You are viewing an old version of this page. View the current version.

Compare with Current View Page History

« Previous Version 328 Next »

The ePixUHR35kHz Megapixel Cameras project aims to provide modular detector blocks that can be configured into larger cameras in various structural configurations. The smallest building block is a 3x2 detector sensor module, which has a total of 3*2*192*168=193536≈200k pixels. Six of these (6*193536=1161216≈1M pixels) modules are assembled together into a 1 megapixel (1M) camera as shown below to the left. Four of the 1M cameras can then be assembled together, around a central beam pipe aperture, to form a 4M camera shown in the middle below. The largest configuration foreseen for this project is the 16M camera that consists of 16 of the 1M camera blocks as shown below on the right.

1 megapixel (1M)

6x 3x2 sensor modules:

  • 6*3*2 = 36 ASICs
    • 36*192*168 = 1,161,216 pixels
    • 36*8 = 288 ASIC GT serial links
      • 35 kfps: 288*1.975 = 568.8 Gbit/s
  • 6 readout boards:
    • 6 FPGAs & t ransceivers
    • 6*12 = 72 fiber pairs
      • 72*15 = 1080 Gbit/s

4 megapixel (4M)

4x 1M camera assemblies:

  • 4*36 = 144 ASICs
    • 144*192*168 = 4,644,864 pixels
    • 144*8 = 1152 ASIC GT serial links
      • 35 kfps: 1152*1.975 = 2275.2 Gbit/s
  • 4*6 = 24 readout boards:
    • 24 FPGAs & t ransceivers
    • 24*12 = 288 fiber pairs
      • 288*15 = 4320 Gbit/s

16 megapixel (16M)

16x 1M camera assemblies:

  • 16*36 = 576 ASICs
    • 576*192*168 = 18,579,456 pixels
    • 576*8 = 4608 ASIC GT serial links
      • 35 kfps: 4608*1.975 = 9100.8 Gbit/s
  • 16*6 = 96 readout boards:
    • 96 FPGAs & t ransceivers
    • 96*12 = 1152 fiber pairs
      • 1152*15 = 17280 Gbit/s

Table of contents

Useful resources



Mechanical design

Assembly procedure

ASIC carrier module assembly

  • TODO
  • This needs a transport box that protects the ASIC and the sensor after it has been assembled!
  • Contains the following components
    • Carrier board
    • 6x ePixUHR ASICs

Readout module assembly

  • TODO
  • Contains the following components
    • Readout board
    • Thermal interface pad
    • Cooling block
    • LEAP transceiver
    • LEAP fiber pigtail
    • Fiber holder
  • These assemblies will be tested individually before mounting into the 1M assembly and also after mounting
    • Write a test procedure for this

1M assembly

  • The final product of this assembly is a complete and tested 1M block
  • This involves attaching 6x of the following to the 1M cooling block
    • ASIC carrier modules with ASICs and sensor (the most sensitive component)
    • Readout modules with cooling blocks attached

4M assembly

  • TODO

Toy model for inserting 1M module into the 4M crate

Thermal Design

1MP Sensor Module Thermal Analysis by Component

Epoxy Layer ThicknessStrongback Pillar DiameterThermal Pad Thermal ConductivityThermal Pad Thickness

1MP Prototype

Set-Up & Enclosure

Components

3x2 Detector Sensor Module

VisualizationComponentsCircuitryThermal Analysis

  • 36x ceramic heaters - 15 x 15 mm2 to thermally mimic ~150 W of heat dissipated by 1MP ASICs

  • 6x aluminum plates to thermally mimic 1MP sensors & ASICs

  • 6x fiberglass plates to thermally mimic 1MP sensor PCBs

  • 6x aluminum strongbacks

  • Thermal Interfaces:

  • 1x copper thermal plate
  • Cooling pipe - Copper OFE or Stainless Steel. Still TBD
  • See 1MPPrototypeHeaterCircuitSchematic.pptx for more details

  • 30-40 V with 4.6-6.3 A over power supply, yielding 140-250 W of power

  • 6x parallel connections, each with 6x heaters (6.0-6.5 Ohms each) in series

  • See 1MPSensorThermalResistanceAnalysisResults.pptx for more details
  • As of 8/7/24, we expect to see 10.5 °C difference between the top of the aluminum plate and the inner surface of the thermal plate containing the cooling pipe using a 1-D thermal analysis


