Tip

The ePixUHR35kHz Megapixel Cameras project aims to provide modular detector blocks that can be configured into larger cameras in various structural configurations. The smallest building block is a 3x2 detector sensor module, which has a total of 3*2*192*168=193536≈200k pixels. Six of these (6*193536=1161216≈1M pixels) modules are assembled together into a 1 megapixel (1M) camera as shown below to the left. Four of the 1M cameras can then be assembled together, around a central beam pipe aperture, to form a 4M camera shown in the middle below. The largest configuration foreseen for this project is the 16M camera that consists of 16 of the 1M camera blocks as shown below on the right.

1-megapixel (1M)

4-megapixel (4M)

16-megapixel (16M)

Image Modified

1M-camera-diagram.drawio

Image Modified

Image Added

4M-camera-diagram-1.drawio
4M-camera-diagram-2.drawio

Image Added

Image Added

16M-camera-diagram.drawio

6x 3x2 sensor modules:

6*3*2 = 36 ASICs
- 36*192*168 = 1,161,216 pixels
- 36*8 = 288 ASIC GT serial links
  - 35 kfps: 288*1.975 = 568.8 Gbit/s
6 readout boards:
- 6 FPGAs & t ransceivers
- 6*12 = 72 fiber pairs
  - 72*15 = 1080 Gbit/s

4 megapixel (4M)

Image Removed

4x 1M camera assemblies:

4*36 = 144 ASICs
- 144*192*168 = 4,644,864 pixels
- 144*8 = 1152 ASIC GT serial links
  - 35 kfps: 1152*1.975 = 2275.2 Gbit/s
4*6 = 24 readout boards:
- 24 FPGAs & t ransceivers
- 24*12 = 288 fiber pairs
  - 288*15 = 4320 Gbit/s

16 megapixel (16M)

Image Removed

16x 1M camera assemblies:

16*36 = 576 ASICs
- 576*192*168 = 18,579,456 pixels
- 576*8 = 4608 ASIC GT serial links
  - 35 kfps: 4608*1.975 = 9100.8 Gbit/s
16*6 = 96 readout boards:
- 96 FPGAs & t ransceivers
- 96*12 = 1152 fiber pairs
  - 1152*15 =

17280 Gbit

- - 17,280 Gbit/s

Useful resources

Jira Kanban board for this project
TID-ID Edge Computing Systems
Presentations:
- Concept Design summary presentation (Sharepoint)

Mechanical design

Assembly
- http://tcprod01:8080/tc/launchapp?-attach=true&-s=226TCSession&-o=RyqVUGKU4OV8rAAAAAAAAAAAAAA&servername=SLAC+Production+Environment
ADD screen shots with key model views
- https://slac-my.sharepoint.com/:p:/g/personal/ddoering_slac_stanford_edu/ESxfBhZQggtNvkejnoYtD7ABE4Rq_67aG8CWIRZB4tOuEA?e=ecbIIG

Assembly procedure

Bill of materials
Custom tools
- These are tools developed during the design to enable insertion and extraction of the
  - 1MPix to/from 4MPix
  - 3x2 carrier modules
  - readout boards
Assembly procedure steps
- Assemble 1MPix focal plane
- Insert 1MPix focal plane into the 4Mpix cradle

1M assembly

The goal of this assembly is a complete 1M block
This involves attaching 6x of the following to the 1M cooling block
- Carrier modules with ASICs and sensor (the most sensitive component)
- Readout modules with cooling block attached
PowerPoint storyboard (work-in-progress as of 2024-05-02): LCLS-II HE Instrument - 1_4_16MPix Detector-StoryBoard.pptx

Toy model for inserting 1M module into the 4M crate

Multimedia

name	4M-camera-assembly.mov

Sensor design

Due to asymmetry in the ASICs, the edges of the top row do not align exactly with the edges of the bottom row. The top row is shifted horizontally by 1.35 µm relative to the bottom row. The ASICs are spaced 19485 µm apart horizontally.

Full sensorLower left cornerBetween two ASICs at the bottomLower right cornerBetween ASICs in the middleTop left cornerTop right cornerImage

Image Removed

Measurements

Width (x): 60610 µm
Height (y): 36525 µm

x offset: 1166.695 µm
y offset: 502.135 µm

x distance: 178.74 µm

x offset: 1168.045 µm
y offset: 502.135 µm

x offset: 178.74 µm
y offset: 179.87 µm

x offset: 1168.045 µm
y offset: 502.135 µm

x offset: 1165.695 µm
y offset: 502.135 µm

Convert GDS to DXF:

Download Klayout: https://www.klayout.de/
Open the GDS
Save it as DXF

Sensors for ASIC and systems characterization

There is a strong need to have sensors capable of detecting visible light during the characterization phase of the detector. This capability enables the use on lab, low power, LASER that can reproduce the fast timing and large charges that will be experienced during beam time use. X-ray sensor do have metallization in the entrance window to block visible light therefore existing sensor are not suitable

Solutions proposed

Design mast on the 1x1 sensor in the production run
- It will take more than a year to have them and adds a step in the process, which adds risks to the production run
- Etch the metal away. Can be done in individual and prototype sensor (5x5mm)
  - Only sensor for characterization would go through this step
  - Can be done in existing sensor (have them available within a month)
  - In the past we had issues removing the metal and CK's team will investigate this since it is believe this can be consistently done
- Decision is to make production runs with full metallization and process the sensors in house for characterization

Link to mechanical models: Dxf with the design

Restricted Content
HE project related information:
- LCLS-II HE Instrument Workshop: FEH 05/7/2024
- FDR preparation

Electronics design for 3x2 sensor module

The electronics for the 3x2 sensor module is split into two parts; the ASIC carrier (left in the block diagram below) and the readout board (right in the block diagram). They are electrically connected together through a right-angle connector from the Samtec SEARAY connector family, which provides a total of 500 pins for signals and power. The ASIC carrier contains the 3x2 ASICs together with the 3x2 sensor and minimal amount of other components in order to reduce the size and therefore increase the sensitive area of the detector focal plane (the are which is covered by a sensitive sensor). All the active circuitry for interfacing and powering the ASICs is located on the readout board as well as the components for optical communication with the external back-end system.

