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CompanyProduct Name

Viscosity (centipoise)

Water: 1cp

Thermal Conductivity

w/(m-K)

Cure Time @ Temp

Strength

(psi & N/mm^2)

Working HoursDensity

Electrical resistivity

ohm-cm

Radiation HardnessType?LinkNotes
Desired values 

< 60 000 or more ideally

< 20 000

1

temp ~ 22C

time: ~1 day

See currently used glue: SE 4445 CV Kit  High

For 2000 fb-1: 1.3E16 neq/cm2 and 1GRad = 10 MGy

Glue (epoxy) , Gel, or Tape  

AI

Technology

Prima-Bond:

EG7655-LV1

70000 cp1.7 ± 10%4 hr @85 CLapShear > 800 psi"reworkable" 

>1E+14

CERN test:

prerad: 340 psi

Flexible epoxy adhesive  
Polytec
TC418

40k-60k

1.6

48 h @ 23C

Young modulus: 40 N/mm^2

Lap shear strength: 2.9 N/mm^2

   Tested at cern: before radiation: peel strength 350, after 325 psiGlue/ Epoxy (flexible)

Being tested as good options by John Matheson.

Also listed here:

https://indico.cern.ch/event/718423/contributions/3002853/attachments/1650032/2638799/20180515_MaterialQualification.pdf

 
Epo‐Tek
T 7109‐19

40k-70k

1.3

"sets harder than SE4445"

Lap Shear 1434 psi

  

> 5E+12

Cern peel strength tested: before rad: 1400 psi, after: 600 psiEpoxy (flexible)Being tested as good options by John Matheson 
3MVHB Tape 5909- 

Temperature Resistance:

Short Term: 121 C

Long Term : 82 C

72 hr to set

Peel Adhesion:

N/100mm

  720 kg/m3tested at cern: 60 psi before and after radiationTape3M VHB Tape 5909. Being tested at CERN 
3MHigh Temperature Acrylic Adhesive 100 (9461P)   

Peel Adhesion:

LHC-b tested up to 10N

   tested up to fluence of  6 to 8×10^(15) MeVneq/cm2Epoxy3M 9461P 
Stycast2850FT

64000 for Catalyst 9 and 23 LV

1.25 for Catalyst 9

1.02 for 23 LV

 lhcb tested up to 10 N   tested up to fluence of  6 to 8×10^(15) MeVneq/cm2 

https://lartpc-docdb.fnal.gov/0000/000059/001/stycas2850.pdf

Adhesive tested by LHCb

 
Masterbond
Supergel
9A0
         
epoxy
gel
could be used in combination with something stronger (J Matheson) 
Dow CorningSE448619k1.53120 hr @ 24C

240 psi

1.65 N/mm^2

--2.00E+14--https://www.ellsworth.com/products/by-market/consumer-products/thermally-conductive-materials/adhesives/dow-corning-se4486-cv-thermally-conductive-adhesive-white-330-ml-cartridge/ 
Dow Corning3-675110k1.1

50hr @100C

40hr @125C

10hr @150C

555 psi

3.82 N/mm^2

--7.20E+13  

"Low modulus; low viscosity; heat curable; UL94 V-0 rating "

 
Dow Corning3-675311k1.4

50hr @100C

40hr@125C

10hr @150C

540 psi

3.72 N/mm^2

--7.20E+13  

"Low modulus; low viscosity; contains 7-mil (178 micron) glass beads for bond line control "

 
Dow Corning3-665132k"good"      EncapsulantTwo-part; grey;

Low modulus; low viscoisty; good thermal conducitivity; UL 94 V-0 rating 

 
Dow Corning3-665533k"good"      Encapsulant

Low viscosity; soft; excellent thermal conductivity; UL 94 V-0 

 
AMEC ThermasolMPC 25 Thermal Insulator, Phase Change Material 4 W/mKTemperature Resistance: 4     Wax

AMEC Thermasol MPC25

Datasheet

 
AMEC ThermasolMPC 801  Temperature Resistance: 8.0     Wax  
AMEC ThermasolMPC 315  Temperature Resistance: 5.0     Elastomer  

