1E+14https://www.aitechnology.com/uploads/pdf/products/dieattach/eg7658t.pdf
| Company | Product Name | Viscosity (Poise) | Thermal Conductivity w/(m-K) | Cure Time @ Temp | Strength | Toxic? | Density | Electrical resistivity ohm-cm | Radiation Hardness | Gel? | Link |
|---|---|---|---|---|---|---|---|---|---|---|---|
| Desired values | < 20 | 1 | temp ~ 22C time: ~1 day | See currently used glue: SE 4445 CV Kit | High | High | No | ||||
| AITechnology | EG7655-LV | 77.8 @ 0.5 rpm 33.4 @ 4.0 rpm 80.0 @ 24 C 30000 cp | 1.7 ± 10% | 4 hr @85 C 2 hr @100C 1 hr @125C 30 mins @150 C | Die Shear 2546-2795 psi Push-off Strength >1500 psi | skin irritant | 2.3 gm/cc | >1E+14 (150C/60 min) | |||
| AI Technology | EG 7658 | 305000 | 3.67 W/m C | 4 hr @85 C 2 hr @100C 1 hr @125C 30 mins @150 C
| skin irritant | epoxy | no | https://www.aitechnology.com/uploads/pdf/products/dieattach/eg7658t.pdf | |||
| Ellsworth Adhesives | SE 4445 CV Kit | 14 | 1.26 | 45mins @ 125 C | skin irritant | 2.4 gm/cc | 7E+15 | Yes? Silicon | Ellsworth Adhesives | ||
Polytec | TC418 | 40k-60k mPa-S | 1.6 | 48 h @ 23C | Young modulus: 40 N/mm^2 Lap shear strength: 2.9 N/mm^2 | being tested | flexible epoxy | Being tested as good options by John Matheson | |||
Epo‐Tek | T 7109‐19 | 40k-70k cPS | 1.3 | "sets harder than SE4445" | Lap Shear 1434 psi | > 5E+12 | being tested | flexible epoxy | Being tested as good options by John Matheson | ||
Masterbond Supergel 9A0 | epoxy gel | could be used in combination with something stronger (J Matheson) | |||||||||
| Thermally Conductive Adhesives | |||||||||||
| Dow Corning | SE4486 | 19 | 1.53 | 120 hr @ 24C | 200 | - | - | 2.00E+14 | - | - | Dow CorningSE4445 |
| Dow Corning | Q3-3600 | 4.7 | 0.77 | 60hr @100C 30hr @150C | - | - | 1.00E+13 | Dow CorningSE4445 | |||
| Dow Corning | 3-6751 | 10 | 1.1 | 50hr @100C 40hr @125C 10hr @150C | 555 | - | - | 7.20E+13 | Dow CorningSE4445 | ||
| Dow Corning | 3-6753 | 11 | 1.4 | 50hr @100C 40hr@125C 10hr @150C | 540 | - | - | 7.20E+13 | Dow CorningSE4445 | ||
| Thermally Conductive Encapsulants | |||||||||||
| Dow Corning | SE4410 | 3.5 | 0.92 | 30hr @150C | 370 | - | - | 1.00E+15 | Dow CorningSE4445 | ||
| Dow Corning | Q3-3600 | 4.7 | 0.77 | 60hr @125C 30hr @150C | NA | - | - | 1.00E+13 | Dow CorningSE4445 | ||
| Thermally Conductive Gels | |||||||||||
| Dow Corning | SE4440-LP | 3.6 | 0.83 | 30min @120C | NA | - | - | 1.00E+15 | Dow CorningSE4445 | ||
| Dow Corning | SE4446CV | 22 | 0.95 | 7hr @RT 3.5hr @100C 2.5hr @125 1.9hr @150C | NA | - | - | 1.00E+15 | Dow CorningSE4445 | ||