| Company | Product Name | Viscosity (centipoise) Water: 1cp | Thermal Conductivity w/(m-K) | Cure Time @ Temp | Strength (psi & N/mm^2) | Working Hours | Density | Electrical resistivity ohm-cm | Radiation Hardness | Type? | Link/Notes | ||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Desired values | < 2000020 000 | 1 | temp ~ 22C time: ~1 day | See currently used glue: SE 4445 CV Kit | High | "10 MGy" for For 2000 fb-1: 1.3E16 neq/cm2 and 1Grad1GRad = 10 MGy | Glue (epoxy), Gel, or Tape | ||||||||||||||||||
| Candidate Glues | |||||||||||||||||||||||||
AI Technology | Prima-Bond: EG7655-LV1 | 300000 70000 cp | 1.7 ± 10% | 4 hr @85 C | LapShear > 800 psi | "reworkable at 80-100 C" | 1E+14 | CERN test: prerad: 340 psi | Flexible epoxy adhesive | EG7655-LV also exists. It has viscosity 80k cp We will ask if we can have the glue without the dopant loading. | |||||||||||||||
AI Tech | ME7638-RC | 10k cp | Die Shear 2546-2795 psi Push-off Strength >1500 psi Lap Shear : 1000 psi 6.9 N/mm^2 | skin irritant | 2.3 gm/cc | >1E+14 (150C/60 min) | KEK result: Preradiation peel strength: 0.25 +- 0.15 N/mm Post radiation: 0.35 +- 0.04 N/mm | 3 | 1E+14 | ||||||||||||||||
AI Tech | CGR 7015 | 2 | 1E+14 | Cool-Grease | |||||||||||||||||||||
AI Tech | CoolBond CP7138 | 4 | 1E+14 | Tape | Tape: Tack free dry film Preforms 3-12 mils (thick) | ||||||||||||||||||||
AI Tech | TackFilmRTK7659 | 11.4 | |||||||||||||||||||||||
AI Tech | Tack Film 7755 | 1.7 | |||||||||||||||||||||||
AI Tech | TP 7209 | 1.4 | "good" | thermal plastic film | |||||||||||||||||||||
AI Tech | TP 8205 | 5.7 | "good" | thermal plastic film | |||||||||||||||||||||
Polytec | TC418 | 40k-60k | 1.6 | 48 h @ 23C | Young mod: 40 N/mm^2 Lap shear: 2.9 N/mm^2 | Tested at cern: before radiation: peel strength 350, after 325 psi | Glue/ Epoxy (flexible) | Being tested as good options by John Matheson. Also listed here: | |||||||||||||||||
| Polytec | TC 423 | 45k | 3 | 1E+14 | Glass transition temp 64C | ||||||||||||||||||||
| Epo‐Tek | T7110 | 1.4K-2k | 1 | ≥ 2 E13 |
| epoxy | RT cure. Suggested by EpoTec | ||||||||||||||||||
| Epo‐Tek | 921-FL new | 9-15k | 1.1 | >6E13 | Smooth flowing paste | Suggested by EpoTec. Curing: 100°C / 20 Minutes | |||||||||||||||||||
| Dow Corning | 3-6751 | 10k | 1.1 | 50hr @100C 40hr @125C 10hr @150C | 555 psi 3.82 N/mm^2 | - | - | 7.20E+13 | "Low modulus; low viscosity; heat curable; UL94 V-0 rating " | Gluemanufacturer | ai | technology | ai | technology | prima | bond | eg7655 | epoxy | paste | adhesive | 2-oz | ||||
AI Technology | Prima-Bond: EG7655-LV1 | 70000 cp | 1.7 ± 10% | 4 hr @85 C | LapShear > 800 psi | >1E+14 |
| Flexible epoxy adhesive | |||||||||||||||||
| AI Technology | Prima-Bond: EG7658 | 305000 | 3.67 W/m C | 4 hr @85 C 2 hr @100C 1 hr @125C 30 mins @150 C
| Lap Shear: 1800 psi 6.9 N/mm^2 | skin irritant | KEK result: Preradiation strength: 0.55 +- 0.05 N/mm Post radiation: 0.4 +- 0.08 N/mm | Glue | https://www.aitechnology.com/uploads/pdf/products/dieattach/eg7658t.pdf | ||||||||||||||||
| Dow Corning | 3-6753 | 11k | 1.4 | 50hr @100C 40hr@125C 10hr @150C | 540 psi 3.72 N/mm^2 | - | - | 7.20E+13 | "Low modulus; low viscosity; contains 7-mil (178 micron) glass beads for bond line control " | ||||||||||||||||
