2019 Sensor Production

Sensor #	Received	Tested	V _dep (V) CNM	V _break (V) CNM	V _break (V) UCSC	Pinholes Sector A	Pinholes Sector B	Glued to Hybrid	Current Location	Notes
W07-S2	02/27/2019	UCSC	30	60	80				SLAC	GP2
W07-S3	02/27/2019	UCSC	23	380	130			L0M02	UCSC	GP2
W07-S5	02/27/2019	UCSC	30	420	170				SLAC	GP2
W07-S6	02/27/2019	UCSC	23	150	100				SLAC	GP2
W09-S2	02/27/2019	UCSC	23	240	180				SLAC	GP2
W09-S5	02/27/2019	UCSC	23	120	120			L0M01	UCSC	GP2
W02-S1	02/27/2019	UCSC Baked	20	50	40				UCSC	GP1, Displaced in Gelpack, baked at 170 C for 23 h
W02-S4	02/27/2019	UCSC Baked	23	150	50				UCSC	GP1, Displaced in Gelpack, baked at 170 C for 23 h
W03-S6	02/27/2019	UCSC Baked	18	280	60				UCSC	GP1, Displaced in Gelpack, baked at 170 C for 23 h
W04-S3	02/27/2019	UCSC	25	350	370				UCSC	GP1, In Gelpack with displaced chips
W04-S6	02/27/2019	UCSC	18	480	420				UCSC	GP1, In Gelpack with displaced chips
W07-S1	02/27/2019	UCSC Baked	23	>500	50				UCSC	GP1, In Gelpack with displaced chips, baked at 170 C for 23 h
W01-S6	01/15/2019				large	37, 41, 103, 171, 191, 195, 199, 203, 239, 24	11, 73, 12, 16, 212		UCSC	the non-slim long edge is cut to ~550 um. No nitride. IV is irregular, but under 10 uA at 350 V.

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