HE project related information

• LCLS-II HE Instrument Workshop: FEH 05/7/2024
• FDR preparation

Mechanical design

• Assembly
  • http://tcprod01:8080/tc/launchapp?-attach=true&-s=226TCSession&-o=RyqVUGKU4OV8rAAAAAAAAAAAAAA&servername=SLAC+Production+Environment
• ADD screen shots with key model views
  • https://slac-my.sharepoint.com/:p:/g/personal/ddoering_slac_stanford_edu/ESxfBhZQggtNvkejnoYtD7ABE4Rq_67aG8CWIRZB4tOuEA?e=ecbIIG

Assembly procedure

General	ASIC carrier module assembly	Readout module assembly	1M assembly	4M assembly
PowerPoint storyboard (work-in-progress as of 2024-05-02): LCLS-II HE Instrument - 1_4_16MPix Detector-StoryBoard.pptx Bill of materials Custom tools These are tools developed during the design to enable insertion and extraction of the 1MPix to/from 4MPix 3x2 carrier modules readout boards

Assembly procedure steps

• Assemble 1MPix focal plane
• Insert 1MPix focal plane into the 4Mpix cradle

Toy model for inserting 1M module into the 4M crate

Sensor design

Due to asymmetry in the ASICs, the edges of the top row do not align exactly with the edges of the bottom row. The top row is shifted horizontally by 1.35 µm relative to the bottom row. The ASICs are spaced 19485 µm apart horizontally.

• x offset: 1166.695 µm
• y offset: 502.135 µm

• x distance: 178.74 µm

• x offset: 1168.045 µm
• y offset: 502.135 µm

• x offset: 178.74 µm
• y offset: 179.87 µm

• x offset: 1168.045 µm
• y offset: 502.135 µm

• x offset: 1165.695 µm
• y offset: 502.135 µm

Convert GDS to DXF:

• Download Klayout: https://www.klayout.de/
• Open the GDS
• Save it as DXF

Sensors for ASIC and systems characterization

There is a strong need to have sensors capable of detecting visible light during the characterization phase of the detector. This capability enables the use on lab, low power, LASER that can reproduce the fast timing and large charges that will be experienced during beam time use. X-ray sensor do have metallization in the entrance window to block visible light therefore existing sensor are not suitable

Solutions proposed 

• Design mast on the 1x1 sensor in the production run
  • It will take more than a year to have them and adds a step in the process, which adds risks to the production run
  • Etch the metal away. Can be done in individual and prototype sensor (5x5mm)
    • Only sensor for characterization would go through this step
    • Can be done in existing sensor (have them available within a month)
    • In the past we had issues removing the metal and CK's team will investigate this since it is believe this can be consistently done
  • Decision is to make production runs with full metallization and process the sensors in house for characterization

Link to mechanical models: Dxf with the design

Electronics design for 3x2 sensor module

Thermal Design

1M Sensor Module Thermal Analysis by Component

1M Prototype

• Determine the effectiveness of the thermal plate in drawing heat away from a heat source

• Check cooling lines effectiveness

• PowerPoint Overview: 1MPPrototypeThermocoupleMeasurements.pptx

• CAD:  1MPTile

Set-Up & Enclosure

Components

• 4-piece foam box enclosure (see 4MP Cam Thermal testing.pptx for more info)
• 1MP Assembly Tool
• LabJack T7 with CB37 Terminal Board (see LabJackT7SetUp.ipynb to use LabJack over USB)
• Variable Power Supply
• Chiller w/coolant & tubing
• 14x Type K Thermocouples

3x2 Detector Sensor Module

Readout Board

Sensor design

The measurements below is based on the sensor design found in UHR_3x2_aug2024_overlay.GDS (restricted). The full sensor wafer can be found in 2024-09-11-compiled_mask_UHR_2024_ro_v5.gds (restricted).