AI

Technology

Prima-Bond:

EG7655

300000 cp

1.7 ± 10%

4 hr @85 C

2 hr @100C

1 hr @125C

30 mins @150 C

120h @ 25 C

Die Shear 2546-2795 psi

Push-off Strength >1500 psi

Lap Shear : 1000 psi

6.9 N/mm^2

skin irritant2.3 gm/cc

>1E+14

(150C/60 min)

KEK result:

Preradiation peel strength: 0.25 +- 0.15 N/mm

Post radiation: 0.35 +- 0.04 N/mm

Glue

https://www.ellsworth.com/products/by-manufacturer/ai-technology/thermally-conductive-materials/adhesives/ai-technology-prima-bond-eg7655-epoxy-paste-adhesive-2-oz-kit/

https://www.aitechnology.com/product/prima-bond-eg7655/

Datasheet

Being tested by CERN. See pg 8

 
Ellsworth AdhesivesThermally Conductive Gel Gray: SE 4445 CV Kit140001.26

45mins @ 125 C

-skin irritant2.4 gm/cc7E+15

not good enough.

KEK result:

Preradiation strength: 0.1 N/mm

Post radiation: 0.025 N/mm (cracked)

Gel (silicone based)Ellsworth AdhesivesIBL current glue (question)
Dow CorningQ3-3600 4.7k0.77

60hr @100C

30hr @150C

-- 1.00E+13  Dow CorningSE4445 
Dow CorningSE44103.5k0.9230hr @150C370--1.00E+15 Encapsulants

Two-part; low viscosity;

Heat cure; moderate thermal conductivity; UL 94 V-0 rating 

 
Dow CorningQ3-36004.7k0.77

60hr @125C

30hr @150C

NA--1.00E+13 EncapsulantsDow CorningSE4445 
Dow CorningSE4440-LP3.6k0.8330min @120CNA--1.00E+15 GelDow CorningSE4445 
Dow CorningSE4446CV22k0.95

7hr @RT

3.5hr @100C

2.5hr @125

1.9hr @150C

NA--1.00E+15 GelDow CorningSE4445 
Dow Corning Sylgard 18666.7(k)0.2125min@100C 15min@125C  15min@150C305--5.00E+15  

Sylgard® 186 Silicone Elastomer

Being tested at CERN

 
HuntsmanAraldite 201130-45k cp0.22 W/m*K @23C7-10 hrs room temp

Avg lap shear strength: 1) 17-25 MPa (metal-metal)

2) 10-20 (plastic-plastic)

Peel: 0.2 N/mm

   

tested up to fluence of  6 to 8×10^(15) MeVneq/cm2.


 

Adhesive tested by LHCb.

Also on the CERN list for testing

 
AI Technology

Prima-Bond:

EG7658

3050003.67 W/m C

4 hr @85 C

2 hr @100C

1 hr @125C

30 mins @150 C

 

Lap Shear: 1800 psi

6.9 N/mm^2

skin irritant   

KEK result:

Preradiation strength: 0.55 +- 0.05 N/mm

Post radiation: 0.4 +- 0.08 N/mm

Gluehttps://www.aitechnology.com/uploads/pdf/products/dieattach/eg7658t.pdf 
HuntsmanAraldite 2020150k cp 16 hrs @23C, 3 hrs @ 40C

Avg lap shear strength: 1) 13-25 MPa (metal-metal)

2) 2-7 (plastic-plastic)

     Being tested at cern 
3M (goes to space with NASA)Scotch-Weld Epoxy Adhesive (2216)800000.0326 W/mK

90 min @ 24 C

 

Overlap Shear: 464 E 3 psi @ 24 C

3200 N/mm^2

 

 

    Glue (epoxy)

Used by nasa for mars missions

Also used by FERMI LAT

 
             

 

List of adhesives being irradiated and tested by CERN group: https://indico.cern.ch/event/718423/contributions/3002853/attachments/1650032/2638799/20180515_MaterialQualification.pdf

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