Readout Board

AS OF 8/7/24, THIS PART OF THE PROTOTYPE PROJECT IS ON HOLD, WAITING FOR FINALIZED COOLING PLATE DESIGN
VisualizationComponentsCircuitry

  • 7x ceramic heaters - 15 x 15 mm2 to thermally mimic heat dissipated by FPGA & power regulators
  • 5x ceramic heaters - 10 x 10 mm2 to thermally mimic heat dissipated by power regulators & LEAP transceiver
  • Thermal Pads
  • Copper Cooling Plate




Sensor design

The measurements below is based on the sensor design found in UHR_3x2_aug2024_overlay.GDS (restricted).


Full sensorLower left cornerBetween two ASICs at the bottomLower right cornerBetween ASICs in the middleTop left cornerTop right corner
Image

Measurements
  • Width (x): 60690 µm
  • Height (y): 36565 µm
  • x offset: 1166.695   µm
  • y offset: 501.635 µm
  • x distance: 218.74  µm
  • x offset: 1167.045 µm
  • y offset: 501.635 µm
  • x offset: 218.74 µm
  • y offset: 218.87  µm
  • x offset: 1166.695 µm
  • y offset: 501.635 µm
  • x offset: 1167.045 µm
  • y offset: 501.635 µm

Sensors for ASIC and systems characterization

There is a strong need to have sensors capable of detecting visible light during the characterization phase of the detector. This capability enables the use on lab, low power, LASER that can reproduce the fast timing and large charges that will be experienced during beam time use. X-ray sensor do have metallization in the entrance window to block visible light therefore existing sensor are not suitable

Solutions proposed 

  • Design mast on the 1x1 sensor in the production run
    • It will take more than a year to have them and adds a step in the process, which adds risks to the production run
    • Etch the metal away. Can be done in individual and prototype sensor (5x5mm)
      • Only sensor for characterization would go through this step
      • Can be done in existing sensor (have them available within a month)
      • In the past we had issues removing the metal and CK's team will investigate this since it is believe this can be consistently done
    • Decision is to make production runs with full metallization and process the sensors in house for characterization


Link to mechanical models: Dxf with the design


Electronics design for 3x2 sensor module

The electronics for the 3x2 sensor module is split into two parts; the ASIC carrier (left in the block diagram below) and the readout board (right in the block diagram). They are electrically connected together through a right-angle connector from the Samtec SEARAY connector family, which provides a total of 500 pins for signals and power. The ASIC carrier contains the 3x2 ASICs together with the 3x2 sensor and minimal amount of other components in order to reduce the size and therefore increase the sensitive area of the detector focal plane (the are which is covered by a sensitive sensor). All the active circuitry for interfacing and powering the ASICs is located on the readout board as well as the components for optical communication with the external back-end system.

More details about the electronics design for the 3x2 module can be found on a dedicated page: 3x2 Readout Overview

ePixUHR-miniTileBD


ePixUHR35kfps 3x2 AssemblyePixUHR35kfps 3x2 Readout BoardePixUHR35kfps 3x2 ASIC Carrier Board
3D view

Altium 365 project

ePixUHR35kfps-3x2-assembly-C00

ePixUHR35kfps-3x2-readout-board-C00

ePixUHR35kfps-3x2-ASIC-carrier-board-C00
Board tracking


PC_261_101_43_C00

PC_261_101_44_C00
Dimensions (X x Y)
59mm x 160mm60.69mm x 42mm
STEP 3D model
ePixUHR35kfps-3x2-readout-board-PCB-2024-08-29.stepePixUHR35kfps-3x2-ASIC-carrier-board-PCB-2024-08-16.step

NOTE: If some of the images above are indicated as missing, please ensure that you are logged into Confluence and have access to the Board tracking pages where the images are stored.



Power

The system is designed to operate at 48 V nominally. There are separate supply connections for analog (APWR/AGND) and digital (DPWR/DGND) that are feeding different parts of the readout electronics, which can be used to have a low noise analog supply and a high-efficiency digital supply for example.