Sensors for ASIC and systems characterization

There is a strong need to have sensors capable of detecting visible light during the characterization phase of the detector. This capability enables the use on lab, low power, LASER that can reproduce the fast timing and large charges that will be experienced during beam time use. X-ray sensor do have metallization in the entrance window to block visible light therefore existing sensor are not suitable

Solutions proposed 

• Design mast on the 1x1 sensor in the production run
  • It will take more than a year to have them and adds a step in the process, which adds risks to the production run
  • Etch the metal away. Can be done in individual and prototype sensor (5x5mm)
    • Only sensor for characterization would go through this step
    • Can be done in existing sensor (have them available within a month)
    • In the past we had issues removing the metal and CK's team will investigate this since it is believe this can be consistently done
  • Decision is to make production runs with full metallization and process the sensors in house for characterization

Link to mechanical models: Dxf with the design

Electronics design for 3x2 sensor module

The electronics for the 3x2 sensor module is split into two parts; the ASIC carrier (left in the block diagram below) and the readout board (right in the block diagram). They are electrically connected together through a right-angle connector from the Samtec SEARAY connector family, which provides a total of 500 pins for signals and power. The ASIC carrier contains the 3x2 ASICs together with the 3x2 sensor and minimal amount of other components in order to reduce the size and therefore increase the sensitive area of the detector focal plane (the are which is covered by a sensitive sensor). All the active circuitry for interfacing and powering the ASICs is located on the readout board as well as the components for optical communication with the external back-end system.

More details about the electronics design for the 3x2 module can be found on a dedicated page: 3x2 Readout Overview

NOTE: If some of the images above are indicated as missing, please ensure that you are logged into Confluence and have access to the Board tracking pages where the images are stored.

Power

The system is designed to operate at 48 V nominally. There are separate supply connections for analog (APWR/AGND) and digital (DPWR/DGND) that are feeding different parts of the readout electronics, which can be used to have a low noise analog supply and a high-efficiency digital supply for example.

Expected power consumption

The expected power for one 3x2 Readout Board with a Carrier Board attached to it is shown in 3x2 Readout Overview#3x2ReadoutOverview-Power and is extrapolated here for the 1M assembly and the 4M camera.

NOTE: This does not include the power drop in the cables, which will depend on the cable lengths in each application. See Resistance,voltagedrop,powerlossandweight below for example values.

Power distribution

The power distribution diagram below shows how the power is distributed for a 1M assembly with all the boards and cables detailed as well as the expected power consumption values from above. More details of the different connectors, cables and parts is shown in the sections below.

ePixUHR35kfps 1M Power Breakout Board

The 1M Power Breakout Board distributes the power to six 3x2 Readout Boards. It has two externally facing square Harting connectors, one for all the power and one for optional signals. Each power channel is individually fused with a socketed fuse to protect against catastrophic failures. Changing a fuse requires removal of the board from the 1M assembly, which has been done intentionally since blowing a fuse indicates something internal to the 1M assembly has gone wrong and requires expert investigation. The thermistor connections can be selected on the board through switches to which of the six 3x2 Readout Boards they connect to. Only one thermistor shall be connected per thermistor channel.

Board specific details

• See 

  Jira
  showSummary false server SLAC National Accelerator Laboratory serverId 1b8dc293-975d-3f2d-b988-18fd9aec1546 key TIDIDECS-81

  for more details on the development of this board.
• The "Top" side of the board is facing the outside of the camera.
• The "Bottom" side of the board is facing the inside of the camera and connects to the six 3x2 readout boards through the TFM connectors.

Connectors and parts

Internal facing Samtec connector and cable assembly

Between the Power Breakout Board and the 3x2 Readout Boards there are cable assemblies that interface with Samtec TFM surface mount connectors on both sides that interface with Samtec ISDF cable mounted housings. Samtec also provides wire cable assemblies with the ISDF called SFSDT, which is what is being used here to reduce the amount of manual labour needed. See

External facing Harting connectors and parts

The two square Harting connectors on the Power Breakout Board above is separated into one for power and one for signal. They have different gender to avoid wrong connections. The power connector have a "protected" female connector on the cable side where voltages may be exposed on the pins. The tables below lists the components that are needed to assembly a full connector stack for the power and signal.

Optional parts

Some optional parts that might be useful in some cases.

Tools

The pins that attach to the wires on the cable are crimped and required a specific tool for it listed below. A pin removal/extraction tool could also be useful in case a pin was inserted into the wrong slot.

Power cable

There will be one power cable connecting to the Power connector J1 on the ePixUHR35kfps 1M Power Breakout Board that is routed to external power supplies at the installed location. The choice of cable is motivated and discussed in

The cable is an igus CF9-05-12, which is a 12-conductor 0.5mm² cable that is designed for heavy duty applications where the cable will be flexed in various direction, e.g. on a robotic arm. The outer jacket is made from TPE and the cable is specified to be halogen-free, PVC-free and Silicone-free. Some other important technical data about the cable:

• Datasheet
• Number of conductors: 12 x 20 AWG (0.5mm²)
• Stranded conductors of bare copper wires

• Cores color coded in accordance with DIN 47100

• Outer jacket colored dark blue (similar to RAL 5011)

• A tear strip is moulded into the outer jacket (CFRIP)
• Outer diameter: 0.39 in (10 mm)
• Weight: 123 kg/km
• Min. bend radius, fixed: 1.18 in (30 mm)
• Min. bend radius, flexible: 1.57 in (40 mm)
• Nominal Voltage: 300/500V
• DigiKey: 4849-CF9-05-12-DS-ND

We assume a cable length of 50 ft (15.24 m) for now to give some headroom for the installation.

