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Detector requirements from TXI beam line
- L2SI-GR-0002, Global Requirements Document L2S-I Beam Parameters
- L2SI-PR-0021-R0, NEH 1.2 Instrument Scope Document
ASICs documentation
Transceivers
Detector Design Concept
- Initial design concept revision A (2019) presentation
- Preliminary Concept Design Review 07-23-21 (talk1, talk2 and talk3)
- Mechanical design
- Thermal analyses
- Electronics Design
Grounding
Tile board
- Mother board
- Voltage drop simulation
- 25Gpps board simulation
- Timing ePixHr10k at LCLS-II
Design files
Design files (boards, cables, firmware and software)
Board design files
Carrier board (link)
- Carrier to flex interface document
- Mechanical board outline
- Flex board (link)
- Flex to analog board interface document
- Mechanical board outline
- Analog board (link)
- Analog to digital interface document
- Mechanical board outline
- Digital board (link)
- External interface documents (power, control and optics)
- Mechanical board outline
Cables
- Fiber optics cable
- MTP24 1:3 breakout cable (link)
- Vacuum Feedthrough (link)
- Internal Fiber Optics cable (link)
Firmware/Software
Hardware
- Bench-Top
- Digital- & Analog-BRDs: Liquid-Cooling-setup (link)
Procurement
- Track procured items for the project (link)
- Kaz list of items to by acquired by the beamline (link)
Beamline tests
Meetings
Meeting's list
New Meeting notes page
- - Status Meeting focus on mechanical integration. (Presentation with notes)
- - Detailed status meeting (System and electronics talk, Mechanics and cooling talk)
- - Status Meeting slides (file)
- - Status Meeting slides (file)
- - Status Meeting slides (file)
- - Status Meeting slides (file)
- - Status Meeting slides (file)
- - Status Meeting slides (file)
- - Concept design review (talk1, talk2 and talk3)
- - Meeting with the BL scientists (file)
- - Meeting with the BL scientists (file)
- - Meeting with the BL scientists (file)
- - Meeting with the BL scientists (file)
- - Internal Meeting focus on cooling simulation results (file)
- - Meeting with the BL scientists (file)
- - Mechanical status updated and board distribution (no presentation).
- - Tile cooling with simulations from Marco (ppt)
- - Mechanical status updated and board distribution (no presentation).
- - Mechanical status updated and board distribution (no presentation).
- - Status updates and follow up from 04/02 meeting (no file, only meeting notes)
- - Tile cooling and connector discussions (file)
- - Tile cooling and connector discussions (file)
- - Tile cooling and connector discussions (file)
- - Initial electromechanical design concept discussion with beam line group (file)
- - Initial electromechanical design concept discussion (file)
- - Initial electromechanical design concept discussion (file)
- - kick-off meetingFlex boards and wire thickness discussions (ppt)
- File with Dionisio's meeting notes (file)
Data communication protocol
TBD
Image definition
TBD
Register map
TBD
Issues tracking
Issues tracking list
Description | Priority | Assigned to | Design | Tested | Notes |
---|
- Analog board power supplies not powering up.
| High | Scott/Dionisio | Done |
| The missing connection on the power planes have been identified by Scott and implemented in the C01 design files. A new board spin is required. |
| Medium | Dionisio/Tung |
|
| Need to change the fab notes to make board more flexible. If needed we will change the planes from solid to criss-cross pattern |
- Carrier board copper plate opening is too narrow
| Medium | Marco | Done | Done | Marco has changed the design file to increase the opening and requested the tech to rework all existing copper carriers |
- Component heights to not match pockets in the cooling block
| Medium | Marco |
|
| Scott found some components hight did not match the needs. Marco is working with Don to get this fixed |
- Mounting holes on cooling block have wrong size
| High | Marco |
|
| Mounting hole on the cooling block are larger than in the board. This prevents us from securing the boards. |
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