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The ePixUHR35kHz Megapixel Cameras project aims to provide modular detector blocks that can be configured into larger cameras in various structural configurations. The smallest building block is a 3x2 detector tile which has a total of 3*2*192*168=193536≈200k pixels. Six of these (6*193536=1161216≈1M pixels) tiles are assembled together into a 1 megapixel (1M) camera as shown below to the left. Four of the 1M cameras can then be assembled together around a central beam pipe aperture to form a 4M camera shown in the middle below. The largest configuration foreseen for this project is the 16M camera that consists of 16 of the 1M camera blocks as shown below on the right.

1M

 

 

4M

 

16M

 

Table of contents

Useful resources

Jira tasks for the project

To do

Summary Assignee Status
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In progress

Summary Assignee Status
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Design 

Mechanical design

Electronics design

ePixUHR-miniTileBD


FPGA

The FPGA that will be used is XCKU15P-2FFVA1760E from AMD/Xilinx.

  • Package mechanical drawing
  • FPGA measured 3D model
  • Difference between the drawing and 3D model used:
    • Total height (A = A1 + A2):
      • 3D model is 3.86 mm
      • Drawing is 3.71 mm (max)
    • Solder ball height (A1):
      • 3D model is 0.6 mm
      • Drawing is 0.6 mm (max)
    • Package height (A2):
      • 3D model is 3.26 mm
      • Drawing is 3.21 mm (max)
    • → It seems that the 3D model of the package we have is not 100% accurate, but the difference (3.86-3.71=0.15 mm) is negligible
    • Any thermal interface between the package and the cooling block should be able to "absorb" this difference

Board-to-board connector

SAMTEC SEAF8/SEAM8 series connector will be used which provide up to 10x50=500 pins in one connector.



Readout board connectorCarrier board connector
3D model

Part numberSEAF8-50-1-S-10-2-RASEAM8-50-S02.0-S-10-3
Product pagehttps://www.samtec.com/products/seaf8-50-1-s-10-2-rahttps://www.samtec.com/products/seam8-50-s02.0-s-10-3
Catalog[online version] - [local pdf][online version] - [local pdf]
Drawing[online version] - [local pdf][online version] - [local pdf]
Footprint[online version] - [local pdf][online version] - [local pdf]
STEP 3D modelSEAF8-50-1-S-10-2-RA.stpSEAM8-50-S02.0-S-10-3.stp

Readout board connectorCarrier board connector
3D model

Part numberSEAF8-50-1-S-10-2-RA-GPSEAM8-50-S02.0-S-10-3-GP
Product pagehttps://www.samtec.com/products/seaf8-50-1-s-10-2-ra-gphttps://www.samtec.com/products/seam8-50-s02.0-s-10-3-gp
Catalog[online version] - [local pdf][online version] - [local pdf]
Drawing[online version] - [local pdf][online version] - [local pdf]
Footprint[online version] - [local pdf][online version] - [local pdf]
STEP 3D modelSEAF8-50-1-S-10-2-RA-GP.stpSEAM8-50-S02.0-S-10-3-GP.stp

Concept boards for 3x2 sensor modules


Multi-board assemblyReadout BoardASIC Carrier Board
3D view

Name

ePixUHR35kfps-3x2-concept

ePixUHR35kfps-3x2-readout-board-concept

ePixUHR35kfps-3x2-ASIC-carrier-board-concept
Altium 365 project

https://stanford-linear-accelerator-center.365.altium.com/designs/AA37FBEE-48A8-4801-968D-F2C18F098256

https://stanford-linear-accelerator-center.365.altium.com/designs/8A58F5D8-B190-4E81-9967-A7C97BA5BAD8

https://stanford-linear-accelerator-center.365.altium.com/designs/1C32F53F-0F7D-4FA6-A6A2-A68D0AD370D8
Dimensions (X x Y)N/A60.54mm x 160mm60.54mm x 42mm
STEP 3D modelePixUHR35kfps-3x2-concept.stepePixUHR35kfps-3x2-readout-board-concept-PCB.stepePixUHR35kfps-3x2-ASIC-carrier-board-concept-PCB.step

ASIC

The ePixUHR 35 kHz ASIC is used in this project. The main properties are:

  • 192 (H) x 168 (V) pixels
  • 100 um x 100 um pixel size

Resources:

Size and measurements

These measurements are taken from a GDS file (ePixUHR_35kHz_APonly.gds) that was opened in KLayout.


Full matrixLower left cornerLower right corner
Image

Measurements
  • Width (x): 19334 µm
  • Height (y): 18373.95 µm
    • 18273.95 µm + 100 µm (note from ASIC group)
  • Pad
    • Width (x): 60 µm
    • Height (y): 120 µm
    • Pitch: 100 µm
  • First pad location relative to lower-left corner
    • x: 186.985 µm
    • y: 58.09 µm
  • Last pad location relative to lower-right corner
    • x: 187.015 µm
    • y: 58.09 µm

Altium footprint

A footprint has been created in Altium Designer for the ASIC. The sizes and measurements listed above have been used and rounded to the nearest µm.


Full matrixLower left cornerLower right corner
Image

Measurements
  • Width (x): 19334 µm
  • Height (y): 18374 µm
  • Pad
    • Width (x): 60 µm
    • Height (y): 120 µm
    • Pitch: 100 µm
  • First pad location relative to lower-left corner
    • x: 187 µm
    • y: 58 µm
  • Last pad location relative to lower-right corner
    • x: 187 µm
    • y: 58 µm

Sensor design

TODO

  • Convert GDS to DXF
  • Sensor first draft

    • 36.49 mm x 60.54 mm

pixel / array size

arrangement 3x2, 2x2, 1x1

Link to mechanical models

  • Dxf with the design


Meeting notes

Reference documents from HE project


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