| Dow Corning | 3-6651 | 32k | "good" | Encapsulant | Two-part; grey; Low modulus; low viscoisty; good thermal conducitivity; UL 94 V-0 rating | ||||||||||||||||||||
| Dow Corning | 3-6655 | 33k | "good" | Encapsulant | Low viscosity; soft; excellent thermal conductivity; UL 94 V-0 | ||||||||||||||||||||
Dow Corning | Ellsworth Adhesives | Thermally Conductive Gel Gray: SE 4445 CV Kit | 14000 | 1.26 | 45mins @ 125 C | - | skin irritant | 2.4 gm/cc | 7E+15 | not good enough.conflicting results KEK result: Preradiation strength: 0.1 N/mm Post radiation: 0.025 N/mm (cracked) | Gel (silicone based) | IBL current glue | |||||||||||||
 | PolytecTC418 | 40k-60k | 1.6 | 48 h @ 23C | being tested | Glue/ Epoxy (flexible) | Being tested as good options by John Matheson. Also listed here: | ||||||||||||||||||
| Ruled out: (reason for being ruled out is in Red) | |||||||||||||||||||||||||
Epo‐Tek | T 7109‐19 | 40k-70k | 1.3 | "sets harder than SE4445" | Lap Shear 1434 psi | > 5E+12 | being testedCern peel strength tested: before rad: 1400 psi, after: 600 psi | Epoxy (flexible) | Being tested as good options by John Matheson | ||||||||||||||||
| Stycast | 2850FT | 64000 for Catalyst 9 and 23 LV | 1.25 for Catalyst 9 1.02 for 23 LV | lhcb tested up to 10 N | tested up to fluence of 6 to 8×10^(15) MeVneq/cm2 | https://lartpc-docdb.fnal.gov/0000/000059/001/stycas2850.pdf Adhesive tested by LHCb | |||||||||||||||||||
Masterbond Supergel 9A0 | epoxy gel | could be used in combination with something stronger (J Matheson) | |||||||||||||||||||||||
| Dow Corning | SE4486 | 19k | 1.53 | 120 hr @ 24C | 240 psi 1.65 N/mm^2 | - | - | 2.00E+14 | - | - | https://www.ellsworth.com/products/by-market/consumer-products/thermally-conductive-materials/adhesives/dow-corning-se4486-cv-thermally-conductive-adhesive-white-330-ml-cartridge/ | ||||||||||||||
AI Dow CorningTechnology | Q3-3600 | 4.7k | 0.77 | 60hr @100C 30hr @150C | - | - | 1.00E+13 | Dow CorningSE4445 | |||||||||||||||||
| Dow Corning | 3-6751 | 10k | 1.1 | 50hr @100C 40hr @125C 10hr @150C | 555 psi 3.82 N/mm^2 | - | - | 7.20E+13 | "Low modulus; low viscosity; heat curable; UL94 V-0 rating " | ||||||||||||||||
Prima-Bond: EG7655 | 300000 cp | 1.7 ± 10% | 4 hr @85 C 2 hr @100C 1 hr @125C 30 mins @150 C 120h @ 25 C | Die Shear 2546-2795 psi Push-off Strength >1500 psi Lap Shear : 1000 psi 6.9 N/mm^2 | skin irritant | 2.3 gm/cc | >1E+14 (150C/60 min) | KEK result: Preradiation peel strength: 0.25 +- 0.15 N/mm Post radiation: 0.35 +- 0.04 N/mm | Glue | ||||||||||||||||
| Dow Corning | Q3-3600 | 4.7k | 0.77 | 60hr @100C 30hr @150C | - | - | 1.00E+13 | Dow CorningSE4445 | Dow Corning | 3-6753 | 11k | 1.4 | 50hr @100C 40hr@125C 10hr @150C | 540 psi 3.72 N/mm^2 | - | - | 7.20E+13 | "Low modulus; low viscosity; contains 7-mil (178 micron) glass beads for bond line control " | |||||||
| Dow Corning | SE4410 | 3.5k | 0.92 | 30hr @150C | 370 | - | - | 1.00E+15 | Encapsulants | Two-part; low viscosity; Heat cure; moderate thermal conductivity; UL 94 V-0 rating | |||||||||||||||
| Dow Corning | Q3-3600 | 4.7k | 0.77 | 60hr @125C 30hr @150C | NA | - | - | 1.00E+13 | EncapsulantsDow CorningSE4445 | ||||||||||||||||
| Dow Corning | 3-6651 | 32k | Encapsulant | Two-part; grey; Low modulus; low viscoisty; good thermal conducitivity; UL 94 V-0 rating | |||||||||||||||||||||
