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Excerpt

Sensor #

Received

Tested

V dep (V) CNM

V dep (V) UCSC

V break (V) CNM

V break (V) UCSC

Pinholes Sector A

Pinholes Sector B

Glued to Hybrid

Current Location

Notes

W07-S202/27/2019UCSC30 6080   SLACGP2
W07-S302/27/2019UCSC23 380130  L0M02 UCSCGP2
W07-S502/27/2019UCSC30 420170   SLACGP2
W07-S602/27/2019UCSC23 150100   SLACGP2
W09-S202/27/2019UCSC23 240180   SLACGP2
W09-S2S502/27/2019UCSC23 120120  L0M01 UCSCGP2
W02-S102/27/2019

UCSC Baked

20 5040   UCSCGP1, Displaced in Gelpack, baked at 170 C for 23 h
W02-S402/27/2019UCSC Baked23 15050   UCSCGP1, Displaced in Gelpack, baked at 170 C for 23 h
W03-S602/27/2019UCSC Baked18 28060   UCSCGP1, Displaced in Gelpack, baked at 170 C for 23 h
W04-S302/27/2019UCSC25 350370   UCSCGP1, In Gelpack with displaced chips
W04-S602/27/2019UCSC18 480420   UCSCGP1, In Gelpack with displaced chips
W07-S102/27/2019

UCSC

Baked

23 >50050   UCSCGP1, In Gelpack with displaced chips, baked at 170 C for 23 h
W01-S601/15/2019    large37, 41, 103, 171, 191, 195, 199, 203, 239, 2411, 73, 12, 16, 212 UCSCthe non-slim long edge is cut to ~550 um. No nitride. IV is irregular, but under 10 uA at 350 V.