ePixHR10kT meeting notes

March-27-2024

TXI status

Status
- Pause on TXI until next FY
- Focus on ePixHRM
Fit check
- Gabriel and Chris could not attend this weeks meeting
- Issues described in confluence https://confluence.slac.stanford.edu/x/xo-JGQ
- tapped holes need to have helicoils
  - seem some of the helicons is missing
- Assembly the sensor modules with guiding screws
- Tungsten shields should be done now
- Fit check is on the small detector to be done next week
  - Then stop
CO2 Safety
- Marco will have a lab space in FPD
- Norm and Marc Weibel will participate on this review
- Review to happen next week
Prototype
ASIC testing
- Beamtime on Friday
Tungsten foil??
- Foils should be arriving here today
- 2 weeks of work to be able to use them
Flip chip bonding - 3 to 4 months turn around
- Release last week
- Costs Euro123k
Chiller locations
- - ASC lab (Conny's lab) - temporary (installed first)
  - B084 - Clean room - Permanent
  - Beamline - 2 chiller permanent (1 now and one from ASC)
  - Shipper is working on getting them shipped but they did not departure from Poland yet.
- For the 2.5KW (cooling) the input power does not scale linearly
Small side entrance detector
- Ready to fit check
Open rec for mechanical engineer
- Offer letter approved

March-13-2024

TXI status

Status
- Pause on TXI until next FY
- Focus on ePixHRM
Fit check
- Gabriel and Chris could not attend this weeks meeting
- Issues described in confluence https://confluence.slac.stanford.edu/x/xo-JGQ
- tapped holes need to have helicoils
  - seem some of the helicons is missing
- Assembly the sensor modules with guiding screws
- Tungsten shields should be done now
- Fit check is on the small detector to be done next week
  - Then stop
CO2 Safety
- Chris Kroeber will ask about it again
- Working with Marc Weibel
- Sent info on Monday 27th
- Still waiting on it
Prototype
ASIC testing
- Beamtime on Friday
Tungsten foil??
- Foils should be arriving here today
- 2 weeks of work to be able to use them
Flip chip bonding - 3 to 4 months turn around
- Release last week
- Costs Euro123k
Chiller locations
- - ASC lab (Conny's lab) - temporary (installed first)
  - B084 - Clean room - Permanent
  - Beamline - 2 chiller permanent (1 now and one from ASC)
  - Shipper is working on getting them shipped but they did not departure from Poland yet.
- For the 2.5KW (cooling) the input power does not scale linearly
Small side entrance detector
- Ready to fit check
Open rec for mechanical engineer
- Offer letter approved

March-06-2024

TXI status

Status
- Pause on TXI until next FY
- Focus on ePixHRM
Fit check
- Issues described in confluence https://confluence.slac.stanford.edu/x/xo-JGQ
- tapped holes need to have helicoils
  - seem some of the helicons is missing
- Assembly the sensor modules with guiding screws
- Tungsten shields should be done now
Fit check is on the small detector to be done next week
Then stop

CO2 Safety
- Working with Marc Weibel
- Sent info on Monday 27th
- Still waiting on it
Prototype
- Fit check is going
- Report for the assembly by next week
- Buying more thermal pads
ASIC testing
- 2.6V is new default
- New setting defined by ASIC team
Tungsten foil
- Foils should be arriving here today
- 2 weeks of work to be able to use them
Flip chip bonding - 3 to 4 months turn around
- Goal is to release both 4x1 and 2x2 detectors
- Not released yet
- Costs Euro123k
Chiller locations
- - ASC lab (Conny's lab) - temporary (installed first)
  - B084 - Clean room - Permanent
  - Beamline - 2 chiller permanent (1 now and one from ASC)
  - Shipper is working on getting them shipped but they did not departure from Poland yet.
- For the 2.5KW (cooling) the input power does not scale linearly

Small side entrance detector
- Ready to fit check
- Missing only screws to arrive
Open rec for mechanical engineer
- Going to HR today

February-14-2024

CO2 Safety
- Working with Marc Weibel
- Sent info on Monday 27th
- Still waiting on it
Prototype
- Fit check is going
- Report for the assembly by next week
- Buying more thermal pads
ASIC testing
- 2.6V is new default
- New setting defined by ASIC team
Tungsten foil
- Foils should be arriving here today
- 2 weeks of work to be able to use them
Flip chip bonding - 3 to 4 months turn around
- Goal is to release both 4x1 and 2x2 detectors
- Not released yet
- Costs Euro123k
Chiller locations
- - ASC lab (Conny's lab) - temporary (installed first)
  - B084 - Clean room - Permanent
  - Beamline - 2 chiller permanent (1 now and one from ASC)
  - Shipper is working on getting them shipped but they did not departure from Poland yet.
- For the 2.5KW (cooling) the input power does not scale linearly

Small side entrance detector
- Ready to fit check
- Missing only screws to arrive
Open rec for mechanical engineer
- Going to HR today

January-31-2024

CO2 Safety
- Working with Marc Weibel
- Sent info on Monday 27th
- Still waiting on it
Prototype
- Need Hydrostatic pressure test
- Passed test
ASIC testing
- 2.6V and reducing bit width might solve the banding issues
- Check detector needed before we continue ADC improvements
Tungsten foil
- Delivery expected soon
- 2 weeks of work to be able to use them
Flip chip bonding - 3 to 4 months turn around
- Goal is to release both 4x1 and 2x2 detectors
- Not released yet
- Costs Euro123k
Chiller locations
- - ASC lab (Conny's lab) - temporary (installed first)
  - B084 - Clean room - Permanent
  - Beamline - 2 chiller permanent (1 now and one from ASC)
  - Shipper is working on getting them shipped but they did not departure from Poland yet.
- For the 2.5KW (cooling) the input power does not scale linearly

Small side entrance detector
- Ready to fit check
- Missing only screws to arrive

November-29-2023

CO2 Safety
- Working with Marc Weibel
- Sent info on Monday 27th
Prototype
- Need Hydrostatic pressure test
- Bob will do it "soon"
ASIC testing
- V4 are our for adding bumps (35V bias on Cd109 source)
  - Complete minimum test
    - Noise
    - Programing matrix
    - global R/W
    - gain measurement (needs sensor)
      - Lithography is done
      - 3 weeks minimum
Tungsten foil
- Material has been procured
- Laser cut can be be slow process 2 weeks to 1 month
- Plasma coted pm campus
- We will start one order now to make sure it does not cause impact on schedule. May need to be redone if fit check fails.
Flip chip bonding - 3 to 4 months turn around
- Goal is to release both 4x1 and 2x2 detectors
- Not released yet
- Costs Euro123k
Chiller locations
- - ASC lab (Conny's lab) - temporary (installed first)
  - B084 - Clean room - Permanent
  - Beamline - 2 chiller permanent (1 now and one from ASC)
  - Shipper is working on getting them shipped but they did not departure from Poland yet.
- For the 2.5KW (cooling) the input power does not scale linearly

Small side entrance detector
- Get it vacuum clean
Action items
- check 2x2 carriers
  - Fab more to have ~10 for science
- Strong backs
  - Can we check the strong back dimensions?
  - Compare to the actuals
  - Fab 10 more
- Braze cooling block for the small detector
- 1/4 full system fit check (late July)

