Detector requirements from TXI beam line
- L2SI-GR-0002, Global Requirements Document L2S-I Beam Parameters
- L2SI-PR-0021-R0, NEH 1.2 Instrument Scope Document
ASICs documentation
ePix10K readout ASIC data sheet (link)
Transceivers
Detector Design Concept
- Initial design concept revision A (2019) presentation
- Preliminary Concept Design Review 07-23-21 (talk1, talk2 and talk3)
- Mechanical design
- Thermal analyses
- Electronics Design
Grounding
Tile board
- Mother board
- Voltage drop simulation
- 25Gpps board simulation
- Timing ePixHr10k at LCLS-II
Board Design files
Carrier board (link)
- Carrier to flex interface document
- Mechanical board outline
- Flex board (link)
- Flex to analog board interface document
- Mechanical board outline
- Analog board (link)
- Analog to digital interface document
- Mechanical board outline
- Digital board (link)
- External interface documents (power, control and optics)
- Mechanical board outline
Cables
Power cable
- Fiber optics cable
- MTP24 1:3 breakout cable (link)
- Vacuum Feedthrough (link)
- Internal Fiber Optics cable (link)
Firmware/Software
- List of requirements (link)
- Links to GitHub (link)
- Link to HowTos(link)
- Todo
- Firmware documentation
- Testing system with stand alone timing card, please use this guidelines
Hardware
- Bench-Top
- Digital- & Analog-BRDs: Liquid-Cooling-setup (link)
Procurement
Beamline tests
Meetings
- - Status Meeting focus on mechanical integration. (Presentation with notes)
- - Detailed status meeting (System and electronics talk, Mechanics and cooling talk)
- - Status Meeting slides (file)
- - Status Meeting slides (file)
- - Status Meeting slides (file)
- - Status Meeting slides (file)
- - Status Meeting slides (file)
- - Status Meeting slides (file)
- - Concept design review (talk1, talk2 and talk3)
- - Meeting with the BL scientists (file)
- - Meeting with the BL scientists (file)
- - Meeting with the BL scientists (file)
- - Meeting with the BL scientists (file)
- - Internal Meeting focus on cooling simulation results (file)
- - Meeting with the BL scientists (file)
- - Mechanical status updated and board distribution (no presentation).
- - Tile cooling with simulations from Marco (ppt)
- - Mechanical status updated and board distribution (no presentation).
- - Mechanical status updated and board distribution (no presentation).
- - Status updates and follow up from 04/02 meeting (no file, only meeting notes)
- - Tile cooling and connector discussions (file)
- - Tile cooling and connector discussions (file)
- - Tile cooling and connector discussions (file)
- - Initial electromechanical design concept discussion with beam line group (file)
- - Initial electromechanical design concept discussion (file)
- - Initial electromechanical design concept discussion (file)
- - kick-off meetingFlex boards and wire thickness discussions (ppt)
- File with Dionisio's meeting notes (file)
Data communication protocol
Image definition
Register map
Issues tracking
| Description | Priority | Assigned to | Design | Tested | Notes |
|---|---|---|---|---|---|
| Analog board power supplies not powering up. | High | Scott/Dionisio | Done | The missing connection on the power planes have been identified by Scott and implemented in the C01 design files. A new board spin is required. | |
| Flex cable too thick | Medium | Dionisio/Tung | Need to change the fab notes to make board more flexible. If needed we will change the planes from solid to criss-cross pattern | ||
| Carrier board copper plate opening is too narrow | Medium | Marco | Done | Done | Marco has changed the design file to increase the opening and requested the tech to rework all existing copper carriers |
| Component heights to not match pockets in the cooling block | Medium | Marco | Scott found some components hight did not match the needs. Marco is working with Don to get this fixed | ||
| Mounting holes on cooling block have wrong size | High | Marco | Mounting hole on the cooling block are larger than in the board. This prevents us from securing the boards. | ||
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