More details about the electronics design for the 3x2 module can be found on a dedicated page: 3x2 Readout Overview

Image Added

3x2-readout-stack-sideview.drawio | 3x2-readout-stack-sideview.pdf

	ePixUHR35kfps 3x2 Assembly	ePixUHR35kfps 3x2 Readout Board	ePixUHR35kfps 3x2 ASIC Carrier Board
3D view	Image Added	Image Added	Image Added
3D view	Image Added	Image Added	Image Added
Altium 365 project	ePixUHR35kfps-3x2-assembly-C00	ePixUHR35kfps-3x2-readout-board-C00 ePixUHR35kfps-3x2-readout-board-C01	ePixUHR35kfps-3x2-ASIC-carrier-board-C00
Board tracking		PC_261_101_43_C00 PC_261_101_43_C01	PC_261_101_44_C00
Dimensions (X x Y)		59mm x 160mm	60.69mm x 42mm
STEP 3D model		ePixUHR35kfps-3x2-readout-board-PCB-2024-08-29.step	ePixUHR35kfps-3x2-ASIC-carrier-board-PCB-2024-09-16.step

NOTE: If some of the images above are indicated as missing, please ensure that you are logged into Confluence and have access to the Board tracking pages where the images are stored.

Power

The system is designed to operate at 48 V nominally. There are separate supply connections for analog (APWR/AGND) and digital (DPWR/DGND) that are feeding different parts of the readout electronics, which can be used to have a low noise analog supply and a high-efficiency digital supply for example.

Expected power consumption

The expected power for one 3x2 Readout Board with a Carrier Board attached to it is shown in 3x2 Readout Overview#3x2ReadoutOverview-Power and is extrapolated here for the 1M assembly and the 4M camera.

	3x2 Readout Board + Carrier Board		1M assembly		4M camera
	Current	Power	Current	Power	Current	Power
Digital power (DPWR) - 48 V nominal	0.95 A	0.95*48 = 45.6 W	6*0.95 = 5.7 A	5.7*48 = 273.6 W	4*5.7 = 22.8 A	22.8*48 = 1094.4 W
Analog power (APWR) - 48 V nominal	0.56 A	0.56*48 = 26.88 W	6*0.56 = 3.36 A	3.36*48 = 161.28 W	4*3.36 = 13.44 A	13.44*48 = 645.12 W

NOTE: This does not include the power drop in the cables, which will depend on the cable lengths in each application. See Resistance,voltagedrop,powerlossandweight below for example values.

Power distribution

The power distribution diagram below shows how the power is distributed for a 1M assembly with all the boards and cables detailed as well as the expected power consumption values from above. More details of the different connectors, cables and parts is shown in the sections below.

power-distribution-1M.drawio
Image Added
power-distribution-1M.pdf

ePixUHR35kfps 1M Power Breakout Board

The 1M Power Breakout Board distributes the power to six 3x2 Readout Boards. It has two externally facing square Harting connectors, one for all the power and one for optional signals. Each power channel is individually fused with a socketed fuse to protect against catastrophic failures. Changing a fuse requires removal of the board from the 1M assembly, which has been done intentionally since blowing a fuse indicates something internal to the 1M assembly has gone wrong and requires expert investigation. The thermistor connections can be selected on the board through switches to which of the six 3x2 Readout Boards they connect to. Only one thermistor shall be connected per thermistor channel.

Pin	Power connector (J1)	Signal connector (J2) - optional
1	Digital power (DPWR)	Timing input 0 (TIMING_IN_0)
2	Digital power (DPWR)	Timing input 1 (TIMING_IN_1)
3	Analog power (APWR)	Timing output 0 (TIMING_OUT_0)
4	Analog power (APWR)	Timing output 1 (TIMING_OUT_1)
5	Digital ground (DGND)	Timing input 2 (TIMING_IN_2)
6	Digital ground (DGND)	Digital ground (DGND)
7	Analog ground (AGND)	Timing output 2 (TIMING_OUT_2)
8	Analog ground (AGND)	Digital ground (DGND)
9	Thermistor in (THERM_EXT_IN)	Spare connection (SPARE1)
10	Sensor ground (HV_GND)	Thermistor in (THERM_AUX_IN)
11	Thermistor out (THERM_EXT_OUT)	Spare connection (SPARE2)
12	Sensor biasing (SENSOR_HV)	Thermistor out (THERM_AUX_OUT)

Board specific details

See
Jira
showSummary false
server SLAC National Accelerator Laboratory
serverId 1b8dc293-975d-3f2d-b988-18fd9aec1546
key TIDIDECS-81
for more details on the development of this board.
The "Top" side of the board is facing the outside of the camera.
The "Bottom" side of the board is facing the inside of the camera and connects to the six 3x2 readout boards through the TFM connectors.

	PCB	Assembly with connectors
Top	Image Added	Image Added
Bottom	Image Added	Image Added
Altium 365 project	ePixUHR35kfps-1M-power-breakout-board-C00	ePixUHR35kfps-1M-power-breakout-assembly-C00
Board tracking	PC_261_101_45_C00	-
Dimensions (X x Y)	110 mm x 110 mm	-
3D files	ePixUHR35kfps-1M-power-breakout-board-PCB-2024-05-31.step	-

Connectors and parts

Internal facing Samtec connector and cable assembly

Between the Power Breakout Board and the 3x2 Readout Boards there are cable assemblies that interface with Samtec TFM surface mount connectors on both sides that interface with Samtec ISDF cable mounted housings. Samtec also provides wire cable assemblies with the ISDF called SFSDT, which is what is being used here to reduce the amount of manual labour needed. See

Jira

showSummary	false
server	SLAC JIRA
serverId	1b8dc293-975d-3f2d-b988-18fd9aec1546
key	TIDIDECS-218

for more details.

Photo	Part number	DigiKey	Length
Image Added	SFSDT-15-28-G-12.00-DR-NDX	SFSDT-15-28-G-12.00-DR-NDX-ND	304.80 mm (12 inches)

External facing Harting connectors and parts

The two square Harting connectors on the Power Breakout Board above is separated into one for power and one for signal. They have different gender to avoid wrong connections. The power connector have a "protected" female connector on the cable side where voltages may be exposed on the pins. The tables below lists the components that are needed to assembly a full connector stack for the power and signal.

