SLAC/EPP/HPS Public Jefferson Lab/Hall B/HPS Run Wiki S30XL-LESA/LDMX
changes.mady.by.user Tim Nelson
Saved on Mar 19, 2012
Half-module #
Contains hybrid
Contains sensor
Hybrid glued
Sensor glued
Sent to UCSC
HV wirebonded
Signals wirebonded
QA tested
Results
Sent to SLAC
Mounted to cooling block
Part of module
Notes
Half-module 0 - THE GIMP
Hybrid 0
Sensor 1803
to fixture
lousy
with a prayer
mashed bonds
painfully
? test 1
4 chips bonded, and 4 are alive. 3 of them are both bonded and alive.
?
never
Module ?
Half-module 1
Hybrid 1
Sensor 568
2/23/12(TKN)
2/23/12(AG)
2/27/12(FM)
2/29/12(FM)
OK
3/12/12(TKN)
READY
Half-module 2
Hybrid 0t
Sensor 150
3/1/12(TKN)
3/1/12(OM)
3/2/12(FM)
3/6/12(FM)
3/14/12(PH)
Half-module 3
Hybrid 1t
Sensor 132
3/10/12(TKN)
3/12/12(FM)
3/13/12(FM)
3/14/12 (OM, VF) test 1
High noise? (To retest)
Needs ITT connector
Half-module 4
Hybrid 2t
Sensor 134
3/14/12(FM)
3/16/12 (TC, VF) test 1
Channels 317, 319 have low gain and timing anomalies, rest is OK.
3/18/12 (VF)
Solder pad ripped (dgnd), need re-work!
Half-module 5
Hybrid 3t
Sensor 136
Half-module 6
Hybrid 07t
Sensor 138
3/18/12(TKN)
3/18/12(TKN) ?
3/19/12(TKN/VF)
Half-module 7
Hybrid 10t
Sensor 140
Half-module 8
Hybrid 11t
Sensor 141
To add a half-module, copy the line below into the table and fill in the ?s.
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