October-18-2023

Mechanical support
- Two new designers has been identified.
ASIC testing
- V4 are our for adding bumps (35V bias on Cd109 source)
  - 6 pairs prepared 9/26 -DONE !!!
  - Complete minimum test
    - Noise
    - Programing matrix
    - global R/W
    - gain measurement (needs sensor)
      - Lithography is done
      - 3 weeks minimum
- Tungsten foil
  - Material has been procured
  - Laser cut can be be slow process 2 weeks to 1 month
  - Plasma coted pm campus
  - We will start one order now to make sure it does not cause impact on schedule. May need to be redone if fit check fails.
- Carrier - Version 2 (-C02) for the 2x2 and -C00 for the 4x1
  - Check if 2x2 have arrived
  - give non working carrier to CK, put new ASIC
  - 4x1 out for wirebonding - arrived here
    - First carrier tested 3 out of 4 ASICs work
- Flip chip bonding - 3 to 4 months turn around
  - Goal is to release both 4x1 and 2x2 detectors
  - Not released yet
- Testing to start in August
  - ~~2 weeks test to validate ADC, bugs fixed and pixel configurates~~
- Metrology test with bleacher (Marco/Chris to meet)
  - Measurements done.
  - Need to send files to DATA systems
Safety (call a meeting after beam time)
- LATE to integrate into ASC
- Meeting with Conny, Kaz, Marco and Chris Koeber
  - Marco sent info to start talks with safety personal (Hovannes and Marc Weibel)
  - We need to talk with Marc
- Chiller locations
  - ASC lab (Conny's lab) - temporary (installed first)
  - B084 - Clean room - Permanent
  - Beamline - 2 chiller permanent (1 now and one from ASC)
  - Shipper is working on getting them shipped but they did not departure from Poland yet.
- For the 2.5KW (cooling) the input power does not scale linearly

2M pixel - TXI detector
- Bob to braze it this week
- Enables stress test on the electronics
- Release analog board for final fab
- Issues
  - back lash on one crescent - system has been retrofitted and problem solved
  - 1/4 pipes bending is not working
    - Next step make a final bending (this week)
  - Brazing company should receive parts next week
    - Copper bending
    - - Fabricating 1 of each flavor now for testing
    - Needs the brazing
      - ETA to come from company
  - Assembly the two modules together
    - Manual torch brazing, done at SLAC
- Analog board
  - Once tests are completed, C01 will be submitted to Fab
- Digital board
- FW
  - Timing receiver works (RxLock flag not going high)
  - Julian/Dawood will start work on the FW in August
    - Data descrambling
- Motion system
  - Vacuum rated parts, also here.
  - Check with Andy for controls system integration
- Mechanical status
  - We need a full system fit check, planed for ~~late July~~-> ~~Mid August →~~ Mid September
  - Marco needs a measurement of actual power consumption
  - CO2 system
    - In ASC
  - 2 units are stored at B

Small side entrance detector
- Jena's email
- Changing de diameter of the cooling pipe to 1/8".
  - Modify desing
  - Fab
  - Brazing
  - Encloser
  - Assemly
  - Cold plates arriving today
  - Has to go to brazing
    - Complete detector in ETA ~3weeks
  - Parallel detector (epoxied)
Action items
- check 2x2 carriers
  - Fab more to have ~10 for science
- Strong backs
  - Can we check the strong back dimensions?
  - Compare to the actuals
  - Fab 10 more
- Braze cooling block for the small detector
- 1/4 full system fit check (late July)

September-06-2023

Mechanical support
- New designer (Veronica) has been identified.
- We are in the process to extend her contract (Mario Santa)
ASIC testing
- Litho work
  - V4 are our for adding bumps
  - 6 pairs prepared 9/26
  - Flip chip 2 today
  - ETA for them end of the week
  - What needs
    - Complete minimum test
      - Noise
      - Programing matrix
      - global R/W
      - gain measurement (needs sensor)
        Lithography is done
        3 weeks minimum
- Tungsten foil
  - Material has been procured
  - Laser cut can be be slow process 2 weeks to 1 month
  - Plasma coted pm campus
  - We will start one order now to make sure it does not cause impact on schedule. May need to be redone if fit check fails.
- Carrier - Version 2 (-C02) for the 2x2 and -C00 for the 4x1
  - give non working carrier to CK, put new ASIC
  - 4x1 out for wirebonding
- Flip chip bonding - 3 to 4 months turn around
  - Not released yet
- Testing to start in August
  - ~~2 weeks test to validate ADC, bugs fixed and pixel configurates~~
- Metrology test with bleacher (Marco/Chris to meet)
  - Crescent, with frame and bleacher
  - ETA?
Safety
- Meeting with Conny, Kaz, Marco and Chris Koeber
  - Marco sent info to start talks with safety personal (Hovannes and Marc Weibel)
  - We need to talk with Marc
- Chiller locations
  - ASC lab (Conny's lab) - temporary (installed first)
  - B084 - Clean room - Permanent
  - Beamline - 2 chiller permanent (1 now and one from ASC)
  - Shipper is working on getting them shipped but they did not departure from Poland yet.
- For the 2.5KW (cooling) the input power does not scale linearly

2M pixel - TXI detector
- Issues
  - back lash on one crescent - system has been retrofitted and problem solved
  - 1/4 pipes bending is not working
    - Next step make a final bending (this week)
  - Brazing company should receive parts next week
    - Copper bending
    - - Fabricating 1 of each flavor now for testing
    - Needs the brazing
      - ETA to come from company
  - Assembly the two modules together
    - Manual torch brazing, done at SLAC
- Analog board
  - Once tests are completed, C01 will be submitted to Fab
- Digital board
- FW
  - Timing receiver works (RxLock flag not going high)
  - Julian/Dawood will start work on the FW in August
    - ADC (fast already working, now fw dev is on the slow ADC)
    - Serial numbers
    - and data descrambling
- Motion system
  - Check with Andy for controls system integration
- Mechanical status
  - New design for cold plates because bending did not work as planned
    - expected 4 weeks to have a assembled system
  - Progress on Motion system assembly
  - We need a full system fit check, planed for ~~late July~~-> ~~Mid August →~~ Mid September
  - Marco needs a measurement of actual power consumption
  - Furnace at SLAC B44 is down
    - Bodycote vendor can be used for the brazing
  - CO2 system
    - In ASC
  - Mark Freitag is working on making a power cable. We will run it at 208V @ 60Hz and expect it to perform close to the specs (50Hz)
  - 2 units are stored at B

Small side entrance detector
- Jena's email
- Changing de diameter of the cooling pipe to 1/8".
  - Modify desing
  - Fab
  - Brazing
  - Encloser
  - Assemly
  - Cold plates arriving today
  - Has to go to brazing
    - Complete detector in ETA ~3weeks
  - Parallel detector (epoxied)
Action items
- check 2x2 carriers
  - Fab more to have ~10 for science
- Strong backs
  - Can we check the strong back dimensions?
  - Compare to the actuals
  - Fab 10 more
- Braze cooling block for the small detector
- 1/4 full system fit check (late July)

September-20-2023

Only discussed LDACslides
- https://slac.sharepoint.com/sites/Reviews/LCLS/ldac_2023/Pages/default.aspx

September-06-2023

LDAC
- https://slac.sharepoint.com/sites/Reviews/LCLS/ldac_2023/Pages/default.aspx
ASIC testing
- Litho work
  - V4 are our for adding bumps
  - Current carriers have ASICs only and are at Amtech now
- What needs
  - Complete minimum test
    - Noise
    - Programing matrix
    - global R/W
    - gain measurement (needs sensor)
      - Lithography is done
      - 3 weeks minimum
- Out for wirebonding today 8/30
- Tungsten foil
  - Material has been procured
  - Laser cut can be be slow process 2 weeks to 1 month
  - Plasma coted pm campus
  - We will start one order now to make sure it does not cause impact on schedule. May need to be redone if fit check fails.
- Carrier - Version 2 (-C02) for the 2x2 and -C00 for the 4x1
  - give non working carrier to CK, put new ASIC
- Flip chip bonding - 3 to 4 months turn around
- Testing to start in August
  - ~~2 weeks test to validate ADC, bugs fixed and pixel configurates~~
  - Side entrance mechanics.
    - No news this week (other priorities)
    - Needs to modify cooling pipe
    - Estimate to go out for fab this week
    - 5 cooling blocks
    - 10-20 strong backs (includes other ASICs that need prototype testing)
  - Expected beam time by Sept 14-15, 6 pm (use V2 ASIC for this beamtime)
  - Metrology test with bleacher (Marco/Chris to meet)
    - Crescent, with frame and bleacher
    - ETA
Safety
- Meeting with Conny, Kaz, Marco and Chris Koeber
  - Marco sent info to start talks with safety personal (Hovannes and Marc Weibel)
  - We need to talk with Marc
- Chiller locations
  - ASC lab (Conny's lab) - temporary (installed first)
  - B084 - Clean room - Permanent
  - Beamline - 2 chiller permanent (1 now and one from ASC)
  - Shipper is working on getting them shipped but they did not departure from Poland yet.
- For the 2.5KW (cooling) the input power does not scale linearly