Power connector J1

Description	Harting part number	Quantity	DigiKey	Image
PCB connector Han Q12/0 PCB Adapter	09 12 012 9901	1	1195-1381-ND	Image Added
Male PCB adapter Han Q12-M for PCB-Adapter	09 12 012 3002	1	1195-1378-ND	Image Added
Male pins for PCB adapter Han D-M-Kontakt f. Han Q12/0 LP-Adapter	09 15 000 6191	12	1195-1575-ND	Image Added
Base flange Han 3A-HBM-SL	09 20 003 0301	1	1195-1772-ND	Image Added
Female crimp housing Han 12Q-SMC-FI-CRT-PE with QL	09 12 012 3101	1	1195-1379-ND	Image Added
Choose the crimp pins below to match the cable wire diameter (12 in total)
Female crimp pins 1.0 mm² (18 AWG)	09 15 000 6202	x	1195-1577-ND	Image Added
Female crimp pins 0.75 mm² (18 AWG)	09 15 000 6205	x	1195-1580-ND
Female crimp pins 0.5 mm² (20 AWG)	09 15 000 6203	x	1195-1578-ND
Female crimp pins 0.14 mm² - 0.37 mm² (22-26 AWG)	09 15 000 6204	x	1195-1579-ND
Metal hood
Metal hood (grey) Han A Hood Top Entry 2 Pegs M20	19 20 003 1440	1	1195-3067-ND	Image Added
Choose the cable gland below to match the external diameter of the cable
Han CGM-M M20x1,5 D.5-9mm	19 00 000 5080	x	1195-3032-ND	Image Added
Han CGM-M M20x1,5 D.10-14mm	19 00 000 5084	x	1195-3034-ND
Han CGM-M M20x1,5 D.6-12mm	19 00 000 5082	x	1195-3033-ND
Han CGM-M M20x1,5 D.5-9mm/6-12mm	19 00 000 5081	x	1195-3458-ND

Signal connector J2

Description	Harting part number	Quantity	DigiKey	Image
PCB connector Han Q12/0 PCB Adapter	09 12 012 9901	1	1195-1381-ND	Image Added
Female PCB adapter Han Q12-F for PCB-Adapter	09 12 012 3102	1	1195-1380-ND	Image Added
Female pins for PCB adapter Han D F-ontact f. Han Q12/0 PCB adapter	09 15 000 6297	12	09150006297-ND	Image Added
Base flange Han 3A-HBM-SL	09 20 003 0301	1	1195-1772-ND	Image Added
Male crimp housing Han 12Q-SMC-MI-CRT-PE with QL	09 12 012 3001	1	1195-1377-ND	Image Added
Choose the crimp pins below to match the cable wire diameter (12 in total)
Male crimp pins 1.0 mm² (18 AWG)	09 15 000 6102	x	1195-1561-ND	Image Added
Male crimp pins 0.75 mm² (18 AWG)	09 15 000 6105	x	1195-1564-ND
Male crimp pins 0.5 mm² (20 AWG)	09 15 000 6103	x	1195-1562-ND
Male crimp pins 0.14 mm² - 0.37 mm² (22-26 AWG)	09 15 000 6104	x	1195-1563-ND
Metal hood
Metal hood Han A Hood Top Entry 2 Pegs M20	19 20 003 1440	1	1195-3067-ND	Image Added
Choose the cable gland below to match the external diameter of the cable
Han CGM-M M20x1,5 D.5-9mm	19 00 000 5080	x	1195-3032-ND	Image Added
Han CGM-M M20x1,5 D.10-14mm	19 00 000 5084	x	1195-3034-ND
Han CGM-M M20x1,5 D.6-12mm	19 00 000 5082	x	1195-3033-ND
Han CGM-M M20x1,5 D.5-9mm/6-12mm	19 00 000 5081	x	1195-3458-ND

Tools

The pins that attach to the wires on the cable are crimped and required a specific tool for it listed below. A pin removal/extraction tool could also be useful in case a pin was inserted into the wrong slot.

Description

Harting part number

DigiKey

Image

Drawing

Order

Larger removal tool
Removal Tool Han D

09 99 000 0012

1195-2898-ND

Image Added

PDF

Jira

showSummary	false
server	SLAC JIRA
serverId	1b8dc293-975d-3f2d-b988-18fd9aec1546
key	TIDAT-837

Universal crimp tool
Han Hand Crimp Tool

09 99 000 0110

1195-2906-ND

Image Added

PDF

Optional parts

Some optional parts that might be useful in some cases.

Expand

Description	Harting part number	DigiKey	Image	Drawing
Cover with seal (gray) for female insert Han 3A Protect Cover, Sealing Die Cast f	09 20 003 5425	1195-1792-ND	Image Added	PDF
Cover without seal (gray) for male insert Han 3A Protect Cover, w/o Sealing Die Ca	09 20 003 5426	1195-1793-ND	Image Added	PDF
Cover with seal (blue) for female insert Han Ex-C for HCC Han 3A with seal	09 36 003 5409	09360035405-ND	Image Added	PDF
Cover without seal (blue) for male insert Han Ex-C for HCC Han 3A	09 36 003 5410	09360035410-ND	Image Added	PDF

Power cable

There will be one power cable connecting to the Power connector J1 on the ePixUHR35kfps 1M Power Breakout Board that is routed to external power supplies at the installed location. The choice of cable is motivated and discussed in

Jira

showSummary	false
server	SLAC JIRA
serverId	1b8dc293-975d-3f2d-b988-18fd9aec1546
key	TIDIDECS-258

.