Power supplies

TODO, see TIDIDECS-109 - Getting issue details... STATUS

ePixUHR35kfps 1M Power Breakout Board

The 1M Power Breakout Board distributes the power to six 3x2 Readout Boards. It has two externally facing square Harting connectors, one for all the power and one for optional signals. Each power channel is individually fused with a socketed fuse to protect against catastrophic failures. Changing a fuse requires removal of the board from the 1M assembly, which has been done intentionally since blowing a fuse indicates something internal to the 1M assembly has gone wrong and requires expert investigation. The thermistor connections can be selected on the board through switches to which of the six 3x2 Readout Boards they connect to. Only one thermistor shall be connected per thermistor channel.

Pin Power connector (J1)Signal connector (J2) - optional
1Digital power (DPWR)Timing input 0 (TIMING_IN_0)
2Timing input 1 (TIMING_IN_1)
3Analog power (APWR)Timing output 0 (TIMING_OUT_0)
4Timing output 1 (TIMING_OUT_1)
5Digital ground (DGND)Timing input 2 (TIMING_IN_2)
6Digital ground (DGND)
7Analog ground (AGND)Timing output 2 (TIMING_OUT_2)
8Digital ground (DGND)
9Thermistor in (THERM_EXT_IN)Spare connection (SPARE1)
10Sensor ground (HV_GND)Thermistor in (THERM_AUX_IN)
11Thermistor out (THERM_EXT_OUT)Spare connection (SPARE2)
12Sensor biasing (SENSOR_HV)Thermistor out (THERM_AUX_OUT)

Board specific details

  • See TIDIDECS-81 - Getting issue details... STATUS
  • The "Top" side of the board is facing the rear of the camera
  • The "Bottom" side of the board is facing the inside of the camera and connects to the six 3x2 readout boards through the TFM connectors

PCBAssembly with connectors

Top

Bottom

Altium 365 project

Board tracking

-

Dimensions (X x Y)

110 mm x 110 mm
-

3D files

TODO

Connectors and parts

The two square Harting connectors on the Power Breakout Board above is separated into one for power and one for signal. They have different gender to avoid wrong connections. The power connector have a "protected" female connector on the cable side where voltages may be exposed on the pins. The tables below lists the components that are needed to assembly a full connector stack for the power and signal.

Power connector J1

DescriptionHarting part numberQuantityDigiKeyImage
PCB connector
Han Q12/0 PCB Adapter
09 12 012 9901

1

Male PCB adapter
Han Q12-M for PCB-Adapter
09 12 012 300211195-1378-ND

Male pins for PCB adapter
Han D-M-Kontakt f. Han Q12/0 LP-Adapter
09 15 000 6191121195-1575-ND

Base flange
Han 3A-HBM-SL
09 20 003 030111195-1772-ND

Female crimp housing
Han 12Q-SMC-FI-CRT-PE with QL
09 12 012 310111195-1379-ND

Choose the crimp pins below to match the cable wire diameter (12 in total)
Female crimp pins 2.5 mm² (14 AWG)09 15 000 6206x1195-1581-ND

Female crimp pins 1.5 mm² (16 AWG)09 15 000 6201x1195-1576-ND
Female crimp pins 1.0 mm² (18 AWG)09 15 000 6202x1195-1577-ND
Female crimp pins 0.75 mm² (18 AWG)09 15 000 6205x1195-1580-ND
Female crimp pins 0.5 mm² (20 AWG)09 15 000 6203x1195-1578-ND
Female crimp pins 0.14 mm² - 0.37 mm² (22-26 AWG)09 15 000 6204x1195-1579-ND

Only one hood needed

Metal hood (grey)
Han A Hood Top Entry 2 Pegs M20
19 20 003 144011195-3067-ND

Metal hood (red)
Han 3A-gg-M20 red, M-version
19 20 003 1446x1195-19200031446-ND

Han A Hood Angled Entry 2 Pegs M2019 20 003 1640x1195-3069-ND

Choose the cable gland below to match the external diameter of the cable
Han CGM-M M20x1,5 D.5-9mm19 00 000 5080x1195-3032-ND

Han CGM-M M20x1,5 D.10-14mm19 00 000 5084x1195-3034-ND
Han CGM-M M20x1,5 D.6-12mm 19 00 000 5082 x1195-3033-ND
Han CGM-M M20x1,5 D.5-9mm/6-12mm 19 00 000 5081 x1195-3458-ND