2M pixel - TXI detector
- Issues
  - back lash on one crescent - system has been retrofitted and problem solved
  - 1/4 pipes bending is not working
    - Next step make a final bending (this week)
  - Brazing company should receive parts next week
    - Copper bending
    - - Fabricating 1 of each flavor now for testing
    - Needs the brazing
  - Assembly the two modules together
    - Manual torch brazing, done at SLAC
- Analog board
  - Once tests are completed, C01 will be submitted to Fab
- Digital board
- FW
  - Timing receiver works (RxLock flag not going high)
  - Julian/Dawood will start work on the FW in August
    - ADC (fast already working, now fw dev is on the slow ADC)
    - Serial numbers
    - and data descrambling
- Motion system
  - Check with Andy for controls system integration
- Mechanical status
  - New design for cold plates because bending did not work as planned
    - expected 4 weeks to have a assembled system
  - Progress on Motion system assembly
  - We need a full system fit check, planed for ~~late July~~-> ~~Mid August →~~ Mid September
  - Marco needs a measurement of actual power consumption
  - Furnace at SLAC B44 is down
    - Bodycote vendor can be used for the brazing
  - CO2 system
    - In ASC
  - Mark Freitag is working on making a power cable. We will run it at 208V @ 60Hz and expect it to perform close to the specs (50Hz)
  - 2 units are stored at B

Small side entrance detector
- Jena's email
- Changing de diameter of the cooling pipe to 1/8".
  - Modify desing
  - Fab
  - Brazing
  - Encloser
  - Assemly
  - ETA ~3weeks
Action items
- Braze cooling block for the small detector
- 1/4 full system fit check (late July)

August-30-2023

LDAC
- https://slac.sharepoint.com/sites/Reviews/LCLS/ldac_2023/Pages/default.aspx
ASIC testing
- What needs
  - Complete minimum test
    - Noise
    - Programing matrix
    - global R/W
    - gain measurement (needs sensor)
      - Litography is still on going
      - 3 weeks minimum
- Out for wirebonding today 8/30
- Tungsten foil
  - Material has been procured
  - Laser cut can be be slow process 2 weeks to 1 month
  - Plasma coted pm campus
  - We will start one order now to make sure it does not cause impact on schedule. May need to be redone if fit check fails.
- Carrier - Version 2 (-C02) for the 2x2 and -C00 for the 4x1
  - give non working carrier to CK, put new ASIC
- Flip chip bonding - 3 to 4 months turn around
- Testing to start in August
  - ~~2 weeks test to validate ADC, bugs fixed and pixel configurates~~
  - Side entrance mechanics.
    - Needs to modify cooling pipe
    - Estimate to go out for fab this week
    - 5 cooling blocks
    - 10-20 strong backs (includes other ASICs that need prototype testing)
  - Expected beam time by Sept 14-15, 6 pm
  - Metrology test with bleacher (Marco/Chris to meet)
Safety
- Meeting with Conny, Kaz, Marco and Chris Koeber
  - Marco sent info to start talks with safety personal (Hovannes and Marc Weibel)
  - We need to talk with Marc
- Chiller locations
  - ASC lab (Conny's lab) - temporary (installed first)
  - B084 - Clean room - Permanent
  - Beamline - 2 chiller permanent (1 now and one from ASC)
  - Shipper is working on getting them shipped but they did not departure from Poland yet.
- For the 2.5KW (cooling) the input power does not scale linearly

2M pixel - TXI detector
- Issues
  - back lash on one crescent - system has been retrofitted and problem solved
  - 1/4 pipes bending is not working
    - Next step make a final bending (this week)
  - Brazing company should receive parts next week
    - Copper bending
    - - Fabricating 1 of each flavor now for testing
    - Needs the brazing
  - Assembly the two modules together
    - Manual torch brazing, done at SLAC
- Analog board
  - Once tests are completed, C01 will be submitted to Fab
- Digital board
- FW
  - Timing receiver works
  - Julian/Dawood will start work on the FW in August
    - ADC (fast and slow)
    - Serial numbers
    - and data descrambling
- Motion system
  - Check with Andy for controls system integration
- Mechanical status
  - New design for cold plates because bending did not work as planned
    - expected 4 weeks to have a assembled system
  - Progress on Motion system assembly
  - We need a full system fit check, planed for ~~late July~~-> ~~Mid August →~~ Mid September
  - Marco needs a measurement of actual power consumption
  - Furnace at SLAC B44 is down
    - Bodycote vendor can be used for the brazing
  - CO2 system
    - In ASC
  - Mark Freitag is working on making a power cable. We will run it at 208V @ 60Hz and expect it to perform close to the specs (50Hz)
  - 2 units are stored at B

Small side entrance detector
- Jena's email
- Changing de diameter of the cooling pipe to 1/8".
  - Modify desing
  - Fab
  - Brazing
  - Encloser
  - Assemly
  - ETA ~3weeks
Action items
- Braze cooling block for the small detector
- 1/4 full system fit check (late July)

July-19-2023

ASIC testing
- Out on dicing/coring. Expected to be available for testing by 8/7
- Tungsten foil
  - Material has been procured
  - Laser cut can be be slow process 2 weeks to 1 month
  - Plasma coted pm campus
  - We will start one order now to make sure it does not cause impact on schedule. May need to be redone if fit check fails.
- Carrier - Version 2 (-C02) for the 2x2 and -C00 for the 4x1
  - all copper blocks are with Leo in Nitrogen locker
  - all Al blocks are here (2x2)
  - Need to fab more 2x2 carrier boards
- Flip chip bonding - 3 to 4 months turn around
- Testing to start in August
  - 2 weeks test to validate ADC, bugs fixed and pixel configurates
  - Make 10 strong back for the 2x2 (small detector)
  - side entrance mechanics. Can we start now? Marco will work on it.
    - 5 cooling blocks
    - 10-20 strong backs (includes other ASICs that need prototype testing)
  - Expected beam time by ?? (check with Conny)
Safety
- Meeting with Conny, Kaz, Marco and Chris Koeber
  - Marco sent info to start talks with safety personal (Hovannes and Marc Weibel)
  - We need to talk with Marc
- Chiller locations
  - ASC lab (Conny's lab) - temporary (installed first)
  - B084 - Clean room - Permanent
  - Beamline - 2 chiller permanent (1 now and one from ASC)
  - Shipper is working on getting them shipped but they did not departure from Poland yet.
- For the 2.5KW (cooling) the input power does not scale linearly