The cable is an igus CF9-05-12, which is a 12-conductor 0.5mm² cable that is designed for heavy duty applications where the cable will be flexed in various direction, e.g. on a robotic arm. The outer jacket is made from TPE and the cable is specified to be halogen-free, PVC-free and Silicone-free. Some other important technical data about the cable:

Datasheet
Number of conductors: 12 x 20 AWG (0.5mm²)
Stranded conductors of bare copper wires
Cores color coded in accordance with DIN 47100
Outer jacket colored dark blue (similar to RAL 5011)
A tear strip is moulded into the outer jacket (CFRIP)
Outer diameter: 0.39 in (10 mm)
Weight: 123 kg/km
Min. bend radius, fixed: 1.18 in (30 mm)
Min. bend radius, flexible: 1.57 in (40 mm)
Nominal Voltage: 300/500V
DigiKey: 4849-CF9-05-12-DS-ND

We assume a cable length of 50 ft (15.24 m) for now to give some headroom for the installation.

Resistance, voltage drop, power loss and weight

The voltage drop over the cable depends on the length and the current passing through the conductors. The 3x2 Readout Overview power map shows that the highest current is for the digital supply that requires 0.95 A when running at 48 V. For a 1M assembly this means a total current of 6*0.95 = 5.7 A and there are two conductors in the Power connector J1 for each supply that share the current. With this information, we can calculate the expected resistance of the conductors in the cable:

Resistance	Voltage drop	Power loss	Weight
Resistance equation: R = ρ * L / A ρ: resistivity of the material, copper at 20°C: ρ ≈ 1.7e ^-8 [Ωm] L: length of the conductor in [m] A: cross-sectional area of the conductor in [m²] R = 1.7e-8/0.5e-6*15.24 = 0.51816 Ω	Voltage drop for two conductors -> half of 5.7 A current U = RI U = 0.518165.7/2 ≈ 1.48 V	Expected power loss in the cable: P = I²R 5.7 A through two conductors at 48 V: 0.5 mm^2: P = (5.7/2)^20.51816 ≈ 4.2 W	Total weight: 12315e-3 = 1.845 kg*
0.51816 Ω	1.48 V	4.2 W	1.845 kg

Sleeve for robotic arm

A flexible sleeve is used to guide the power cables and fiber optic cables for an application where the camera will be mounted on a robotic arm. A Triflex TRE sleeve from igus will be used and more details are available here. There are several sizes available and some of them are shown below as profiles with four gray power cables and four purple fiber optic cables (see below) placed inside for demonstration purposes. The cables are inserted into the sleeve through the slots at the top and bottom as shown below and there are tools available to ease with this.

	TRE-60	TRE-70	TRE-85
Profile with cables	Image Added	Image Added	Image Added
Weight	0.83 kg / m	1.3 kg / m	1.67 kg / m
Bend radius	87 mm	110 mm	135 mm
Number of links	49 links / m	39 links / m	33 links / m

Lab cable diagram

For testing in the lab a cable is made with the Harting power connector on one end and Ponoma 1825 banana connectors on the other end for easy connection to lab equipment.

lab-power-cable.drawio

Assembled cable

Image Added

lab-power-cable.pdf

See

Jira

showSummary	false
server	SLAC JIRA
serverId	1b8dc293-975d-3f2d-b988-18fd9aec1546
key	TIDAT-1019

Power supplies

TODO, see

Jira

server	SLAC National Accelerator Laboratory
serverId	1b8dc293-975d-3f2d-b988-18fd9aec1546
key	TIDIDECS-109

Fiber

The fiber block diagram below shows the connections for 2x 1M assemblies that are connected to 3x Multi Mode to Single Mode Conversion Box . For the full 4M camera this is repeated twice. See

Jira

showSummary	false
server	SLAC JIRA
serverId	1b8dc293-975d-3f2d-b988-18fd9aec1546
key	TIDIDECS-267

for further discussions on the fiber. The length of the fibers will be depend on the final application.

2x1M-fiber-block-diagram.drawio
Image Added

Fiber channel assignment

TODO: need to double-check this with fibers in the lab.

Expand

Signal name	Leap readout	Fiber pigtail Type A		12216 opposed key adapter	Fiber trunk cable Type A		8835 opposed key adapter	Fiber pigtail Type A		Leap MM to SM
Signal name	Male	Female	Male	12216 opposed key adapter	Female	Female	8835 opposed key adapter	Male	Female	Male
TODO	TX 1	← 1	13 →	13 ↔ 12	← 12	24 →	24 ↔ 1	← 1	13 →	RX 1
	TX 2	← 2	14 →	14 ↔ 11	← 11	23 →	23 ↔ 2	← 2	14 →	RX 2
	TX 3	← 3	15 →	15 ↔ 10	← 10	22 →	22 ↔ 3	← 3	15 →	RX 3
	TX 4	← 4	16 →	16 ↔ 9	← 9	21 →	21 ↔ 4	← 4	16 →	RX 4
	TX 5	← 5	17 →	17 ↔ 8	← 8	20 →	20 ↔ 5	← 5	17 →	RX 5
	TX 6	← 6	18 →	18 ↔ 7	← 7	19 →	19 ↔ 6	← 6	18 →	RX 6
	TX 7	← 7	19 →	19 ↔ 6	← 6	18 →	18 ↔ 7	← 7	19 →	RX 7
	TX 8	← 8	20 →	20 ↔ 5	← 5	17 →	17 ↔ 8	← 8	20 →	RX 8
	TX 9	← 9	21 →	21 ↔ 4	← 4	16 →	16 ↔ 9	← 9	21 →	RX 9
	TX 10	← 10	22 →	22 ↔ 3	← 3	15 →	15 ↔ 10	← 10	22 →	RX 10
	TX 11	← 11	23 →	23 ↔ 2	← 2	14 →	14 ↔ 11	← 11	23 →	RX 11
	TX 12	← 12	24 →	24 ↔ 1	← 1	13 →	13 ↔ 12	← 12	24 →	RX 12
	RX 1	← 13	1 →	1 ↔ 24	← 24	12 →	12 ↔ 13	← 13	1 →	TX 1
	RX 2	← 14	2 →	2 ↔ 23	← 23	11 →	11 ↔ 14	← 14	2 →	TX 2
	RX 3	← 15	3 →	3 ↔ 22	← 22	10 →	10 ↔ 15	← 15	3 →	TX 3
	RX 4	← 16	4 →	4 ↔ 21	← 21	9 →	9 ↔ 16	← 16	4 →	TX 4
	RX 5	← 17	5 →	5 ↔ 20	← 20	8 →	8 ↔ 17	← 17	5 →	TX 5
	RX 6	← 18	6 →	6 ↔ 19	← 19	7 →	7 ↔ 18	← 18	6 →	TX 6
	RX 7	← 19	7 →	7 ↔ 18	← 18	6 →	6 ↔ 19	← 19	7 →	TX 7
	RX 8	← 20	8 →	8 ↔ 17	← 17	5 →	5 ↔ 20	← 20	8 →	TX 8
	RX 9	← 21	9 →	9 ↔ 16	← 16	4 →	4 ↔ 21	← 21	9 →	TX 9
	RX 10	← 22	10 →	10 ↔ 15	← 15	3 →	3 ↔ 22	← 22	10 →	TX 10
	RX 11	← 23	11 →	11 ↔ 14	← 14	2 →	2 ↔ 23	← 23	11 →	TX 11
	RX 12	← 24	12 →	12 ↔ 13	← 13	1 →	1 ↔ 24	← 24	12 →	TX 12