Signal connector J2

DescriptionHarting part numberQuantityDigiKeyImage
PCB connector
Han Q12/0 PCB Adapter
09 12 012 9901

1

Female PCB adapter
Han Q12-F for PCB-Adapter
09 12 012 310211195-1380-ND

Female pins for PCB adapter
Han D F-ontact f. Han Q12/0 PCB adapter
09 15 000 62971209150006297-ND

Base flange
Han 3A-HBM-SL
09 20 003 030111195-1772-ND

Male crimp housing
Han 12Q-SMC-MI-CRT-PE with QL
09 12 012 300111195-1377-ND

Choose the crimp pins below to match the cable wire diameter (12 in total)
Male crimp pins 2.5 mm² (14 AWG)09 15 000 6106x1195-1565-ND

Male crimp pins 1.5 mm² (16 AWG)09 15 000 6101x1195-1560-ND
Male crimp pins 1.0 mm² (18 AWG)09 15 000 6102x1195-1561-ND
Male crimp pins 0.75 mm² (18 AWG)09 15 000 6105x1195-1564-ND
Male crimp pins 0.5 mm² (20 AWG)09 15 000 6103x1195-1562-ND
Male crimp pins 0.14 mm² - 0.37 mm² (22-26 AWG)09 15 000 6104x1195-1563-ND

Only one hood needed

Metal hood
Han A Hood Top Entry 2 Pegs M20
19 20 003 144011195-3067-ND

Metal hood (red)
Han 3A-gg-M20 red, M-version
19 20 003 1446x1195-19200031446-ND

Han A Hood Angled Entry 2 Pegs M2019 20 003 1640x1195-3069-ND

Choose the cable gland below to match the external diameter of the cable
Han CGM-M M20x1,5 D.5-9mm19 00 000 5080x1195-3032-ND

Han CGM-M M20x1,5 D.10-14mm19 00 000 5084x1195-3034-ND
Han CGM-M M20x1,5 D.6-12mm 19 00 000 5082 x1195-3033-ND
Han CGM-M M20x1,5 D.5-9mm/6-12mm 19 00 000 5081 x1195-3458-ND

Optional parts

Some optional parts that might be useful in some cases.

DescriptionHarting part numberDigiKeyImageDrawing
Cover with seal (gray) for female insert
Han 3A Protect Cover, Sealing Die Cast f
09 20 003 5425 1195-1792-ND

PDF

Cover without seal (gray) for male insert
Han 3A Protect Cover, w/o Sealing Die Ca

09 20 003 5426 1195-1793-NDPDF
Cover with seal (blue) for female insert
Han Ex-C for HCC Han 3A with seal
09 36 003 540909360035405-ND

PDF
Cover without seal (blue) for male insert
Han Ex-C for HCC Han 3A
09 36 003 5410 09360035410-NDPDF

Tools

The pins that attach to the wires on the cable are crimped and required a specific tool for it listed below. A pin removal/extraction tool could also be useful in case a pin was inserted into the wrong slot.

DescriptionHarting part numberDigiKeyImageDrawing
Small removal tool
Removal Tool, Han D, Mini
09 99 000 0052

Larger removal tool
Removal Tool Han D
09 99 000 0012

Universal crimp tool
Han Hand Crimp Tool
09 99 000 0110

Simple crimp tool
Han CRIMP TOOL WITH LOCATOR
09 99 000 0021

Power cable

There will be one power cable connecting to the Power connector J1 on the ePixUHR35kfps 1M Power Breakout Board that is routed to external power supplies at the installed location. The choice of cable is motivated and discussed in TIDIDECS-258 - Getting issue details... STATUS .

The cable is an igus CF9-05-12, which is a 12-conductor 0.5mm2 cable that is designed for heavy duty applications where the cable will be flexed in various direction, e.g. on a robotic arm. The outer jacket is made from TPE and the cable is specified to be halogen-free, PVC-free and Silicone-free. Some other important technical data about the cable:

  • Datasheet
  • Number of conductors: 12 x 20 AWG (0.5mm2)
  • Stranded conductors of bare copper wires
  • Cores color code in accordance with DIN 47100

  • Outer jacket colored dark blue (similar to RAL 5011)

  • A tear strip is moulded into the outer jacket (CFRIP)
  • Outer diameter: 0.39 in (10 mm)
  • Weight: 123 kg/km
  • Min. bend radius, fixed: 1.18 in (30 mm)
  • Min. bend radius, flexible: 1.57 in (40 mm)
  • Nominal Voltage: 300/500V
  • DigiKey: 4849-CF9-05-12-DS-ND

We assume a cable length of 50 ft (15.24 m) for now to give some headroom for the installation.

