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Ring Loading Tooling

Ring Loading Tooling Drawings: 19-1 Ring.zip

  • In the future, use drawing release process to reduce risk of interface issues.

Stave Loading Tooling

Stave Loading Tooling in progress...

Summary of requirements for loading 19-1 Outer Barrel Stave:

  • Load RD53a Quad modules (drawings: 150um, 400um) with connectors oriented as shown in picture above
  • Load modules onto 19-1 OB Stave (no drawing yet, preliminary CAD on LBL Windchill site)
  • Load without collisions: 200um nominal gap / 100 micron minimum gap between modules (no assembly drawing yet showing modules on stave)
  • Glue layer thickness to be 100um -50/+100um
  • ESD protection during loading: grounding of tooling
  • Mechanical protection of wire bonds during loading: stay clear of wire bonds, handle modules using tooling only, consider covers/shields
  • Baseplate to be installed onto glue robot: weight limit 7kg (per manual)
  • Stave to be removed from baseplate and transferred to test box for QC testing

Summary of different requirements for loading 19-1 Inner Barrel Stave:

  • Load Triplet modules (drawing, .step)
  • Load onto 19-1 IB Stave (no drawing yet, preliminary CAD on LBL Windchill site)
  • Load without collisions: 200um nominal gap / 100 micron minimum gap between modules (no assembly drawing yet showing modules on stave)

Summary of specifications:

  • Closely toleranced pins/bushings – same approach as used for 19-0 tooling
    • Requirement: +/-75um module position tolerance in local support coordinate system (per requirements document "ITk Pixel Module Loading Accuracy Requirements" AT2-IP-ES-006-v3)
    • Distribute tolerances:
      • +/-50um module position relative to loading tooling baseplate coordinate system (to avoid collisions with 100um gap between modules)
      • +/-25um local support position relative to loading tooling baseplate coordinate system (to accurately place modules to meet +/-75um requirement)
  • Glue with beads to control glue layer thickness
    • 100um dia beads, for ~75um glue layer thickness on carbon fiber.
    • Loading tooling does NOT control the glue layer thickness.
      • Loading bridge to rest on the module's pickup areas (vacuum pad locations) during (~10 minute) hold for gluing.
      • Loading bridge to have micrometer adjusters to level the tool relative to the baseplate to +/-12um.
      • Loading bridge to have micrometer adjusters to level the tool relative to the pickup table to +/-12um.
  • Vacuum pads to pick up modules
    • Vacuum pads to fit within clear areas on modules.
    • Height adjustment of vacuum pads while on pickup table.
    • Vacuum to securely hold modules.

Notes for design of 19-1 Stave tooling:

  • Re-use tooling from 19-1 Quad loading bridge; make new 19-1 linear Triplet loading bridge and tooling.
  • Using beads to set glue thickness; no longer need dial indicators or differential adjusters.
  • Use 2 sets of micrometer adjusters (absolute scale).
  • Add soft material to vacuum pads for better sealing and smoothness.
  • Consider adding a hole patterns for trussing / support below the 19-1 Stave baseplate.
  • Reconfirm that Stave and Module CADs / drawings are compatible with tooling, before manufacture.
  • Use dowel pins and screw interface to ends of Stave (locate same as in production assembly).
  • Consider longer dowel pins in the baseplate (help locate the bridge, without pivoting).


Some past presentations:



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