV | 0.12mA | <2mVpp |
MPV 8030I | 8 | 0 - 30V | 2.5A | 50W / ch. | 2mV | 0.12mA | <2mVpp |
MPV 4030I | 4 | 0 - 30V | 5A | 100W / ch. | 2mV | 0.12mA | <2mVpp |
MEH – 12/30 | 12V … 30V | 1 | 23A / 550W |
or
MDL | 7… 24V | 2 | +/- 11,5A / 275W (550W total) |
Data communication protocol
Image definition
Register map
Assembly | Software ID | Digital SN | P&CB SN | Carrier SN | Cooling | Location | Notes |
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Assembly 1 | 0016778240-0176075265-0452984854-4021594881-1962934296-0177446913-0402653206 | C00-03 | BT-02-23 | 24-C00-01 (RX-001) | 16C | Fee Alcove | Thin entrance sensor 4 V4 ASICs |
Assembly 2 | 0016777984-4294967295-4294967295-4032267777-3204448280-0177427457-3053453334 | C00-01 | 26-C01-01 | John Doe | 18 | ASC | not thin 4 ASICs |
Assembly 3 | C00-02 | BT-02-23 | 24-C00-08 (RX-000) | 18 | IC lab | Thin entrance sensor 2 V2 ASICs | |
Assembly 4 | C00-02 | BT-02-23 | 24-C00-01 (RX-001) | At the beam after swapping 6/15
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Assembly 5 | C00-03 | BT-02-23 | 24-C00-08 (RX-000) | At the beam after swapping 6/15
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