To do list:
Item# | Name | Description | Power(W)/card | Cost($)/card | Note: |
---|---|---|---|---|---|
1 | FPGA | XCKU040-2FFVA1156E | 15 | 885 | Based on the LCLS-II production discount from Avnet.com |
2 | DDR4 | 16GB SODIMM, MTA16ATF2G64HZ-2G3 | 2.1 | 191 | Based on www.memory4less.com, power estimated using Micron DDR4 power calculator |
3 | SSD | SSD 960 EVO NVMe M.2 250GB | 5 | 130 | Based on www.samsung.com |
4 | Optics | WIB QSFP and Timing SFP | 2.4 | 100 | Based on fs.com QSFP-SR4-40G transceivers @ 10GbE |
5 | Misc. | Misc components | 3 | 250 | Estimate of support components |
6 | Fabrication | Fabrication of PCB | N/A | 500 | Estimate of on experience for large quantities |
7 | Assembly | Assembly of parts | N/A | 250 | Estimate of on experience for large quantities |
Total Power (W)/card | Total Cost($k)/card | ||||
27.5 | 2.306 |
Type | kLUTs/RCE | kFFs/RCE | DDR/RCE | BRAM/RCE | URAM/RCE | DSP48/RCE | SSD Bandwidth | Note |
---|---|---|---|---|---|---|---|---|
XC7Z045-2FFG900E (proto-DUNE) | 218 | 437.2 | 0GB | 19.2Mb | 0Mb | 900 | 0GB/s | 2x RCEs per DPM |
XCZU15EG-1FFVB1156E (Oxford DPM) | 341 | 683 | 32GB | 26.2Mb | 31.5Mb | 3,528 | 1.4GB/s (PCIe 2x4) | 1x RCEs per DPM |
XCZU6EG-1FFVC900E (ATLAS DPM US+) | 215 | 429 | 8GB | 25.1Mb | 0Mb | 1,973 | 1.4GB/s (PCIe 2x4) | 2x RCEs per DPM |
XCKU040-2FFVA1156E (DUNE PCIe) | 242 | 485 | 16GB | 21.1Mb | 0Mb | 1,920 | 1.9GB/s (PCIe 3x4) | 1x FPGA per PCIe Card |
2000W Redundant (2+2) Power Supplies; Platinum Level (94%+)
HEAT SINK 35MM X 35MM X 35MM
Thermal Resistance @ Forced Air Flow: 3.29°C/W @ 100 LFM
FPGA junction temperate would increase by ~50°C (15W x 3.29°C/W)
FPGA operational temperature: 0°C ~ 100°C (TJ)
This means max. operational ambient temperature would be 50°C
Expecting 25°C nominal ambient temperature
Item | Without compression | With compression |
---|---|---|
Total Power | 31.5kW | 15.75kW |
Total Rack Space | 200u | 100u |
Total Cost | $1.65M | $0.825M |