2M pixel - TXI detector
- Brazing is happening
  - Boards cooling blocks
    - Copper bending
    - - Fabricating 1 of each flavor now for testing
    - Needs the brazing
  - Assembly the two modules together
    - Manual torch brazing, done at SLAC
- Carrier board fabrication status
  - Need to fab 5 more
- Flex board
  - In fabrication
- Analog board
  - Once tests are completed, C01 will be submitted to Fab
- Digital board
- FW
  - Timing receiver works
  - Julian will start work on the FW in August
- Motion system
  - Check with Andy for controls system integration (check on Friday)
- Mechanical status
  - New design for cold plates because bending did not work as planned
    - expected 4 weeks to have a assembled system
  - Progress on Motion system assembly
  - We need a full system fit check, planed for ~~late July~~-> Mid August
  - Marco needs a measurement of actual power consumption
  - Furnace at SLAC B44 is down
    - Bodycote vendor can be used for the brazing
  - CO2 system - routing beyond the chamber is moving forward.
  - Small chillers are in Poland ready to ship
  - Expected to get release from Marco next week and after that 2weeks (maybe longer) to get to SLAC.
    - Marco approved shipping released

Small side entrance detector
- Jena's email
- We have on cold plate and planning on brazing that with the ePixHRM 0 degree
- Check with Leo and Bob on ETA
- Drawings released
  - Flex checked
    - layout queue
  - Cold plate
- Flex board
  - Layout kick off meeting is today
Action items
- Braze cooling block for the small detector
- 1/4 full system fit check (late July)

July-05-2023

ASIC testing
- Tungsten foil
  - Material has been procured
  - Laser cut can be be slow process 2 weeks to 1 month
  - Plasma coted pm campus
  - We will start one order now to make sure it does not cause impact on schedule. May need to be redone if fit check fails.
- Carrier - C02 for the 2x2 and C00 for the 4x1
  - all copper blocks are with Leo in Nitrogen locker
- Flip chip bonding - 3 to 4 months turn around
- Testing to start end of July
  - 2 weeks test to validate ADC, bugs fixed and pixel configurates
  - Make 10 strong back for the 2x2 (small detector)
  - side entrance mechanics. Can we start now? Marco will work on it.
    - 5 cooling blocks
    - 10-20 strong backs (includes other ASICs that need prototype testing)
Safety
- Meeting with Conny, Kaz, Marco and Chris Koeber
  - Marco will send info to start talks with safety personal (Hovannes and Marc Weibel)
- Chiller locations
  - ASC lab (Conny's lab) - temporary (installed first)
  - B084 - Clean room - Permanent
  - Beamline - 2 chiller permanent (1 now and one from ASC)
- For the 2.5KW (cooling) the input power does not scale linearly

2M pixel - TXI detector
- Brazing is happening
  - Boards cooling blocks
    - Needs to to the copper bending
      - Pipe bending is having a hard time to complete the cold plate path
      - Priority set on this one by Marco
    - Needs the brazing
  - Assembly the two modules together
    - Manual torch brazing, done at SLAC
- Carrier board fabrication status
  - Machine shop is modifying the copper
    - Make 5 more copper blocks
    - Already done.
- Flex board
  - In fabrication
- Analog board
  - Once tests are completed, C01 will be submitted to Fab
- Digital board
- FW
  - Timing receiver works
- Motion system
  - Check with Andy for controls system integration (check on Friday)
- Mechanical status
  - New design for cold plates because bending did not work as planned
    - expected 4 weeks to have a assembled system
  - Progress on Motion system assembly
  - We need a full system fit check, planed for ~~late July~~-> Mid August
  - Marco needs a measurement of actual power consumption
  - Furnace at SLAC B44 is down
    - Bodycote vendor can be used for the brazing
  - CO2 system - routing beyond the chamber is moving forward.
  - Small chillers are in Poland ready to ship
  - Expected to get release from Marco next week and after that 2weeks (maybe longer) to get to SLAC.
    - Marco approved shipping released

Small side entrance detector
- Jena's email
- We have on cold plate and planning on brazing that with the ePixHRM 0 degree
- Drawings released
  - Flex checked
    - layout queue
  - Cold plate
- Flex board
  - Layout kick off meeting is today
Action items
- Braze cooling block for the small detector
- 1/4 full system fit check (late July)

July-05-2023

ASIC testing
- Delivered today.
- Dicing, wirebonding (2 weeks)
- Testing (2 weeks)
- In parallel prototype sensor bonding
- After testing the science grade detectors will be release for bonding
- Tungsten foil
  - Material has been procured
  - Laser cut can be be slow process 2 weeks to 1 month
  - Plasma coted pm campus
  - We will start one order now to make sure it does not cause impact on schedule. May need to be redone if fit check fails.
- Carrier - C02 for the 2x2 and C00 for the 4x1
  - all copper blocks are with Leo in Nitrogen locker
- Flip chip bonding - 3 to 4 months turn around
- Testing to start end of July
  - 2 weeks test to validate ADC, bugs fixed and pixel configurates
  - Make 10 strong back for the 2x2 (small detector)
  - side entrance mechanics. Can we start now? Marco will work on it.
    - 5 cooling blocks
    - 10-20 strong backs (includes other ASICs that need prototype testing)
Safety
- Meeting with Conny, Kaz, Marco and Chris Koeber
  - Marco will send info to start talks with safety personal (Hovannes and Marc Weibel)
- Chiller locations
  - ASC lab (Conny's lab) - temporary (installed first)
  - B084 - Clean room - Permanent
  - Beamline - 2 chiller permanent (1 now and one from ASC)
- For the 2.5KW (cooling) the input power does not scale linearly

2M pixel - TXI detector
- Brazing is happening
  - Boards cooling blocks
    - Needs to to the copper bending
      - Pipe bending is having a hard time to complete the cold plate path
      - Priority set on this one by Marco
    - Needs the brazing
  - Assembly the two modules together
    - Manual torch brazing, done at SLAC
- Carrier board fabrication status
  - Machine shop is modifying the copper
    - Make 5 more copper blocks
    - Already done.
- Flex board
  - In fabrication
- Analog board
  - Once tests are completed, C01 will be submitted to Fab
- Digital board
- FW
  - ASIC streams now lock. Next steps
    - save data over
    - test viewer
    - charge injection
    - noise
    - ADC linearity
- Mechanical status
  - We need a full system fit check, planed for late July.
  - Marco needs a measurement of actual power consumption
  - Furnace at SLAC B44 is down
    - Bodycote vendor can be used for the brazing
  - CO2 system - routing beyond the chamber is moving forward.
  - Small chillers are in Poland ready to ship
  - Expected to get release from Marco next week and after that 2weeks to get to SLAC.

Small side entrance detector
- Jena's email
- We have on cold plate and planning on brazing that with the ePixHRM 0 degree
- Drawings released
  - Flex checked
    - layout queue
  - Cold plate
- Flex board
  - Layout kick off meeting is today
Action items
- Braze cooling block for the small detector
- 1/4 full system fit check (late July)

June-28-2023

ASIC testing
- Tungsten foil
  - Material has been procured
  - Laser cut can be be slow process 2 weeks to 1 month
  - Plasma coted pm campus
  - We will start one order now to make sure it does not cause impact on schedule. May need to be redone if fit check fails.
- Carrier - C02 for the 2x2 and C00 for the 4x1
- Flip chip bonding - 3 to 4 months turn around
- Testing to start end of July
  - 2 weeks test to validate ADC, bugs fixed and pixel configurates
  - Make 10 strong back for the 2x2 (small detector)
  - side entrance mechanics. Can we start now? Marco will work on it.
    - 5 cooling blocks
    - 10-20 strong backs (includes other ASICs that need prototype testing)
Cooling simulation
- Did we get the results from the Al strong back use?
Safety
- Meeting with Conny, Kaz, Marco and Chris Koeber
  - walk though was done in the lab
  - Found a space to install the chiller
  - Chillers requires
    - 230Vac
    - Seismic
    - High pressure
    - ODH
  - Electrical power still an open item (230V at ~2-3KVA)
  - Marco will send info to start talks with safety personal (Hovannes and Marc Weibel)
- Chiller locations
  - ASC lab (Conny's lab) - temporary (installed first)
  - B084 - Clean room - Permanent
  - Beamline - 2 chiller permanent (1 now and one from ASC)
- For the 2.5KW (cooling) the input power does not scale linearly