| Dow Corning | 3-6655 | 33k | Encapsulant | Low viscosity; soft; excellent thermal conductivity; UL 94 V-0 | |||||||||||||||||||||
| Dow Corning | SE4440-LP | 3.6k | 0.83 | 30min @120C | NA | - | - | 1.00E+15 | GelDow CorningSE4445 | ||||||||||||||||
| Dow Corning | SE4446CV | 22k | 0.95 | 7hr @RT 3.5hr @100C 2.5hr @125 1.9hr @150C | NA | - | - | 1.00E+15 | GelDow CorningSE4445 | ||||||||||||||||
| Dow Corning | Sylgard 186 | 66.7(k) | 0.21 | 25min@100C 15min@125C 15min@150C | 305 | - | - | 5.00E+15 | Sylgard® 186 Silicone Elastomer Being tested at CERN | ||||||||||||||||
| Stycast | 2850FT | 64000 for Catalyst 9 and 23 LV | 1.25 for Catalyst 9 1.02 for 23 LV | lhcb tested up to 10 N | tested up to fluence of 6 to 8×10^(15) MeVneq/cm2 | https://lartpc-docdb.fnal.gov/0000/000059/001/stycas2850.pdf Adhesive tested by LHCb | |||||||||||||||||||
| Huntsman | Araldite 2011 | 30-45k cp | 0.22 W/m*K @23C | 7-10 hrs room temp | Avg lap shear strength: 1) 17-25 MPa (metal-metal) 2) 10-20 (plastic-plastic) Peel: 0.2 N/mm | tested up to fluence of 6 to 8×10^(15) MeVneq/cm2. | Adhesive tested by LHCb. Also on the CERN list for testing | ||||||||||||||||||
| AI Technology | Prima-Bond: EG7658 | 305000 | 3.67 W/m C | 4 hr @85 C 2 hr @100C 1 hr @125C 30 mins @150 C
| Lap Shear: 1800 psi 6.9 N/mm^2 | skin irritant | KEK result: Preradiation strength: 0.55 +- 0.05 N/mm Post radiation: 0.4 +- 0.08 N/mm | Glue | https://www.aitechnology.com/uploads/pdf/products/dieattach/eg7658t.pdf | ||||||||||||||||
| Huntsman | Araldite 2020 | 150k cp | 16 hrs @23C, 3 hrs @ 40C | Avg lap shear strength: 1) 13-25 MPa (metal-metal) 2) 2-7 (plastic-plastic) | Being tested at cern | ||||||||||||||||||||
| 3M (goes to space with NASA) | Scotch-Weld Epoxy Adhesive (2216) | 80000 | 0.0326 W/mK | 90 min @ 24 C
| Overlap Shear: 464 E 3 psi @ 24 C 3200 N/mm^2
| Glue (epoxy) | Used by nasa for mars missions Also used by FERMI LAT | ||||||||||||||||||
| 3M | VHB Tape 5909 | - | Temperature Resistance: Short Term: 121 C Long Term : 82 C | Peel Adhesion: N/100mm | 720 kg/m3 | Tape | 3M VHB Tape 5909. Being tested at CERN | ||||||||||||||||||
| 3M | High Temperature Acrylic Adhesive 100 (9461P) | Peel Adhesion: LHC-b tested up to 10N | tested up to fluence of 6 to 8×10^(15) MeVneq/cm2 | Epoxy | 3M 9461P | ||||||||||||||||||||
| AMEC Thermasol | MPC 25 Thermal Insulator, Phase Change Material | 4 W/mK | Temperature Resistance: 4 | Wax | |||||||||||||||||||||
| AMEC Thermasol | MPC 801 | Temperature Resistance: 8.0 | Wax | ||||||||||||||||||||||
| AMEC Thermasol | MPC 315 | Temperature Resistance: 5.0 | Elastomer | ||||||||||||||||||||||
| 3M | High Temperature Acrylic Adhesive 100 (9461P) | 0.18 | Peel Adhesion: LHC-b tested up to 10N | tested by LHCb up to fluence of 6 to 8×10^(15) MeVneq/cm2 | Epoxy | Adhesive tested by LHCb | |||||||||||||||||||
| 3M | VHB Tape 5909 | - | bad. 0.08 | Temperature Resistance: Short Term: 121 C Long Term : 82 C 72 hr to set | Peel Adhesion: N/100mm | 720 kg/m3 | tested at cern: 60 psi before and after radiation | Tape | 3M VHB Tape 5909. Being tested at CERN | ||||||||||||||||
| SE 4445 | |||||||||||||||||||||||||
List of adhesives being irradiated and tested by CERN group: https://indico.cern.ch/event/718423/contributions/3002853/attachments/1650032/2638799/20180515_MaterialQualification.pdf
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