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Block diagram
Components
FPGA
The FPGA that will be used is XCKU15P-2FFVA1760E from AMD/Xilinx.
- Package mechanical drawing
- FPGA measured 3D model
- Difference between the drawing and 3D model used:
- Total height (A = A1 + A2):
- 3D model is 3.86 mm
- Drawing is 3.71 mm (max)
- Solder ball height (A1):
- 3D model is 0.6 mm
- Drawing is 0.6 mm (max)
- Package height (A2):
- 3D model is 3.26 mm
- Drawing is 3.21 mm (max)
- → It seems that the 3D model of the package we have is not 100% accurate, but the difference (3.86-3.71=0.15 mm) is negligible
- Any thermal interface between the package and the cooling block should be able to "absorb" this difference