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The ePixUHR35kHz Megapixel Cameras project aims to provide modular detector blocks that can be configured into larger cameras in various structural configurations. The smallest building block is a 3x2 detector sensor module which has a total of 3*2*192*168=193536≈200k pixels. Six of these (6*193536=1161216≈1M pixels) modules are assembled together into a 1 megapixel (1M) camera as shown below to the left. Four of the 1M cameras can then be assembled together around a central beam pipe aperture to form a 4M camera shown in the middle below. The largest configuration foreseen for this project is the 16M camera that consists of 16 of the 1M camera blocks as shown below on the right.

1M


6x 3x2 sensor modules:

  • 6*3*2 = 36 ASICs
  • 6 readout boards:
    • 6 FPGAs
    • 6*12 = 72 fiber pairs

4M

 

4x 1M camera assemblies:

  • 4*36 = 144 ASICs
  • 4*6 = 24 readout boards
    • 24*6 = 144 FPGAs
    • 24*72 = 1728 fiber pairs

16M

 

16x 1M camera assemblies:

  • 16*36 = 576 ASICs
  • 16*6 = 96 readout boards
    • 96*6 = 576 FPGAs
    • 96*72 = 6912 fiber pairs

Table of contents

Useful resources

Jira tasks for the project

To do

Summary Assignee Status
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In progress

Summary Assignee Status
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Design 

Mechanical design

Electronics design 3x2 sensor module

The electronics for the 3x2 sensor module is split into two parts; the ASIC carrier (left in the block diagram below) and the readout board (right in the block diagram). They are electrically connected together through a right-angle connector from the Samtec SEARAY connector family, which provides a total of 500 pins for signals and power. The ASIC carrier contains the 3x2 ASICs together with the 3x2 sensor and minimal amount of other components in order to reduce the size and therefore increase the sensitive area of the detector focal plane (the are which is covered by a sensitive sensor). All the active circuitry for interfacing and powering the ASICs is located on the readout board as well as the components for optical communication with the external back-end system.

ePixUHR-miniTileBD

Concept boards for 3x2 sensor modules


Multi-board assemblyReadout BoardASIC Carrier Board
3D view

Name

ePixUHR35kfps-3x2-concept

ePixUHR35kfps-3x2-readout-board-concept

ePixUHR35kfps-3x2-ASIC-carrier-board-concept
Overview page


3x2 readout board overview


Altium 365 project

https://stanford-linear-accelerator-center.365.altium.com/designs/AA37FBEE-48A8-4801-968D-F2C18F098256

https://stanford-linear-accelerator-center.365.altium.com/designs/8A58F5D8-B190-4E81-9967-A7C97BA5BAD8

https://stanford-linear-accelerator-center.365.altium.com/designs/1C32F53F-0F7D-4FA6-A6A2-A68D0AD370D8
Dimensions (X x Y)N/A60.54mm x 160mm60.54mm x 42mm
STEP 3D modelePixUHR35kfps-3x2-concept.stepePixUHR35kfps-3x2-readout-board-concept-PCB.stepePixUHR35kfps-3x2-ASIC-carrier-board-concept-PCB.step

Board-to-board connector

SAMTEC SEAF8/SEAM8 series connector will be used which provide up to 10x50=500 pins in one connector.



Readout board connectorCarrier board connector
3D model

Photo of sample


Part numberSEAF8-50-1-S-10-2-RASEAM8-50-S02.0-S-10-3
Product pagehttps://www.samtec.com/products/seaf8-50-1-s-10-2-rahttps://www.samtec.com/products/seam8-50-s02.0-s-10-3
Catalog[online version] - [local pdf][online version] - [local pdf]
Drawing[online version] - [local pdf][online version] - [local pdf]
Footprint[online version] - [local pdf][online version] - [local pdf]
STEP 3D modelSEAF8-50-1-S-10-2-RA.stpSEAM8-50-S02.0-S-10-3.stp

Readout board connectorCarrier board connector
3D model

Part numberSEAF8-50-1-S-10-2-RA-GPSEAM8-50-S02.0-S-10-3-GP
Product pagehttps://www.samtec.com/products/seaf8-50-1-s-10-2-ra-gphttps://www.samtec.com/products/seam8-50-s02.0-s-10-3-gp
Catalog[online version] - [local pdf][online version] - [local pdf]
Drawing[online version] - [local pdf][online version] - [local pdf]
Footprint[online version] - [local pdf][online version] - [local pdf]
STEP 3D modelSEAF8-50-1-S-10-2-RA-GP.stpSEAM8-50-S02.0-S-10-3-GP.stp

ASIC

The ePixUHR 35 kHz ASIC is used in this project. The main properties are:

  • 192 (H) x 168 (V) pixels
  • 100 um x 100 um pixel size

Resources:

Size and measurements

These measurements are taken from a GDS file (ePixUHR_35kHz_APonly.gds) that was opened in KLayout.


Full matrixLower left cornerLower right corner
Image

Measurements
  • Width (x): 19306.26 µm
  • Height (y): 18647.7 µm
  • Pad
    • Width (x): 60 µm
    • Height (y): 120 µm
    • Pitch: 100 µm
  • First pad location relative to lower-left corner
    • x: 573.13 µm
    • y: 45.095 µm
  • Last pad location relative to lower-right corner
    • x: 473.13 µm
    • y: 45.095 µm

Altium footprint

Must be updated after changes to the ASIC

A footprint has been created in Altium Designer for the ASIC. The sizes and measurements listed above have been used and rounded to the nearest µm.


Full matrixLower left cornerLower right corner
Image

Measurements
  • Width (x): 19306 µm
  • Height (y): 18648 µm
  • Pad
    • Width (x): 60 µm
    • Height (y): 120 µm
    • Pitch: 100 µm
  • First pad location relative to lower-left corner
    • x: 573 µm
    • y: 45 µm
  • Last pad location relative to lower-right corner
    • x: 473 µm
    • y: 45 µm

Sensor design

TODO

  • Convert GDS to DXF
  • Sensor first draft

    • 36.49 mm x 60.54 mm

pixel / array size

arrangement 3x2, 2x2, 1x1

Link to mechanical models

  • Dxf with the design


Block diagrams of camera configurations

These block diagrams are linked to the static .png images at the top of this page. Changing the block diagrams below will automatically update the .png images at the top.

1M

Gliffy Macro Error

Cannot find a diagram with these parameters:

  • Name: 1M-camera

2M


16M


Meeting notes

Reference documents from HE project


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