2M pixel - TXI detector
- Brazing is happening
  - Boards cooling blocks
    - Needs to to the copper bending
      - Pipe bending is having a hard time to complete the cold plate path
      - Priority set on this one by Marco
    - Needs the brazing
  - Assembly the two modules together
    - Manual torch brazing, done at SLAC
- Carrier board fabrication status
  - Machine shop is modifying the copper
    - Make 5 more copper blocks
    - Needed by beginning of July
  - RTV is not attaching to copper
    - New process is in place
    - It will be used on the upcoming 5 modules
- Flex board
  - Got quote and fabrication was released 6/20
- Analog board
  - Once tests are completed, C01 will be submitted to Fab
- Digital board
- FW
  - ASIC streams now lock. Next steps
    - save data over
    - test viewer
    - charge injection
    - noise
    - ADC linearity
- Mechanical status
  - We need a full system fit check, planed for late July.
  - Marco needs a measurement of actual power consumption
  - Furnace at SLAC B44 is down
    - Bodycote vendor can be used for the brazing
  - CO2 system - routing beyond the chamber is moving forward.
    - Marco met with Don S. and some requests have been made
      - Marco to give them feedback
    - Chillers now scheduled to June, still the same.
    - Chiller distance to the detector 30-40'
      - Needs vacuum insulated line to reduce heat losses
      - Marco simulating that scenario and we will get that request to the beam line.

Small side entrance detector
- Jena's email
- We have on cold plate and planning on brazing that with the ePixHRM 0 degree
- Drawings released
  - Flex checked
    - layout queue
  - Cold plate
- Flex board
  - Layout kick off meeting is today
Action items
- Get flex though layout
- Braze cooling block for the small detector
- 1/4 full system fit check (late July

June-21-2023

ASIC testing
- Carrier - C02 for the 2x2 and C00 for the 4x1
- Flip chip bonding - 3 to 4 months turn around
- Testing to start end of July
  - 2 weeks test to validate ADC, bugs fixed and pixel configurates
  - Make 10 strong back for the 2x2 (small detector)
  - side entrance mechanics. Can we start now? Marco will work on it.
    - 5 cooling blocks
    - 10-20 strong backs (includes other ASICs that need prototype testing)
Cooling simulation
- Did we get the results from the Al strong back use?
Safety
- Meeting with Conny, Kaz, Marco and Chris Koeber
  - walk though was done in the lab
  - Found a space to install the chiller
  - Chillers requires
    - 230Vac
    - Seismic
    - High pressure
    - ODH
  - Electrical power still an open item (230V at ~2-3KVA)
  - Marco will send info to start talks with safety personal (Hovannes and Marc Weibel)
- Chiller locations
  - ASC lab (Conny's lab) - temporary (installed first)
  - B084 - Clean room - Permanent
  - Beamline - 2 chiller permanent (1 now and one from ASC)
- For the 2.5KW (cooling) the input power does not scale linearly

2M pixel - TXI detector
- Brazing is happening
  - Boards cooling blocks
    - Needs to to the copper bending
      - Pipe bending is having a hard time to complete the cold plate path
      - Priority set on this one by Marco
    - Needs the brazing
  - Assembly the two modules together
    - Manual torch brazing, done at SLAC
- Carrier board fabrication status
  - Machine shop is modifying the copper
    - Make 5 more copper blocks
    - Needed by beginning of July
  - RTV is not attaching to copper
    - New process is in place
    - It will be used on the upcoming 5 modules
- Flex board
  - Got quote and fabrication was released 6/20
- Analog board
  - Once tests are completed, C01 will be submitted to Fab
- Digital board
- FW
  - ASIC streams now lock. Next steps
    - save data over
    - test viewer
    - charge injection
    - noise
    - ADC linearity
- Mechanical status
  - We need a full system fit check, planed for late July.
  - Marco needs a measurement of actual power consumption
  - Furnace at SLAC B44 is down
    - Bodycote vendor can be used for the brazing
  - CO2 system - routing beyond the chamber is moving forward.
    - Marco met with Don S. and some requests have been made
      - Marco to give them feedback
    - Chillers now scheduled to June, still the same.
    - Chiller distance to the detector 30-40'
      - Needs vacuum insulated line to reduce heat losses
      - Marco simulating that scenario and we will get that request to the beam line.

Small side entrance detector
- Jena's email
- We have on cold plate and planning on brazing that with the ePixHRM 0 degree
- Drawings released
  - Flex checked
    - layout queue
  - Cold plate
- Flex board
  - Layout kick off meeting is today
Action items
- Get flex though layout
- Braze cooling block for the small detector
- 1/4 full system fit check (late July

June-14-2023

ASIC testing
- Carrier - C02 for the 2x2 and C00 for the 4x1
- Flip chip bonding - 3 to 4 months turn around
- Testing to start end of July
Cooling simulation
- Did we get the results from the Al strong back use?
Safety
- Chiller locations
  - ASC lab (Conny's lab) - temporary (installed first)
  - B084 - Clean room - Permanent
  - Beamline - 2 chiller permanent (1 now and one from ASC)
- Chillers requires
  - 230Vac
  - Seismic
  - High pressure
  - ODH
- Meeting with Conny 6/16
- For the 2.5KW the input power does not scale linearly
- Marco and Dionisio met with Hovaness yesterday
  - Need initial documents to be provided by Marco
  - Meet with CK to know how to put this CO2 chiller in the clean room

2M
- Brazing is happening
  - bleacher has been brazed
  - Visual inspection passed - no brazing leaks into the holes
  - Fit check passed
  - Leak test passed - no leaks
  - Hydrostatic test - next on the schedule
  - Inserts need to be added
  - Boards cooling blocks
    - Needs to to the copper bending
    - Needs the brazing
  - Assembly the two modules together
    - Manual torch brazing, done at SLAC
- Carrier board fabrication status
  - Machine shop is modifying the copper
    - Make 5 more copper blocks
    - Needed by beginning of July
  - RTV is not attaching to copper
    - New process is in place
    - It will be used on the upcoming 5 modules
- Flex board
  - Waiting for quotes
- Analog board
  - Once tests are completed, C01 will be submitted to Fab
- Digital board
- FW
  - ASIC streams now lock. Next steps
    - save data over
    - test viewer
    - charge injection
    - noise
    - ADC linearity
- Mechanical status
  - Marco and Bob are working on fit check and small modification needed.
  - Marco needs a measurement of actual power consumption
  - Furnace at SLAC B44 is down
    - Bodycote vendor can be used for the brazing
    - - Ready for brazing
  - Cold plates have arrived
  - CO2 system - routing beyond the chamber is moving forward.
    - Chillers now scheduled to June, still the same.
    - Chiller distance to the detector 30-40'
      - Needs vacuum insulated line to reduce heat losses
      - Marco simulating that scenario and we will get that request to the beam line.

