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S30XL-LESA/LDMX
Half-module # |
Contains hybrid |
Contains sensor |
Hybrid glued |
Sensor glued |
Sent to UCSC |
HV wirebonded |
Signals wirebonded |
QA tested |
Results |
Sent to SLAC |
Mounted to cooling block |
Part of module |
Notes |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|
to fixture |
lousy |
with a prayer |
mashed bonds |
painfully |
? test 1 |
4 chips bonded, and 4 are alive. 3 of them are both bonded and alive. |
? |
never |
|
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2/23/12(TKN) |
2/23/12(TKN) |
2/23/12(AG) |
2/27/12(FM) |
2/29/12(FM) |
? test 1 |
OK |
3/12/12(TKN) |
? |
READY |
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3/1/12(TKN) |
3/1/12(TKN) |
3/1/12(OM) |
3/2/12(FM) |
3/6/12(FM) |
? test 1 |
OK |
3/14/12(PH) |
? |
READY |
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3/10/12(TKN) |
3/10/12(TKN) |
3/12/12(TKN) |
3/12/12(FM) |
3/13/12(FM) |
3/14/12 (OM, VF) test 1 |
High noise? (To retest) |
? |
? |
Needs ITT connector |
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3/10/12(TKN) |
3/10/12(TKN) |
3/12/12(TKN) |
3/14/12(FM) |
3/14/12(FM) |
3/16/12 (TC, VF) test 1 |
Channels 317, 319 have low gain and timing anomalies, rest is OK. |
3/18/12 (VF) |
? |
Solder pad ripped (dgnd), need re-work! |
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3/10/12(TKN) |
3/10/12(TKN) |
3/12/12(TKN) |
3/14/12(FM) |
3/14/12(FM) |
? test 1 |
? |
? |
? |
Needs ITT connector |
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3/18/12(TKN) |
3/18/12(TKN) |
? |
? |
? |
? test 1 |
? |
? |
? |
|
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3/18/12(TKN) |
3/18/12(TKN) |
? |
? |
? |
? test 1 |
? |
? |
? |
|
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3/18/12(TKN) |
3/18/12(TKN) |
? |
? |
? |
? test 1 |
? |
? |
? |
|
To add a half-module, copy the line below into the table and fill in the ?s.
|[Half-module ?] | [Hybrid ?] | [Sensor ?] | ? | ? | ? | ? | ? | ? [test 1|Half-module ?, test 1]| ? | ? | ? |[Module ?]|