Transceiver fiber pigtail

A fiber pigtail is needed for the Leap transceiver with a female MT ferrule on one end and a male MTP-24 connector on the other end. A simplified diagram below shows how the pigtail should look like. The exposed fibers on the left between he MT ferrule and the heat shrink are kept as short as possible to reduce the risk of breakage. See

Jira

showSummary	false
server	SLAC JIRA
serverId	1b8dc293-975d-3f2d-b988-18fd9aec1546
key	TIDIDECS-268

for additional information.

transceiver-fiber.drawio
Image Added
transceiver-fiber.pdf

ASIC

The ePixUHR ASIC is used in this project. The main properties are:

192 (H) x 168 (V) pixels
100 um x 100 um pixel size
8 serial data outputs operating at up to ~6 Gbit/s
The ASIC will be operating at 35 kHz in this application

Resources:

Glue used to bond the ASIC and sensor assembly to the carrier board:
- SP-120 silicone primer: https://nusil.avantorsciences.com/nusil/en/product/SP-120/silicone-primer
- CV-2943 thermally conductive, controlled volatility RTV silicone: https://nusil.avantorsciences.com/nusil/en/product/CV-2943/thermally-conductive-controlled-volatility-rtv-silicone

Size and measurements

These measurements are taken from UHR_3x2_aug2024_overlay.GDS (restricted) that was opened in KLayout.

	Full matrix	Lower left corner	Lower right corner
Image	Image Added	Image Added	Image Added
Measurements	Width (x): 19304.26 µm Height (y): 18672.7 µm	Pad Width (x): 60 µm Height (y): 120 µm Pitch: 100 µm First pad location relative to lower-left corner x: 573.13 µm y: 45.095 µm	Last pad location relative to lower-right corner x: 473.13 µm y: 45.095 µm

Expand

title	Click here to expand for Altium footprint...

A footprint has been created in Altium Designer for the ASIC. The sizes and measurements listed above have been used and rounded to the nearest µm.

NOTE: This needs to be updated to match the latest footprint.

	Full matrix	Lower left corner	Lower right corner
Image	Image Added	Image Added	Image Added
Measurements	Width (x): 19306 µm Height (y): 18674 µm	Pad Width (x): 60 µm Height (y): 120 µm First pad location relative to lower-left corner x: 573 µm y: 45 µm	Last pad location relative to lower-right corner x: 473 µm y: 45 µm Pitch: 100 µm

Sensor design

The measurements below is based on the sensor design found in UHR_3x2_aug2024_overlay.GDS (restricted). The full sensor wafer can be found in 2024-09-11-compiled_mask_UHR_2024_ro_v5.gds (restricted).

	Full sensor	Lower left corner	Between two ASICs at the bottom	Lower right corner	Between ASICs in the middle	Top left corner	Top right corner
Image	Image Added	Image Added	Image Added	Image Added	Image Added	Image Added	Image Added
Measurements	Width (x): 60690 µm Height (y): 36565 µm	x offset: 1166.695 µm y offset: 501.635 µm	x distance: 218.74 µm	x offset: 1167.045 µm y offset: 501.635 µm	x offset: 218.74 µm y offset: 218.87 µm	x offset: 1166.695 µm y offset: 501.635 µm	x offset: 1167.045 µm y offset: 501.635 µm

TODO: cleanup the text below

Sensors for ASIC and systems characterization

There is a strong need to have sensors capable of detecting visible light during the characterization phase of the detector. This capability enables the use on lab, low power, LASER that can reproduce the fast timing and large charges that will be experienced during beam time use. X-ray sensor do have metallization in the entrance window to block visible light therefore existing sensor are not suitable

Solutions proposed

Design mast on the 1x1 sensor in the production run
- It will take more than a year to have them and adds a step in the process, which adds risks to the production run
- Etch the metal away. Can be done in individual and prototype sensor (5x5mm)
  - Only sensor for characterization would go through this step
  - Can be done in existing sensor (have them available within a month)
  - In the past we had issues removing the metal and CK's team will investigate this since it is believe this can be consistently done
- Decision is to make production runs with full metallization and process the sensors in house for characterization

Mechanical design

TODO: Link to mechanical design resources with some example images for the parts

Assembly
- http://tcprod01:8080/tc/launchapp?-attach=true&-s=226TCSession&-o=RyqVUGKU4OV8rAAAAAAAAAAAAAA&servername=SLAC+Production+Environment

Assembly procedure

TODO: Update with the new assembly storyboard

General

ASIC carrier module assembly

Readout module assembly

1M assembly

4M assembly

PowerPoint storyboard (work-in-progress as of 2024-05-02): LCLS-II HE Instrument - 1_4_16MPix Detector-StoryBoard.pptx
Bill of materials
Custom tools
- These are tools developed during the design to enable insertion and extraction of the
  - 1MPix to/from 4MPix
  - 3x2 carrier modules
  - readout boards

TODO
This needs a transport box that protects the ASIC and the sensor after it has been assembled!
Contains the following components
- Carrier board
- 6x ePixUHR ASICs