Small side entrance detector
- Digital board high speed links, now meet the specs 10Gbps
  - Tung is getting quotes
- Jena's email
- Drawings released
  - Flex checked
  - Cold plate
- We went out for quotes, waiting for return.
- Explores Bodycote/Slac venue
Flex board
- Need to send out for layout to make new cable, same schematics, just longer.
Action items
- Single board fabrication
  - Analog and Digital board ready to Fab
    - 25k to fab boards
- 1/4 full system fit check

June-07-2023

ASIC testing
- Carrier - C02 for the 2x2 and C00 for the 4x1
- Flip chip bonding - 3 to 4 months turn around
- Testing to start end of July
Safety
- Chiller locations
  - ASC lab (Conny's lab) - temporary (installed first)
  - B084 - Clean room - Permanent
  - Beamline - 2 chiller permanent (1 now and one from ASC)
- Chillers requires
  - 230Vac
  - Seismic
  - High pressure
  - ODH
- Meeting with Conny
- Marco and Dionisio met with Hovaness yesterday
  - Need initial documents to be provided by Marco
  - Meet with CK to know how to put this CO2 chiller in the clean room

2M
- Brazing is happening
  - We expect to have first articles back anytime now
- Carrier board fabrication status
  - Leo Modified the copper
    - Make 5 more copper blocks
  - RTV is not attaching to copper
    - Next steps it to try Master Bond epoxy
    - Should we try some etching?
- Flex board
  - Schematic review done
  - C01 should be thin to make it flexible
  - On layout queue
- Analog board
  - Once tests are completed, C01 will be submitted to Fab
- Digital board
- FW
  - ASIC streams now lock. Next steps
    - save data over
    - test viewer
    - charge injection
    - noise
    - ADC linearity
- Testing setup

- Mechanical status
  - Marco and Bob are working on fit check and small modification needed.
  - Marco needs a measurement of actual power consumption
  - Furnace at SLAC B44 is down
    - Bodycote vendor can be used for the brazing
    - - Ready for brazing
  - Cold plates have arrived
  - CO2 system - routing beyond the chamber is moving forward.
    - Chillers now scheduled to June, still the same.
    - Chiller distance to the detector 30-40'
      - Needs vacuum insulated line to reduce heat losses
      - Marco simulating that scenario and we will get that request to the beam line.
Small side entrance detector
- Digital board high speed links, now meet the specs 10Gbps
  - Tung is getting quotes
- Jena's email
- Drawings released
  - Flex checked
  - Cold plate
- We went out for quotes, waiting for return.
- Explores Bodycote/Slac venue
Flex board
- Need to send out for layout to make new cable, same schematics, just longer.
Action items
- Single board fabrication
  - Analog and Digital board ready to Fab
    - 25k to fab boards

May-31-2023

Brazing shop is closed at SLAC, causing delays. Marco to check on it. How to escalate that?

May-17-2023

ASIC testing
- V4 Submitted
Safety
- Marco and Dionisio met with Hovaness yesterday
  - Need initial documents to be provided by Marco
  - Meet with CK to know how to put this CO2 chiller in the clean room

2M
- Carrier board fabrication status
  - Leo Modified the copper
  - RTV is not attaching to copper
    - Next steps it to try Master Bond epoxy
    - Should we try some etching?
- Flex board
  - Schematic review done
  - C01 should be thin to make it flexible
  - On layout queue
- Analog board
  - Once tests are completed, C01 will be submitted to Fab
- Digital board
- FW
  - ASIC streams now lock. Next steps
    - save data over
    - test viewer
    - charge injection
    - noise
    - ADC linearity
- Testing setup

- Mechanical status
  - Marco and Bob are working on fit check and small modification needed.
  - Marco needs a measurement of actual power consumption
  - Furnace at SLAC B44 is down
    - Bodycote vendor can be used for the brazing
    - - Ready for brazing
  - Cold plates have arrived
  - CO2 system - routing beyond the chamber is moving forward.
    - Chillers now scheduled to June, still the same.
    - Chiller distance to the detector 30-40'
      - Needs vacuum insulated line to reduce heat losses
      - Marco simulating that scenario and we will get that request to the beam line.
Small side entrance detector
- Digital board high speed links, now meet the specs 10Gbps
  - Tung is getting quotes
- Jena's email
- Drawings released
  - Flex checked
  - Cold plate
- We went out for quotes, waiting for return.
- Explores Bodycote/Slac venue
Flex board
- Need to send out for layout to make new cable, same schematics, just longer.
Action items
- Single board fabrication
  - Analog and Digital board ready to Fab
    - 25k to fab boards

May-03-2023

ASIC testing
- V4 Submitted
Safety
- Marco and Dionisio met with Hovaness yesterday
  - Need initial documents to be provided by Marco
  - Meet with CK to know how to put this CO2 chiller in the clean room

2M
- Carrier board fabrication status
  - Leo Modified the copper
  - RTV is not attaching to copper
    - Next steps it to try Master Bond epoxy
    - Should we try some etching?
- Flex board
  - Schematic review done
  - C01 should be thin to make it flexible
- Analog board
  - Once tests are completed, C01 will be submitted to Fab
- Digital board
- FW
  - ASIC streams now lock. Next steps
    - save data over
    - test viewer
    - charge injection
    - noise
    - ADC linearity
- Testing setup

- Mechanical status
  - Marco and Bob are working on fit check and small modification needed.
  - Marco needs a measurement of actual power consumption
  - Furnace at SLAC B44 is down
    - Bodycote vendor can be used for the brazing
    - - Ready for brazing
  - Cold plates have been ordered and should arrive soon
  - CO2 system - routing beyond the chamber is moving forward.
    - Chillers now scheduled to June, still the same.
    - Chiller distance to the detector 30-40'
      - Needs vacuum insulated line to reduce heat losses
      - Marco simulating that scenario and we will get that request to the beam line.
Small side entrance detector
- Digital board high speed links, now meet the specs 10Gbps
  - Tung is getting quotes
- Jena's email
- Drawings released
  - Flex checked
  - Cold plate
- We will go out for quotes
Flex board
- Need to send out for layout to make new cable, same schematics, just longer.
Action items
- Single board fabrication
  - Analog and Digital board ready to Fab
    - 25k to fab boards

April-26-2023

ASIC testing
- V3 prototype carrier needs new strong back. (2x2).
- Status on V4
  - Submitted
Safety
- Marco and Dionisio met with Hovaness yesterday
  - Need initial documents to be provided by Marco
  - Meet with CK to know how to put this CO2 chiller in the clean room

2M
- Carrier board fabrication status
  - Leo Modified the copper
  - New module out for wirebond
- Flex board
  - Schematic review this afternoon
  - C01 should be thin to make it flexible
- Analog board
  - Once tests are completed, C01 will be submitted to Fab
- Digital board
- FW
  - ASIC streams now lock. Next steps
    - save data over
    - test viewer
    - charge injection
    - noise
    - ADC linearity
- Testing setup

- Mechanical status
  - Marco and Bob are working on fit check and small modification needed.
  - Marco needs a measurement of actual power consumption
    - - Ready for brazing
  - CO2 system - routing beyond the chamber is moving forward.
    - Chillers now scheduled to June, still the same.
    - Chiller distance to the detector 30-40'
      - Needs vacuum insulated line to reduce heat losses
      - Marco simulating that scenario and we will get that request to the beam line.
Small side entrance detector
- Digital board high speed links, not meeting specs for 10Gbps
  - Dan's found a solution, propagated to layout
- Jena's email
Action items
- Single board fabrication
  - Analog and Digital board ready to Fab
    - 25k to fab boards

April-19-2023

ASIC testing
- V3 prototype carrier needs new strong back. (2x2). These are assembled and ready to test. This is done. Temperature reduces by 10C (from 50C to 40C)
- Status on V4
  - Submitted
Safety
- Marco and Dionisio met with Hovaness yesterday
  - Need initial documents to be provided by Marco
  - Meet with CK to know how to put this CO2 chiller in the clean room

2M
- Carrier board fabrication status
  - Leo Modified the copper
  - New module to be built and wirebonded
- Flex board
  - Found an schematic mistake, which was removed for the existing cable. It will be fixed for the final production
  - Mistake on one row needs schematic changes
  - C01 should be thin to make it flexible
- Analog board
  - Once tests are completed, C01 will be submitted to Fab
- Digital board
- FW
  - ASIC streams now lock. Next steps
    - save data over
    - test viewer
    - charge injection
    - noise
    - ADC linearity
- Testing setup

