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Half-module # | Contains hybrid | Contains sensor | Hybrid glued | Sensor glued | Sent to UCSC | HV wirebonded | Signals wirebonded | QA tested | Results | Sent to SLAC | Mounted to cooling block | Part of module | Notes |
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Half-module 0 - THE GIMP | Hybrid 0 | Sensor 1803 | to fixture | lousy | with a prayer | mashed bonds | painfully | ? test 1 | 4 chips bonded, and 4 are alive. 3 of them are both bonded and alive. | ? | never | Module ? | | Half-module 1 | Hybrid 1 | Sensor 568 | 2/23/12(TKN) | 2/23/12(TKN) | 2/23/12(AG) | 2/27/12(FM) | 2/29/12(FM) |
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Damaged signal wirebonds observed: probable shorts first ~40 channels. | Half-module 3 | Hybrid 1t | Sensor 132 | 3/10/12(TKN) | 3/10/12(TKN) | 3/12/12 (TKN) | 3/12/12(FM) | 3/13/12(FM) | 3/13/12 test 1 3/14/12 (OM, VF) |
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625 unbonded, 627 dead. High noise is only on run 2 - believed due to noisy electrical contact between CF and baseplate. | | | | Cont'ed on next line | Cont'ed No 3 | | | | | | | Chan 625 fixed, 3/22/12(FM) | 3/23/12 test 6 | 627 dead, else OK: test 6 | 3/23/12 (PH) |
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3/21/12(FM) noticed scratch on Bias/Guard rings. But IV is OK up to 300V. | 3/22/12(FM) | 3/22/12 test 1 3/22/12 test 2 | OK except channels 0 (no response), 134, 639 (noisy response). Channel 0 is bad b/c of the scratch that connects it with bias ring. | 3/23/12(PH) |
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Sensor 142
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Sensor 146
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Half-module Channel Mapping
Link to DAQ page.