TODO
Contains the following components
- Readout board
- Thermal interface pad
- Cooling block
- LEAP transceiver
- LEAP fiber pigtail
- Fiber holder
These assemblies will be tested individually before mounting into the 1M assembly and also after mounting
- Write a test procedure for this

TODO
The final product of this assembly is a complete and tested 1M block
This involves attaching 6x of the following to the 1M cooling block
- ASIC carrier modules with ASICs and sensor (the most sensitive component)
- Readout modules with cooling blocks attached

TODO
Toy model for inserting 1M module into the 4M crate

Multimedia

name	4M-camera-assembly.mov

Thermal Design

1M Sensor Module Thermal Analysis by Component

Layer overview	Thermal resistances	Epoxy Layer Thickness	Strongback Pillar Diameter	Thermal Pad Thermal Conductivity	Thermal Pad Thickness
Image Added	Image Added	Image Added	Image Added	Image Added	Image Added

1M Prototype

Determine the effectiveness of the thermal plate in drawing heat away from a heat source
Check cooling lines effectiveness
PowerPoint Overview: 1MPPrototypeThermocoupleMeasurements.pptx
CAD: 1MPTile

Set-Up & Enclosure

Image Added

Components

4-piece foam box enclosure (see 4MP Cam Thermal testing.pptx for more info)
1MP Assembly Tool
LabJack T7 with CB37 Terminal Board (see LabJackT7SetUp.ipynb to use LabJack over USB)
Variable Power Supply
Chiller w/coolant & tubing
14x Type K Thermocouples

3x2 Detector Sensor Module

Visualization	Components	Circuitry	Thermal Analysis
Image Added	36x ceramic heaters - 15 x 15 mm² to thermally mimic ~150 W of heat dissipated by 1MP ASICs 6x aluminum plates to thermally mimic 1MP sensors & ASICs 6x fiberglass plates to thermally mimic 1MP sensor PCBs 6x aluminum strongbacks Thermal Interfaces: MX-4 Thermal Paste & 2-part epoxy to bond ceramic heaters to aluminum, aluminum to fiberglass, & fiberglass to strongbacks 6 Tflex™ 700 thermal pads 1 mm thick between aluminum strongbacks & copper thermal plate 1x copper thermal plate Cooling pipe - Copper OFE or Stainless Steel. Still TBD	See 1MPPrototypeHeaterCircuitSchematic.pptx for more details 30-40 V with 4.6-6.3 A over power supply, yielding 140-250 W of power 6x parallel connections, each with 6x heaters (6.0-6.5 Ohms each) in series	See 1MPSensorThermalResistanceAnalysisResults.pptx for more details As of 8/7/24, we expect to see 10.5 °C difference between the top of the aluminum plate and the inner surface of the thermal plate containing the cooling pipe using a 1-D thermal analysis

Readout Board

Note
As of 8/7/24, this part of the prototype project is on hold, waiting for finalized cooling plate design

Visualization	Components	Circuitry
Image Added	7x ceramic heaters - 15 x 15 mm² to thermally mimic heat dissipated by FPGA & power regulators 5x ceramic heaters - 10 x 10 mm² to thermally mimic heat dissipated by power regulators & LEAP transceiver Thermal Pads Copper Cooling Plate	See 1MPPrototypeHeaterCircuitSchematic.pptx for more details 6.3-8.0 V with 8.5-10.8 A over power supply, yielding 54-87 W of power Power Resistors used in series to regulate heat dissipation of each sensor

Project Management

Smartsheet
PM Internal discussions
LCLS-II-HE XES Detectors ePixHR10k PDR: https://indico.slac.stanford.edu/event/8884/

Production plans

If there Jira tickets related to the parts needed, please add them here.

Electronics components
- Jira
  server SLAC JIRA
  serverId 1b8dc293-975d-3f2d-b988-18fd9aec1546
  key TIDIDECS-275
- Long lead parts (FPGA, Transceivers, connectors, voltage regulators)
- Carrier board
- ...
Mechanical components
- Custom tools
- Mechanical parts
Supporting systems
- Conversion box:
  Jira
  server SLAC JIRA
  serverId 1b8dc293-975d-3f2d-b988-18fd9aec1546
  key TIDIDECS-205
- Power distribution units?
- Power cables
  - Jira
    server SLAC JIRA
    serverId 1b8dc293-975d-3f2d-b988-18fd9aec1546
    key TIDIDECS-218
  - Prototype cable:
    Jira
    server SLAC JIRA
    serverId 1b8dc293-975d-3f2d-b988-18fd9aec1546
    key TIDIDECS-258
- Debug cables
- Fiber optics external cables
  - Jira
    server SLAC JIRA
    serverId 1b8dc293-975d-3f2d-b988-18fd9aec1546
    key TIDIDECS-267

Panel

title	Purchasing Info

PA (also to be used for labor):

21588-46601

P6 (to be used according to the specific item being purchased):

XES_DET_MBP_6180 AWARD: Procurement - Motherboards - DET ePixHR10k / XES_DET_MBP_6210 RCV: Motherboards Procurement - DET ePixHR10k
XES_DET_MCP_6180 AWARD: Procurement - Mech Comp - DET ePixHR10k / XES_DET_MCP_6210 RCV: Mech Comp Procurement - DET ePixHR10k
XES_DET_MOD_6180 AWARD: Procurement - Module Boards - DET ePixHR10k / XES_DET_MOD_6210 RCV: Module Boards Procurement - DET ePixHR10k
XES_DET_RSP_6180 AWARD: Procurement - Rad Shield - DET ePixHR10k / XES_DET_RSP_6210 RCV: Rad Shield Procurement - DET ePixHR10k
XES_DET_WBP_6180 AWARD: Procurement - Wire Bond - DET ePixHR10k / XES_DET_WBP_6210 RCV: Wire Bond Procurement - DET ePixHR10k
XES_DET_FCH_6210 AWARD: Procurement - Flip Chip Hybridization - DET ePixHR10k / XES_DET_FCH_6240 RCV: Flip Chip Hybridization - DET ePixHR10k

Phase/Funding:

CD-2/3

Justification:

[insert brief summary of what's being bought and for what specific purpose]

