Design 

Mechanical design

• Assembly
  • http://tcprod01:8080/tc/launchapp?-attach=true&-s=226TCSession&-o=RyqVUGKU4OV8rAAAAAAAAAAAAAA&servername=SLAC+Production+Environment

Electronics design

FPGA

The FPGA that will be used is XCKU15P-2FFVA1760E from AMD/Xilinx.

• Package mechanical drawing
• FPGA measured 3D model
• Difference between the drawing and 3D model used:
  • Total height (A = A1 + A2):
    • 3D model is 3.86 mm
    • Drawing is 3.71 mm (max)
  • Solder ball height (A1):
    • 3D model is 0.6 mm
    • Drawing is 0.6 mm (max)
  • Package height (A2):
    • 3D model is 3.26 mm
    • Drawing is 3.21 mm (max)
  • → It seems that the 3D model of the package we have is not 100% accurate, but the difference (3.86-3.71=0.15 mm) is negligible
  • Any thermal interface between the package and the cooling block should be able to "absorb" this difference

Board-to-board connector

SAMTEC SEAF8/SEAM8 series connector will be used which provide up to 10x50=500 pins in one connector.

Concept boards for 3x2 sensor modules

TODO

• Trade study complete material (shared with GT readout)
• Power estimation
• Power block diagram 
• readout board block diagram
• TIDIDECS-46 - Getting issue details... STATUS

ASIC

The ePixUHR 35 kHz ASIC is used in this project. The main properties are:

• 192 (H) x 168 (V) pixels
• 100 um x 100 um pixel size

Resources:

• Confluence page (restricted)
• iWoRiD 2023 presentation: ePixUHR-35kHz: a read-out ASIC for tender X-ray imaging at LCLS-II with 35 kHz frame-rate

Size and measurements

These measurements are taken from a GDS file (ePixUHR_35kHz_APonly.gds) that was opened in KLayout.

Altium footprint

A footprint has been created in Altium Designer for the ASIC. The sizes and measurements listed above have been used and rounded to the nearest µm.

Sensor design

TODO

• Convert GDS to DXF
  • Download https://www.klayout.de/, open the GDS and re-save it as DXF, done.
• Sensor first draft

  • 36.49 mm x 60.54 mm

pixel / array size

arrangement 3x2, 2x2, 1x1

Link to mechanical models

• Dxf with the design

Meeting notes

• Notes from the design team meetings

• Notes from beam line and design teams meetings

  
  

Reference documents from HE project

• Draft 
• Released
• LCLSII-HE-1.4-IR-0875.pdf