HE project related information

• LCLS-II HE Instrument Workshop: FEH 05/7/2024
• FDR preparation

Mechanical design

• Assembly
  • http://tcprod01:8080/tc/launchapp?-attach=true&-s=226TCSession&-o=RyqVUGKU4OV8rAAAAAAAAAAAAAA&servername=SLAC+Production+Environment

Assembly procedure

• PowerPoint storyboard (work-in-progress as of 2024-05-02): LCLS-II HE Instrument - 1_4_16MPix Detector-StoryBoard.pptx
• Bill of materials
• Custom tools
  • These are tools developed during the design to enable insertion and extraction of the
    • 1MPix to/from 4MPix
    • 3x2 carrier modules
    • readout boards

ASIC carrier module assembly

• TODO
• This needs a transport box that protects the ASIC and the sensor after it has been assembled!
• Contains the following components
  • Carrier board
  • 6x ePixUHR ASICs

Readout module assembly

• TODO
• Contains the following components
  • Readout board
  • Thermal interface pad
  • Cooling block
  • LEAP transceiver
  • LEAP fiber pigtail
  • Fiber holder
• These assemblies will be tested individually before mounting into the 1M assembly and also after mounting
  • Write a test procedure for this

1M assembly

• The final product of this assembly is a complete and tested 1M block
• This involves attaching 6x of the following to the 1M cooling block
  • ASIC carrier modules with ASICs and sensor (the most sensitive component)
  • Readout modules with cooling blocks attached

4M assembly

• TODO

Toy model for inserting 1M module into the 4M crate

Thermal Design

1MP Sensor Module Thermal Analysis by Component

1MP Prototype

• Determine the effectiveness of the thermal plate in drawing heat away from a heat source

• Check cooling lines effectiveness

• PowerPoint Overview: 1MPPrototypeThermocoupleMeasurements.pptx

• CAD:  1MPTile

Set-Up & Enclosure

Components

• 4-piece foam box enclosure (see 4MP Cam Thermal testing.pptx for more info)
• 1MP Assembly Tool
• LabJack T7 with CB37 Terminal Board (see LabJackT7SetUp.ipynb to use LabJack over USB)
• Variable Power Supply
• Chiller w/coolant & tubing
• 14x Type K Thermocouples

3x2 Detector Sensor Module

Components

• 36x ceramic heaters - 15 x 15 mm² to thermally mimic ~150 W of heat dissipated by 1MP ASICs

• 6x aluminum plates to thermally mimic 1MP sensors & ASICs

• 6x fiberglass plates to thermally mimic 1MP sensor PCBs

• 6x aluminum strongbacks

• Thermal Interfaces:

  • MX-4 Thermal Paste & 2-part epoxy to bond ceramic heaters to aluminum, aluminum to fiberglass, & fiberglass to strongbacks

  • 6 Tflex™ 700 thermal pads 1 mm thick between aluminum strongbacks & copper thermal plate

• 1x copper thermal plate
• Cooling pipe - Copper OFE or Stainless Steel. Still TBD

Circuitry

• See 1MPPrototypeHeaterCircuitSchematic.pptx for more details

• 30-40 V with 4.6-6.3 A over power supply, yielding 140-250 W of power

• 6x parallel connections, each with 6x heaters (6.0-6.5 Ohms each) in series

Thermal Analysis

• See 1MPSensorThermalResistanceAnalysisResults.pptx for more details
• As of 8/7/24, we expect to see 10.5 °C difference between the top of the aluminum plate and the inner surface of the thermal plate containing the cooling pipe using a 1-D thermal analysis

Readout Board

AS OF 8/7/24, THIS PART OF THE PROTOTYPE PROJECT IS ON HOLD, WAITING FOR FINALIZED COOLING PLATE DESIGN

Components

• 7x ceramic heaters - 15 x 15 mm² to thermally mimic heat dissipated by FPGA & power regulators
• 5x ceramic heaters - 10 x 10 mm² to thermally mimic heat dissipated by power regulators & LEAP transceiver
• Thermal Pads
• Copper Cooling Plate

Circuitry

• See 1MPPrototypeHeaterCircuitSchematic.pptx for more details
• 6.3-8.0 V with 8.5-10.8 A over power supply, yielding 54-87 W of power
• Power Resistors used in series to regulate heat dissipation of each sensor

Sensor design

Due to asymmetry in the ASICs, the edges of the top row do not align exactly with the edges of the bottom row. The top row is shifted horizontally by 1.35 µm relative to the bottom row. The ASICs are spaced 19485 µm apart horizontallyThe measurements below is based on the sensor design found in UHR_3x2_aug2024_overlay.GDS (restricted).