*For any orders that do not require a formal quote (ex Digikey, Mcmaster): Please provide a screenshot of the item in question on the Jira ticket for HE PMT archiving purposes. Or tag Stephen to do so

Reference documents from HE project

Jira

server	SLAC National Accelerator Laboratory
serverId	1b8dc293-975d-3f2d-b988-18fd9aec1546
key	TIDIDECS-93

Draft

Electronics design for 3x2 sensor module

The electronics for the 3x2 sensor module is split into two parts; the ASIC carrier (left in the block diagram below) and the readout board (right in the block diagram). They are electrically connected together through a right-angle connector from the Samtec SEARAY connector family, which provides a total of 500 pins for signals and power. The ASIC carrier contains the 3x2 ASICs together with the 3x2 sensor and minimal amount of other components in order to reduce the size and therefore increase the sensitive area of the detector focal plane (the are which is covered by a sensitive sensor). All the active circuitry for interfacing and powering the ASICs is located on the readout board as well as the components for optical communication with the external back-end system.

More details about the electronics design for the 3x2 module can be found on a dedicated page: 3x2 Readout Overview

Gliffy Diagram

macroId	d222c839-3571-40f2-a7b8-3908d64cfdd6
displayName	ePixUHR-miniTileBD
name	ePixUHR-miniTileBD
pagePin	4

ePixUHR35kfps 3x2 AssemblyePixUHR35kfps 3x2 Readout BoardePixUHR35kfps 3x2 ASIC Carrier Board3D view

Image Removed

Image RemovedImage Removed

Altium 365 project

https://stanford-linear-accelerator-center.365.altium.com/designs/AA37FBEE-48A8-4801-968D-F2C18F098256

https://stanford-linear-accelerator-center.365.altium.com/designs/8A58F5D8-B190-4E81-9967-A7C97BA5BAD8

https://stanford-linear-accelerator-center.365.altium.com/designs/1C32F53F-0F7D-4FA6-A6A2-A68D0AD370D8Board tracking

N/A

PC_261_101_43_C00

PC_261_101_44_C00Dimensions (X x Y)TBD59mm x 160mm60.61mm x 42mmSTEP 3D modelePixUHR35kfps-3x2-readout-board-PCB.step ePixUHR35kfps-3x2-ASIC-carrier-board-PCB.step

NOTE: If some of the images above are indicated as missing, please ensure that you are logged into Confluence and have access to the Board tracking pages where the images are stored.

Board-to-board connector

SAMTEC SEAF8/SEAM8 series connector will be used with 10x40=400 pins in one connector.

Readout board connectorCarrier board connector3D model

Image RemovedImage Removed

Photo of sample
(50 column version)

Image Removed Image Removed Image Removed

Image RemovedImage Removed

Part numberSEAF8-40-1-S-10-2-RASEAM8-40-S02.0-S-10-3Product pagehttps://www.samtec.com/products/seaf8-40-1-s-10-2-ra https://www.samtec.com/products/seam8-40-s02.0-s-10-3Catalog[online version] - [local pdf][online version] - [local pdf]Drawing[online version] - [local pdf][online version] - [local pdf]Footprint[online version] - [local pdf][online version] - [local pdf]STEP 3D modelSEAF8-40-1-S-10-2-RA.stp SEAM8-40-S02.0-S-10-3.stp Expand

title	Same connector but with 50 columns

50 column

Readout board connectorCarrier board connector3D model

Image Removed Image Removed

Photo of sample

Image Removed Image Removed Image Removed

Image RemovedImage Removed

Part numberSEAF8-50-1-S-10-2-RASEAM8-50-S02.0-S-10-3Product pagehttps://www.samtec.com/products/seaf8-50-1-s-10-2-ra https://www.samtec.com/products/seam8-50-s02.0-s-10-3Catalog[online version] - [local pdf][online version] - [local pdf]Drawing[online version] - [local pdf][online version] - [local pdf]Footprint[online version] - [local pdf][online version] - [local pdf]STEP 3D modelSEAF8-50-1-S-10-2-RA.stp SEAM8-50-S02.0-S-10-3.stp

50 column with guide posts

Readout board connectorCarrier board connector3D model

Image Removed Image Removed

Part numberSEAF8-50-1-S-10-2-RA-GPSEAM8-50-S02.0-S-10-3-GPProduct pagehttps://www.samtec.com/products/seaf8-50-1-s-10-2-ra-gp https://www.samtec.com/products/seam8-50-s02.0-s-10-3-gpCatalog[online version] - [local pdf][online version] - [local pdf]Drawing[online version] - [local pdf][online version] - [local pdf]Footprint[online version] - [local pdf][online version] - [local pdf]STEP 3D modelSEAF8-50-1-S-10-2-RA-GP.stp SEAM8-50-S02.0-S-10-3-GP.stp

Propagation delay

Info

Note: Due to the use of a right-angle connector there will be different path lengths for signals in different rows. See High Speed Characterization Report from Samtec.

Table 16 on page 38 shows the propagation delay of the first row A (~100 ps) to the last row K (~180 ps) for different signal configurations. These propagation delay values have been assigned to the right-angle connector footprint pads for each row and will therefore be included in the propagation delay calculation in Altium when a trace is routed.

The P and N signal of differential pairs should be placed in the same row to avoid skew between them. Timing critical signals should take into account the different propagation delays for the rows.

Expand

title	Click here to expand for propagation delay table...

Propagation delays, cells with yellow color have been interpolated from the data in the report.