Resistance, voltage drop, power loss and weight

The voltage drop over the cable depends on the length and the current passing through the conductors. The 3x2 Readout Overview power map shows that the highest current is for the digital supply that requires 0.95 A when running at 48 V. For a 1M assembly this means a total current of 6*0.95 = 5.7 A and there are two conductors in the Power connector J1 for each supply that share the current. With this information, we can calculate the expected resistance of the conductors in the cable:

Sleeve for robotic arm

A flexible sleeve is used to guide the power cables and fiber optic cables for an application where the camera will be mounted on a robotic arm. A Triflex TRE sleeve from igus will be used and more details are available here. There are several sizes available and some of them are shown below as profiles with four gray power cables and four purple fiber optic cables (see below) placed inside for demonstration purposes. The cables are inserted into the sleeve through the slots at the top and bottom as shown below and there are tools available to ease with this.

Lab cable diagram

For testing in the lab a cable is made with the Harting power connector on one end and Ponoma 1825 banana connectors on the other end for easy connection to lab equipment.

Power supplies

TODO, see

Fiber

The fiber block diagram below shows the connections for 2x 1M assemblies that are connected to 3x Multi Mode to Single Mode Conversion Box. For the full 4M camera this is repeated twice. See 

Fiber channel assignment

TODO: need to double-check this with fibers in the lab.

Transceiver fiber pigtail

A fiber pigtail is needed for the Leap transceiver with a female MT ferrule on one end and a male MTP-24 connector on the other end. A simplified diagram below shows how the pigtail should look like. The exposed fibers on the left between he MT ferrule and the heat shrink are kept as short as possible to reduce the risk of breakage. See 

The electronics for the 3x2 sensor module is split into two parts; the ASIC carrier (left in the block diagram below) and the readout board (right in the block diagram). They are electrically connected together through a right-angle connector from the Samtec SEARAY connector family, which provides a total of 500 pins for signals and power. The ASIC carrier contains the 3x2 ASICs together with the 3x2 sensor and minimal amount of other components in order to reduce the size and therefore increase the sensitive area of the detector focal plane (the are which is covered by a sensitive sensor). All the active circuitry for interfacing and powering the ASICs is located on the readout board as well as the components for optical communication with the external back-end system.

More details about the electronics design for the 3x2 module can be found on a dedicated page: 3x2 Readout Overview

https://stanford-linear-accelerator-center.365.altium.com/designs/AA37FBEE-48A8-4801-968D-F2C18F098256

https://stanford-linear-accelerator-center.365.altium.com/designs/8A58F5D8-B190-4E81-9967-A7C97BA5BAD8

N/A

PC_261_101_43_C00

NOTE: If some of the images above are indicated as missing, please ensure that you are logged into Confluence and have access to the Board tracking pages where the images are stored.

Board-to-board connector

SAMTEC SEAF8/SEAM8 series connector will be used with 10x40=400 pins in one connector.

Photo of sample
(50 column version)

50 column

50 column with guide posts

Propagation delay

Propagation delays, cells with yellow color have been interpolated from the data in the report.

Row

Power

Power supplies

TODO, see

1M Power Breakout Board

ASIC

The ePixUHR 100 kHz ASIC is used in this project. The main properties are:

• 192 (H) x 168 (V) pixels
• 100 um x 100 um pixel size
• 8 serial data outputs operating at up to ~6 Gbit/s

Resources:

• Confluence page (restricted)
• Glue used to bond the ASIC+SENSOR to the carrier board
  • SP-120 silicone primer: https://nusil.avantorsciences.com/nusil/en/product/SP-120/silicone-primer
  • CV-2943 thermally conductive, controlled volatility RTV silicone: https://nusil.avantorsciences.com/nusil/en/product/CV-2943/thermally-conductive-controlled-volatility-rtv-silicone

ASIC

The ePixUHR 100 kHz ASIC is used in this project. The main properties are:

• 192 (H) x 168 (V) pixels
• 100 um x 100 um pixel size
• 8 serial data outputs operating at up to ~6 Gbit/s

Resources:

• Confluence page (restricted)

Size and measurements

These measurements are taken from a GDS file (ePixUHR_100kHz_4Julie.gds UHR_3x2_aug2024_overlay.GDS (restricted) that was opened in KLayout.

