Components

• Mechanics: Front panel, back panel, cooling block and screws.  
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• EpixHR250M carrier, P&CB, and Digital boards
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• 24-channel Fiber optics cable, MTP adapter, on-board transceiver and optical fiber clip
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• On-board transceiver mounting tool and hex keys (3/32'' and 5/64'') 
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• Power cable
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• Thermal pads

Thermal padding

Position two layers of thermal pad on top of the surface of the P&CB that is in contact with the cooling block (large connector side). Two inductors on this side will be visibly coming out from under the thermal pad. These chips have enough height to be in direct contact with the cooling block, and there is no margin for a thermal pad there. Gently remove the thermal pad from the top of the inductors until the inductor becomes visible. 

As for the carrier and the digital board, in some regions it is recommended to use one layer while in others it is recommended to use two layers of thermal pads. See image below

1 layer regions:

• On top of the FPGA
• On the full upper side of the digital board
• On the bottom region of the cooling block designated for the carrier board

In every other place 2 layers would do. Bear in mind that some of the component part on the bottom side of the digital board have significant height. It can be observed on the left side the pressure that these component exerted on the thermal padding. If bulging is observed when screwing, then unscrew and manually compress the thermal pad in these regions or remove the second layer of the thermal pad.

Fastening the boards on the cooling block

Connecting transceiver