Row

Single-ended: 1:1 S/GSingle-ended: 2:1 S/GDifferential: Optimal HorizontalAssigned in AltiumA96 ps103 ps94 ps100 psB106 ps111 ps103 ps109 psC115 ps118 ps112 ps118 psD125 ps128 ps120 ps127 psE135 ps137 ps129 ps136 psF144 ps147 ps137 ps144 psG153 ps156 ps146 ps153 psH162 ps166 ps154 ps162 psJ172 ps176 ps165 ps171 psK182 ps186 ps174 ps180 psAverage difference:9.6 ps9.2 ps8.9 ps8.9 ps

Power

Power supplies

TODO, see

Jira

server	SLAC National Accelerator Laboratory
serverId	1b8dc293-975d-3f2d-b988-18fd9aec1546
key	TIDIDECS-109

1M Power Breakout Board

See
Jira
server SLAC National Accelerator Laboratory
serverId 1b8dc293-975d-3f2d-b988-18fd9aec1546
key TIDIDECS-81
The "Top" side of the board is facing the rear of the camera
The "Bottom" side of the board is facing the inside of the camera and connects to the six 3x2 readout boards through the TFM connectors

PCBAssembly with connectors

Top

Image Removed

Bottom

Image Removed

3D files

STEP: HE-1M-power-breakout-board-PCB.step
PARASOLID: HE-1M-power-breakout-board-PCB.x_t

STEP: HE-1M-power-breakout-assembly.step
PARASOLID: HE-1M-power-breakout-assembly.x_t

ASIC

The ePixUHR 100 kHz ASIC is used in this project. The main properties are:

192 (H) x 168 (V) pixels
100 um x 100 um pixel size
8 serial data outputs operating at up to ~6 Gbit/s

Resources:

Confluence page (restricted)

Size and measurements

These measurements are taken from a GDS file (ePixUHR_100kHz_4Julie.gds) that was opened in KLayout.

Full matrixLower left cornerLower right cornerImage

Image Removed

Measurements

Width (x): 19306.26 µm
Height (y): 18674.7 µm

Pad
- Width (x): 60 µm
- Height (y): 120 µm
- Pitch: 100 µm
First pad location relative to lower-left corner
- x: 573.13 µm
- y: 45.095 µm

Last pad location relative to lower-right corner
- x: 473.13 µm
- y: 45.095 µm

Expand

title	Click here to expand for Altium footprint...

A footprint has been created in Altium Designer for the ASIC. The sizes and measurements listed above have been used and rounded to the nearest µm.

Full matrixLower left cornerLower right cornerImage

Image Removed

Measurements

Width (x): 19306 µm
Height (y): 18674 µm

Pad
- Width (x): 60 µm
- Height (y): 120 µm
First pad location relative to lower-left corner
- x: 573 µm
- y: 45 µm

Last pad location relative to lower-right corner
- x: 473 µm
- y: 45 µm
- Pitch: 100 µm

Block diagrams of camera configurations

The block diagrams have been created with Draw.io instead of the Gliffy integration in Confluence, which has major issue as soon as there are more than 100 items in the diagram it seems. It slows down the whole confluence page and it's near impossible to edit the diagram. There are also major limitations in the tools available in Gliffy, e.g. there doesn't seem to be a way to draw an arbitrary polygon or parallelograms.

Project Management

Reference documents from HE project

Draft
- https://slac.sharepoint.com/:w:/r/sites/lcls/lcls-2-he/wd/PRD/LCLSII-HE-1.4-PR-0222.docx?d=w4eaaaca4a4774d7c9edee213070d7b51&csf=1&web=1&e=s1DVbb
- https://slac.sharepoint.com/:w:/r/sites/lcls/lcls-2-he/wd/ESD/LCLSII-HE-1.4-ES-1144.docx?d=w43d160d640204029b55ec6cdb5ed74b9&csf=1&web=1&e=Y2FrcG
- https://slac.sharepoint.com/:w:/r/sites/lcls/lcls-2-he/wd/FRS/LCLSII-HE-1.4-FR-1143.docx?d=wd4f6f8b883b1463bae1eb198115994a0&csf=1&web=1&e=iX1UwD
- https://slac.sharepoint.com/:w:/r/sites/lcls/lcls-2-he/wd/ICD/LCLSII-HE-1.4-IC-0499.docx?d=w3073ea2890864e41a72ddd0b782baacc&csf=1&web=1&e=tUZam8
- https://slac.sharepoint.com/:w:/r/sites/lcls/lcls-2-he/wd/ICD/LCLSII-HE-1.4-IR-0879.docx?d=we5d9be1626e849549e24b797f6dd8b23&csf=1&web=1&e=blzNG6
- LCLSII-HE-1.4-IR-0880.docx
- https://slac.sharepoint.com/:w:/r/sites/lcls/lcls-2-he/wd/ICD/LCLSII-HE-1.4-IR-08800881.docx?d=wb5875862dc0c4692aec36b61a37a4941&csf=1&web=1&e=nNlFBB
Released

Jira tasks for the project

To do

Jira

server	SLAC National Accelerator Laboratory
columnIds	summary,assignee,status
columns	summary,assignee,status
maximumIssues	20
jqlQuery	labels = "ePixUHR35kHz-Megapixel-Cameras" and status = "to do"
serverId	1b8dc293-975d-3f2d-b988-18fd9aec1546

In progress

Jira

server	SLAC National Accelerator Laboratory
columnIds	summary,assignee,status
columns	summary,assignee,status
maximumIssues	20
jqlQuery	labels = "ePixUHR35kHz-Megapixel-Cameras" and status = "In progress"
serverId	1b8dc293-975d-3f2d-b988-18fd9aec1546

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Key

Table of contents

Useful resources

Mechanical design

Assembly procedure

1M assembly

Toy model for inserting 1M module into the 4M crate

Sensor design

Electronics design for 3x2 sensor module

Power

Expected power consumption

Power distribution

ePixUHR35kfps 1M Power Breakout Board

Board specific details

Connectors and parts

Internal facing Samtec connector and cable assembly

External facing Harting connectors and parts

Power connector J1

Signal connector J2

Tools

Optional parts

Power cable

Resistance, voltage drop, power loss and weight

Sleeve for robotic arm

Lab cable diagram

Power supplies

Fiber

Fiber channel assignment

Transceiver fiber pigtail

ASIC

Size and measurements

Sensor design

Mechanical design

Assembly procedure

Thermal Design

1M Sensor Module Thermal Analysis by Component

1M Prototype

Set-Up & Enclosure

Components

3x2 Detector Sensor Module

Readout Board

Project Management

Production plans

Electronics design for 3x2 sensor module

Board-to-board connector

Propagation delay

Power

Power supplies

1M Power Breakout Board

ASIC

Size and measurements

Block diagrams of camera configurations

Project Management

Jira tasks for the project

To do

In progress