Resistance, voltage drop, power loss and weight

The voltage drop over the cable depends on the length and the current passing through the conductors. The 3x2 Readout Overview power map shows that the highest current is for the digital supply that requires 0.95 A when running at 48 V. For a 1M assembly this means a total current of 6*0.95 = 5.7 A and there are two conductors in the Power connector J1 for each supply that share the current. With this information, we can calculate the expected resistance of the conductors in the cable:

  • Resistance equation: R = ρ * L / A
    • ρ: resistivity of the material, copper at 20°C: ρ ≈ 1.7e-8 [Ωm]
    • L: length of the conductor in [m]
    • A: cross-sectional area of the conductor in [m2]
  • R = 1.7e-8/0.5e-6*15.24 = 0.51816  Ω
  • Voltage drop for two conductors -> half of 5.7 A current
    • U = R*I
    • U = 0.51816*5.7/2 ≈ 1.48 V
  • Expected power loss in the cable: P = I2*R
    • 5.7 A through two conductors at 48 V: 0.5 mm^2: P = (5.7/2)^2*0.51816 ≈ 4.2 W
  • Total weight: 123*15e-3 = 1.845 kg

Sleeve for robotic arm

A flexible sleeve is used to guide the power cables and fiber optic cables for an application where the camera will be mounted on a robotic arm. A Triflex TRE sleeve from igus will be used and more details are available here. There are several sizes available and some of them are shown below as profiles with four gray power cables and four purple fiber optic cables (see below) placed inside for demonstration purposes. The cables are inserted into the sleeve through the slots at the top and bottom as shown below and there are tools available to ease with this.


Fiber

See TIDIDECS-267 - Getting issue details... STATUS


ASIC

The ePixUHR 100 kHz ASIC is used in this project. The main properties are:

  • 192 (H) x 168 (V) pixels
  • 100 um x 100 um pixel size
  • 8 serial data outputs operating at up to ~6 Gbit/s

Resources:

Size and measurements

These measurements are taken from a GDS file (ePixUHR_100kHz_4Julie.gds) that was opened in KLayout.


Full matrixLower left cornerLower right corner
Image

Measurements
  • Width (x): 19306.26 µm
  • Height (y): 18674.7 µm
  • With extension (see TIDIDECS-228 - Getting issue details... STATUS ):
    • Width (x): 19306.26+2*70 = 19446.26 µm
    • Height (y): 18674.7+2*270 =  19214.7 µm
  • Pad
    • Width (x): 60 µm
    • Height (y): 120 µm
    • Pitch: 100 µm
  • First pad location relative to lower-left corner
    • x: 573.13 µm
    • y: 45.095 µm
  • Last pad location relative to lower-right corner
    • x: 473.13 µm
    • y: 45.095 µm

A footprint has been created in Altium Designer for the ASIC. The sizes and measurements listed above have been used and rounded to the nearest µm.


Full matrixLower left cornerLower right corner
Image

Measurements
  • Width (x): 19306 µm
  • Height (y): 18674 µm
  • Pad
    • Width (x): 60 µm
    • Height (y): 120 µm
  • First pad location relative to lower-left corner
    • x: 573 µm
    • y: 45 µm
  • Last pad location relative to lower-right corner
    • x: 473 µm
    • y: 45 µm
    • Pitch: 100 µm




Block diagrams of camera configurations

The block diagrams have been created with Draw.io instead of the Gliffy integration in Confluence, which has major issue as soon as there are more than 100 items in the diagram it seems. It slows down the whole confluence page and it's near impossible to edit the diagram. There are also major limitations in the tools available in Gliffy, e.g. there doesn't seem to be a way to draw an arbitrary polygon or parallelograms.


Project Management



Jira tasks for the project

To do

Summary Assignee Status
Loading...
Refresh

In progress

Summary Assignee Status
Loading...
Refresh

  • No labels