Convert GDS to DXF:

Sensors for ASIC and systems characterization

There is a strong need to have sensors capable of detecting visible light during the characterization phase of the detector. This capability enables the use on lab, low power, LASER that can reproduce the fast timing and large charges that will be experienced during beam time use. X-ray sensor do have metallization in the entrance window to block visible light therefore existing sensor are not suitable

Solutions proposed 

• Design mast on the 1x1 sensor in the production run
  • It will take more than a year to have them and adds a step in the process, which adds risks to the production run
  • Etch the metal away. Can be done in individual and prototype sensor (5x5mm)
    • Only sensor for characterization would go through this step
    • Can be done in existing sensor (have them available within a month)
    • In the past we had issues removing the metal and CK's team will investigate this since it is believe this can be consistently done
  • Decision is to make production runs with full metallization and process the sensors in house for characterization

Link to mechanical models: Dxf with the design

Electronics design for 3x2 sensor module

The electronics for the 3x2 sensor module is split into two parts; the ASIC carrier (left in the block diagram below) and the readout board (right in the block diagram). They are electrically connected together through a right-angle connector from the Samtec SEARAY connector family, which provides a total of 500 pins for signals and power. The ASIC carrier contains the 3x2 ASICs together with the 3x2 sensor and minimal amount of other components in order to reduce the size and therefore increase the sensitive area of the detector focal plane (the are which is covered by a sensitive sensor). All the active circuitry for interfacing and powering the ASICs is located on the readout board as well as the components for optical communication with the external back-end system.

More details about the electronics design for the 3x2 module can be found on a dedicated page: 3x2 Readout Overview

NOTE: If some of the images above are indicated as missing, please ensure that you are logged into Confluence and have access to the Board tracking pages where the images are stored.

Power

The system is designed to operate at 48 V nominally. There are separate supply connections for analog (APWR/AGND) and digital (DPWR/DGND) that are feeding different parts of the readout electronics, which can be used to have a low noise analog supply and a high-efficiency digital supply for example.

Power supplies

TODO, see

ePixUHR35kfps 1M Power Breakout Board

The 1M Power Breakout Board distributes the power to six 3x2 Readout Boards. It has two externally facing square Harting connectors, one for all the power and one for optional signals. Each power channel is individually fused with a socketed fuse to protect against catastrophic failures. Changing a fuse requires removal of the board from the 1M assembly, which has been done intentionally since blowing a fuse indicates something internal to the 1M assembly has gone wrong and requires expert investigation. The thermistor connections can be selected on the board through switches to which of the six 3x2 Readout Boards they connect to. Only one thermistor shall be connected per thermistor channel.

Board specific details

• See

  Jira
  server SLAC National Accelerator Laboratory serverId 1b8dc293-975d-3f2d-b988-18fd9aec1546 key TIDIDECS-81

• The "Top" side of the board is facing the rear of the camera
• The "Bottom" side of the board is facing the inside of the camera and connects to the six 3x2 readout boards through the TFM connectors

Connectors and parts

The two square Harting connectors on the Power Breakout Board above is separated into one for power and one for signal. They have different gender to avoid wrong connections. The power connector have a "protected" female connector on the cable side where voltages may be exposed on the pins. The tables below lists the components that are needed to assembly a full connector stack for the power and signal.

Optional parts

Some optional parts that might be useful in some cases.

Tools

The pins that attach to the wires on the cable are crimped and required a specific tool for it listed below. A pin removal/extraction tool could also be useful in case a pin was inserted into the wrong slot.

ASIC

The ePixUHR 100 kHz ASIC is used in this project. The main properties are:

• 192 (H) x 168 (V) pixels
• 100 um x 100 um pixel size
• 8 serial data outputs operating at up to ~6 Gbit/s

Resources:

• Confluence page (restricted)
• Glue used to bond the ASIC+SENSOR to the carrier board
  • SP-120 silicone primer: https://nusil.avantorsciences.com/nusil/en/product/SP-120/silicone-primer
  • CV-2943 thermally conductive, controlled volatility RTV silicone: https://nusil.avantorsciences.com/nusil/en/product/CV-2943/thermally-conductive-controlled-volatility-rtv-silicone

Size and measurements

These measurements are taken from a GDS file (ePixUHR_100kHz_4Julie.gds) that was opened in KLayout.

Block diagrams of camera configurations

The block diagrams have been created with Draw.io instead of the Gliffy integration in Confluence, which has major issue as soon as there are more than 100 items in the diagram it seems. It slows down the whole confluence page and it's near impossible to edit the diagram. There are also major limitations in the tools available in Gliffy, e.g. there doesn't seem to be a way to draw an arbitrary polygon or parallelograms.

• 1M-camera-diagram.drawio
• 4M-camera-diagram-1.drawio
• 4M-camera-diagram-2.drawio
• 16M-camera-diagram.drawio

Project Management

• Smartsheet
• PM Internal discussions
• LCLS-II-HE XES Detectors ePixHR10k PDR: https://indico.slac.stanford.edu/event/8884/

Reference documents from HE project

• Draft 
  • LCLSII-HE-1.4-PR-0222.docx
  • LCLSII-HE-1.4-ES-1144.docx
  • LCLSII-HE-1.4-FR-1143.docx
  • LCLSII-HE-1.4-IC-0499.docx
  • LCLSII-HE-1.4-IR-0879.docx
  • LCLSII-HE-1.4-IR-0880.docx
• Released
  • LCLSII-HE-1.4-IR-0875.pdf
  • LCLSII-HE-1.4-PR-0220.pdf
  • LCLSII-HE-1.4-PR-0279.pdf
  • LCLSII-HE-1.4-PR-0280.pdf
  • LCLSII-HE-1.4-IC-0688.pdf
  • LCLSII-HE-1.4-IR-0875.pdf

Jira tasks for the project