Jira tasks for the project

Design 

Mechanical design

• Assembly
  • http://tcprod01:8080/tc/launchapp?-attach=true&-s=226TCSession&-o=RyqVUGKU4OV8rAAAAAAAAAAAAAA&servername=SLAC+Production+Environment

Electronics design 3x2 sensor module

The electronics for the 3x2 sensor module is split into two parts; the ASIC carrier (left in the block diagram below) and the readout board (right in the block diagram). They are electrically connected together through a right-angle connector from the Samtec SEARAY connector family, which provides a total of 500 pins for signals and power. The ASIC carrier contains the 3x2 ASICs together with the 3x2 sensor and minimal amount of other components in order to reduce the size and therefore increase the sensitive area of the detector focal plane (the are which is covered by a sensitive sensor). All the active circuitry for interfacing and powering the ASICs is located on the readout board as well as the components for optical communication with the external back-end system.

Concept boards for 3x2 sensor modules

Board-to-board connector

SAMTEC SEAF8/SEAM8 series connector will be used with 10x40=400 pins in one connector.

Note: Due to the use of a right-angle connector there will be different path lengths for signals in different rows. See hsc-report-sma_seam8-s02_seaf8-ra_web.pdf from Samtec. Page 63 to 65 show the propagation delay of the first row A (0.1 ns) to the last row K (0.18 ns).

ASIC

The ePixUHR 100 kHz ASIC is used in this project. The main properties are:

• 192 (H) x 168 (V) pixels
• 100 um x 100 um pixel size

Resources:

• Confluence page (restricted)

Size and measurements

These measurements are taken from a GDS file (ePixUHR_100kHz_4Julie.gds) that was opened in KLayout.

Altium footprint

A footprint has been created in Altium Designer for the ASIC. The sizes and measurements listed above have been used and rounded to the nearest µm.

Sensor design

Due to asymmetry in the ASICs, the edges of the top row do not align exactly with the edges of the bottom row. The top row is shifted horizontally by 1.35 µm relative to the bottom row. The ASICs are spaced 19485 µm apart horizontally.

• Convert GDS to DXF
  • Download  https://www.klayout.de/, open the GDS and re-save it as DXF, done.

pixel /  array size

arrangement 3x2, 2x2, 1x1

Link to mechanical models

• Dxf with the design

Block diagrams of camera configurations

The block diagrams have been created with Draw.io instead of the Gliffy integration in Confluence, which has major issue as soon as there are more than 100 items in the diagram it seems. It slows down the whole confluence page and it's near impossible to edit the diagram. There are also major limitations in the tools available in Gliffy, e.g. there doesn't seem to be a way to draw an arbitrary polygon or parallelograms.

• 1M-camera-diagram.drawio
• 4M-camera-diagram.drawio
• 16M-camera-diagram.drawio

Meeting notes

• Notes from the design team meetings

• Notes from beam line and design teams meetings

  
  

Reference documents from HE project

• Draft 
• Released
• LCLSII-HE-1.4-IR-0875.pdf