- Mechanical status
  - Marco and Bob are working on fit check and small modification needed.
    - - Ready for brazing
  - CO2 system - routing beyond the chamber is moving forward.
    - Chillers now scheduled to June, still the same.
    - Chiller distance to the detector 30-40'
      - Needs vacuum insulated line to reduce heat losses
      - Marco simulating that scenario and we will get that request to the beam line.
Small side entrance detector
- Digital board high speed links, not meeting specs for 10Gbps
  - Dan's found a solution, propagated to layout
- Jena's email
Action items
- Single board fabrication
  - Analog and Digital board ready to Fab
    - 25k to fab boards

April-12-2023

ASIC testing
- V3 prototype carrier needs new strong back. (2x2). These are assembled and ready to test. This is done. Temperature reduces by 10C (from 50C to 40C)
- Status on V4
  - Noise source found in simulation. Bojan/Lorenzo submit mid April.
- Reach out to Chris to get status update
Safety
- Marco and Dionisio met with Hovaness yesterday
  - Need initial documents to be provided by Marco
  - Meet with CK to know how to put this CO2 chiller in the clean room

2M
- Carrier board fabrication status
  - Wirebonding vendor refused to bid due to hight difference
  - Mat C. bonded locally
  - Bow on blank boards < 7mils
  - Thickness of the epoxy should be 10mils
  - Possible optimizations needed on the copper module
    - one test module will be done reducing 40mils
  - Check the stringer height
  - Reach out to Chris to get status update
- Flex board
  - Found an schematic mistake, which was removed for the existing cable. It will be fixed for the final production
  - Mistake on one row needs schematic changes
  - C01 should be thin to make it flexible
- Analog board
  - Once tests are completed, C01 will be submitted to Fab
- Digital board
- FW
  - ASIC streams now lock. Next steps
    - save data over
    - test viewer
    - charge injection
    - noise
    - ADC linearity
- Testing setup

- Mechanical status
  - Marco and Bob are working on fit check and small modification needed. Working on the bending.
  - Brazing is the next step, it will be done in our local shops.
    - Marco to meet with Andy (at the brazing show) to discuss procedures
      - The meeting resulted in some good ideas
      - Alloy could flow into the threaded holes, need a plan to prevent the clogging or how to clean it
        Plan was defined and will be tested
    - Bob will do the bending
      - Bob has one side of the pipe already done. Next week it should be completed
      - After it we will be able to go for the brazing
      - Final adjustments needed needed before brazing
    - Marco working on a support structure to mount the detector in the same orientation as the experimental chamber.
  - CO2 system - routing beyond the chamber is moving forward.
    - Chillers now scheduled to June, still the same.
    - Chiller distance to the detector 30-40'
      - Needs vacuum insulated line to reduce heat losses
      - Marco simulating that scenario and we will get that request to the beam line.
Small side entrance detector
- Digital board high speed links, not meeting specs for 10Gbps
  - Dan's found a solution, propagated to layout
- Jena's email
Action items
- Single board fabrication
  - Analog and Digital board ready to Fab
    - 25k to fab boards

April-05-2023

ASIC testing
- V3 prototype carrier needs new strong back. (2x2). These are assembled and ready to test. This is done. Temperature reduces by 10C (from 50C to 40C)
- Noise source found in simulation. Bojan/Lorenzo submit mid April.
- Reach out to Chris to get status update
Safety
- Marco and Dionisio met with Hovaness yesterday
  - Need initial documents to be provided by Marco
  - Meet with CK to know how to put this CO2 chiller in the clean room

2M
- Carrier board fabrication status
  - Wirebonding vendor refused to bid due to hight difference
  - Mat C. will try to wire bond locally
  - Possible optimizations needed on the copper module
  - Check the stringer height
  - Reach out to Chris to get status update
- Analog board
- Digital board
- FW
  - Ongoing. List of all modules needed.
- Testing setup
- Found an schematic mistake, which was removed for the existing cable. It will be fixed for the final production

- Mechanical status
  - Marco and Bob are working on fit check and small modification needed. Working on the bending.
  - Brazing is the next step, it will be done in our local shops.
    - Marco to meet with Andy (at the brazing show) to discuss procedures
      - The meeting resulted in some good ideas
      - Alloy could flow into the threaded holes, need a plan to prevent the clogging or how to clean it
        Plan was defined and will be tested
    - Bob will do the bending
      - Bob has one side of the pipe already done. Next week it should be completed
      - After it we will be able to go for the brazing
      - Final adjustments needed needed before brazing
    - Marco working on a support structure to mount the detector in the same orientation as the experimental chamber.
  - CO2 system - routing beiond the chamber is moving forward.
    - Chillers now scheduled to June.
    - Chiller distance to the detector 30-40'
      - Needs vacuum insulated line to reduce heat losses
      - Marco simulating that scenario and we will get that request to the beam line.
Small side entrance detector
- Digital board high speed links, not meeting specs for 10Gbps
  - Dan's found a solution, propagated to layout
- Jena's email
Action items
- Single board fabrication
  - Analog and Digital board ready to Fab
    - 25k to fab boards

Mar-29-2023

ASIC testing
- V3 prototype carrier needs new strong back. (2x2). These are assembled and ready to test. This is done. Temperature reduces by 10C (from 50C to 40C)
- Noise source found in simulation. Bojan/Lorenzo submit mid April.
- Reach out to Chris to get status update
Safety
- Marco and Dionisio met with Hovaness yesterday
  - Need initial documents to be provided by Marco
  - Meet with CK to know how to put this CO2 chiller in the clean room

2M
- Carrier board fabrication status
  - Wirebonding vendor refused to bid due to hight difference
  - Mat C. will try to wire bond locally
  - Possible optimizations needed on the copper module
  - Check the stringer height
  - Reach out to Chris to get status update
- Analog board
- Digital board
- FW
  - Ongoing. List of all modules needed.
- Digital board high speed links, not meeting specs for 10Gbps
  - Dan's found a solution, propagated to layout
- Mechanical status
  - Marco and Bob are working on fit check and small modification needed. Working on the bending.
  - Brazing is the next step, it will be done in our local shops.
    - Marco to meet with Andy (at the brazing show) to discuss procedures
      - The meeting resulted in some good ideas
      - Alloy could flow into the threaded holes, need a plan to prevent the clogging or how to clean it
        Plan was defined and will be tested
    - Bob will do the bending
      - Bob has one side of the pipe already done. Next week it should be completed
      - After it we will be able to go for the brazing
      - Final adjustments needed needed before brazing
    - Marco working on a support structure to mount the detector in the same orientation as the experimental chamber.
  - CO2 system - routing beiond the chamber is moving forward.
    - Chillers now scheduled to June.
    - Chiller distance to the detector 30-40'
      - Needs vacuum insulated line to reduce heat losses
      - Marco simulating that scenario and we will get that request to the beam line.