Expand
title Click here to expand for Altium footprint...
A footprint has been created in Altium Designer for the ASIC. The sizes and measurements listed above have been used and rounded to the nearest µm. NOTE: This needs to the nearest µmbe updated to match the latest footprint. Image RemovedImage Removed Full matrix Lower left corner Lower right corner Image Image Modified Image Added Image Added Measurements Width (x): 19306 µm Height (y): 18674 µm Pad Width (x): 60 µm Height (y): 120 µm First pad location relative to lower-left corner x: 573 µm y: 45 µm Last pad location relative to lower-right corner x: 473 µm y: 45 µm Pitch: 100 µm

Block diagrams of camera configurations

The block diagrams have been created with Draw.io instead of the Gliffy integration in Confluence, which has major issue as soon as there are more than 100 items in the diagram it seems. It slows down the whole confluence page and it's near impossible to edit the diagram. There are also major limitations in the tools available in Gliffy, e.g. there doesn't seem to be a way to draw an arbitrary polygon or parallelograms.

• 1M-camera-diagram.drawio
• 4M-camera-diagram-1.drawio
• 4M-camera-diagram-2.drawio
• 16M-camera-diagram.drawio

Project Management

• Smartsheet
• PM Internal discussions

the diagram. There are also major limitations in the tools available in Gliffy, e.g. there doesn't seem to be a way to draw an arbitrary polygon or parallelograms.

• 1M-camera-diagram.drawio
• 4M-camera-diagram-1.drawio
• 4M-camera-diagram-2.drawio
• 16M-camera-diagram.drawio

Project Management

• Smartsheet
• PM Internal discussions
• LCLS-II-HE XES Detectors ePixHR10k PDR: https://indico.slac.stanford.edu/event/8884/

Reference documents from HE project

• Draft 

  Reference documents from HE project

  • Draft 
    • https://slac.sharepoint.com/:w:/r/sites/lcls/lcls-2-he/wd/PRD/LCLSII-HE-1.4-PR-0222.docx?d=w4eaaaca4a4774d7c9edee213070d7b51&csf=1&web=1&e=s1DVbb
    • https://slac.sharepoint.com/:w:/r/sites/lcls/lcls-2-he/wd/ESD/LCLSII-HE-1.4-ES-1144.docx?d=w43d160d640204029b55ec6cdb5ed74b9&csf=1&web=1&e=Y2FrcG
    • https://slac.sharepoint.com/:w:/r/sites/lcls/lcls-2-he/wd/FRS/LCLSII-HE-1.4-FRPR-11430222.docx?d=wd4f6f8b883b1463bae1eb198115994a0&csf=1&web=1&e=iX1UwD
    • LCLSII-HE-1.4-ES-1144.docx
    • https://slac.sharepoint.com/:w:/r/sites/lcls/lcls-2-he/wd/ICD/LCLSII-HE-1.4-ICFR-04991143.docx?d=w3073ea2890864e41a72ddd0b782baacc&csf=1&web=1&e=tUZam8
    • LCLSII-HE-1.4-IC-0499.docx
    • https://slac.sharepoint.com/:w:/r/sites/lcls/lcls-2-he/wd/ICD/LCLSII-HE-1.4-IR-0879.docx?d=we5d9be1626e849549e24b797f6dd8b23&csf=1&web=1&e=blzNG6
    • LCLSII-HE-1.4-IR-0880.docx
    • https://slac.sharepoint.com/:w:/r/sites/lcls/lcls-2-he/wd/ICD/LCLSII-HE-1.4-IR-08800881.docx?d=wb5875862dc0c4692aec36b61a37a4941&csf=1&web=1&e=nNlFBB
  • Released
    • LCLSII-HE-1.4-IR-0875.pdf
    • LCLSII-HE-1.4-PR-0220.pdf
    • LCLSII-HE-1.4-PR-0279.pdf
    • LCLSII-HE-1.4-PR-0280.pdf
    • LCLSII-HE-1.4-IC-0688.pdf
    • LCLSII-HE-1.4-IR-0875.pdf

Jira tasks for the project