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Sensor # | Received | Tested | V dep (V) CNM | V dep (V) UCSC | V break (V) CNM | V break (V) UCSC | Pinholes Sector A | Pinholes Sector B | Glued to Hybrid | Notes |
|---|---|---|---|---|---|---|---|---|---|---|
| W07-S2 | 02/27/2019 | UCSC | 30 | 60 | 80 | GP2 | ||||
| W07-S3 | 02/27/2019 | UCSC | 23 | 380 | 130 | GP2 | ||||
| W07-S5 | 02/27/2019 | UCSC | 30 | 420 | 170 | GP2 | ||||
| W07-S6 | 02/27/2019 | UCSC | 23 | 150 | 100 | GP2 | ||||
| W09-S2 | 02/27/2019 | UCSC | 23 | 240 | 180 | GP2 | ||||
| W09-S2 | 02/27/2019 | UCSC | 23 | 120 | 120 | GP2 | ||||
| W02-S1 | 02/27/2019 | 20 | 50 | 40 | GP1, Displaced in Gelpack, baked at 170 C for 23 h | |||||
| W02-S4 | 02/27/2019 | UCSC Baked | 23 | 150 | 50 | GP1, Displaced in Gelpack, baked at 170 C for 23 h | ||||
| W03-S6 | 02/27/2019 | UCSC Baked | 18 | 280 | 60 | GP1, Displaced in Gelpack, baked at 170 C for 23 h | ||||
| W04-S3 | 02/27/2019 | UCSC | 25 | 350 | 370 | GP1, In Gelpack with displaced chips | ||||
| W04-S6 | 02/27/2019 | UCSC | 18 | 480 | 420 | GP1, In Gelpack with displaced chips | ||||
| W07-S1 | 02/27/2019 | 23 | >500 | 50 | GP1, In Gelpack with displaced chips, baked at 170 C for 23 h | |||||
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