Action items
- Single board fabrication
  - Analog and Digital board ready to Fab
    - 25k to fab boards

Mar-22-2023

ASIC testing
- V3 prototype carrier needs new strong back. (2x2). These are assembled and ready to test. This is done. Temperature reduces by 10C (from 50C to 40C)
- Noise source found in simulation. Bojan/Lorenzo fixing it and getting ready to submit
- Marco solved the L-braket with a 3D printed
Safety
- Marco and Dionisio met with Hovaness yesterday
  - Need initial documents to be provided by Marco
  - Meet with CK to know how to put this CO2 chiller in the clean room

2M
- Carrier board fabrication status
  - Wirebonding vendor refused to bid due to hight difference
  - Mat C. will try to wire bond locally
  - Possible optimizations needed on the copper module
  - Check the stringer height
- Analog board
- Digital board
- FW
  - Ongoing. List of all modules needed.
- Digital board high speed links, not meeting specs for 10Gbps
  - Dan's found a solution, propagated to layout
- Mechanical status
  - Marco and Bob are working on fit check and small modification needed. Advances on the stepper motor tolerances
  - Brazing is the next step, it will be done in our local shops.
    - Marco to meet with Andy (at the brazing show) to discuss procedures
      - The meeting resulted in some good ideas
      - Alloy could flow into the threaded holes, need a plan to prevent the clogging or how to clean it
        Plan was defined and will be tested
    - Bob will do the bending
      - Bob has one side of the pipe already done. Next week it should be completed
      - After it we will be able to go for the brazing
      - Final adjustments needed needed before brazing
  - CO2 system - routing beiond the chamber is moving forward.
    - Chillers now scheduled to June.

Action items
- Single board fabrication
  - Analog and Digital board ready to Fab
    - 25k to fab boards

Mar-01-2023

ASIC testing
- V3 prototype carrier needs new strong back. (2x2). These are assembled and ready to test. This is done. Temperature reduces by 10C (from 50C to 40C)
- Next, we need to get the noise performance checked - on going
- We need to fab an L-bracket to hold the
  - This did not started. We need to have it soon since carrier arrive end of this week.
Safety
- Marco and Dionisio met with Hovaness yesterday
  - Need initial documents to be provided by Marco
  - Meet with CK to know how to put this CO2 chiller in the clean room

2M
- Carrier board fabrication status
  - Expedite wire bonding (4x1)
  - some ASIC are chipped
    - We need 3 now and 70 about 2months or later
    - 4 to 6 weeks, Marco will find if there are other faster options
  - Carrier bonding. Black solder mask comes off. Why.
- Analog board
- Digital board
  - testing FPGA to PC dataflow
- FW
  - Ongoing. List of all modules needed.
- Digital board high speed links, not meeting specs for 10Gbps
  - Dan's found a solution, propagated to layout
- Mechanical status
  - Marco and Bob are working on fit check and small modification needed. Advances on the stepper motor tolerances
  - Motion system tested by Marco with a +/-5um precision
    - Position sensor is missing for the final use
    - Encoder needs to be readout I'll ask Dawood to look at this
  - Brazing is the next step, it will be done in our local shops.
    - Marco to meet with Andy (at the brazing show) to discuss procedures
      - The meeting resulted in some good ideas
      - Alloy could flow into the threaded holes, need a plan to prevent the clogging or how to clean it
        Plan was defined and will be tested
    - Bob will do the bending
      - Bob has one side of the pipe already done. Next week it should be completed
      - After it we will be able to go for the brazing
  - Cold plates need to be updated after the fit check lessons learning
    - Marco still needs to work with Scott
    - Started but needs a conversation with Scott
  - CO2 system - routing beiond the chamber is moving forward

Action items
- Single board fabrication
  - Analog and Digital board ready to Fab
    - 25k to fab boards

Feb-15-2023

ASIC testing
- V3 prototype carrier needs new strong back. (2x2). These are assembled and ready to test. This is done. Temperature reduces by 10C (from 50C to 40C)
- Next, we need to get the noise performance checked - on going
- We need to fab an l-bracket to hold the
Safety
- Marco and Dionisio met with Hovaness yesterday
  - Need initial documents to be provided by Marco
  - Meet with CK to know how to put this CO2 chiller in the clean room

2M
- Carrier board fabrication status
  - Expedite wire bonding (4x1)
  - some ASIC are chipped
    - We need 3 now and 70 about 2months or later
    - 4 to 6 weeks, Marco will find if there are other faster options
  - Carrier bonding. Black solder mask comes off. Why.
- Analog board
- Digital board
  - testing FPGA to PC dataflow
- FW
  - Ongoing. List of all modules needed.
- Mechanical status
  - Marco and Bob are working on fit check and small modification needed. Advances on the stepper motor tolerances
  - Brazing is the next step, it will be done in our local shops.
    - Marco to meet with Andy (at the brazing show) to discuss procedures
      - The meeting resulted in some good ideas
      - Alloy could flow into the threaded holes, need a plan to prevent the clogging or how to clean it
    - Bob will do the bending
  - Cold plates need to be updated after the fit check lessons learning
    - Marco still needs to work with Scott

Action items
- Fab carrier boxes, should arrive today.
- Complete the validation of the motion systems
- Single board fabrication
  - Analog board ready to Fab
    - We need to know the quantity (check with Lorenzo, and Angelo)
  - Digital board high speed links, not meeting specs for 10Gbps
    - Dan's progress show we have a solution for it, working with Kathy to implement
    - We need to know quantity (check with Lorenzo, and Angelo)

Feb-10-2023

Electronics status

carrier board assembled and going for wirebonding

Mechanics status

Prototype assembly going on

Calibration

We need to get feedback from Andy about the possibility to perform insitu calibration for the 2M detector.
Tytanium kalpha signals, with the detector closed in. But Andy needs to make some calculations.
SSRL could be a good place to do it.
silver behenate can be another way to calibrate it. That will be a geometrical calibration. It could also use a diode for I0 measurements
alternative, we can go to MFX and perform calibration with 8keV.

Andy told us that detector chamber bot will be purchased on the next fiscal year. There is no use for the 2M detector before CY 2024.

Small detector

Chamber will have the below going out straight, towards the door and that should simplify the routing
It will use single welded below

The detector module should stop at the flange. Bellows are part of the chamber design. Marco will get that changed with Don's G.
Check the exact temperatures for the chiller and sensor on this detector.

Feb-08-2023

ASIC testing
- V3 prototype carrier needs new strong back. (2x2). These are assembled and ready to test.
- Next, we need to get the noise performance checked

2M
- Carrier board fabrication status
  - Expedite wire bonding (4x1)
  - some ASIC are chipped
    - We need 3 now and 70 about 2months or later
    - 4 to 6 weeks, Marco will find if there are other faster options
  - Carrier bonding. Black solder mask comes off. Why.
- Analog board
- Digital board
  - 20 bit, working at 20MHz. Good enough for the system
- FW
  - Ongoing. List of all modules needed.
- Mechanical status
  - Marco and Bob are working on fit check and small modification needed. Advances on the stepper motor tolerances
  - Brazing is the next step, it will be done in our local shops.
    - Marco to meet with Andy (at the brazing show) to discuss procedures
    - Bob will do the bending
  - Cold plates need to be updated after the fit check lessons learning
    - Marco needs to work with Scott

Action items
- Fab carrier boxes
- Complete the validation of the motion systems
- Single board fabrication
  - Analog board ready to Fab
    - We need to know the quantity (check with Lorenzo, and Angelo)
  - Digital board high speed links, not meeting specs for 10Gbps
    - License down, working with Larry about it, ETA missing.
    - We need to know quantity (check with Lorenzo, and Angelo)

Feb-01-2023

ASIC testing
- V3 prototype carrier needs new strong back. (2x2) Boards ready for CK

2M
- Carrier board fabrication status
  - Expedite wire bonding (4x1)
  - some ASIC are chipped
  - carrier cases needed, sketch drawing for it to come from CK
- Analog board
- Digital board
  - 20 bit
- FW
  - Ongoing
- Mechanical status
  - Marco and Bob are working on fit check and small modification needed
  - Brazing is the next step, it will be done in our local shops

Single board fabrication
- Analog board ready to Fab
  - We need to know the quantity (check with Lorenzo, and Angelo)
- Digital board high speed links, not meeting specs for 10Gbps
  - License down, working with Larry about it, ETA missing.
  - We need to know quantity (check with Lorenzo, and Angelo)

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