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CompanyProduct Name    
Desired values     

AI

Technology

Prima-Bond:

EG7655-LV

    
AI Technology

Prima-Bond:

EG7658

    
Ellsworth AdhesivesThermally Conductive Gel Gray: SE 4445 CV Kit    
PolytecTC418    
Epo‐TekT 7109‐19    
Masterbond
Supergel
9A0
     
Dow CorningSE4486    
Dow CorningQ3-3600     
Dow Corning3-6751    
Dow Corning3-6753    
Dow CorningSE4410    
Dow CorningQ3-3600    
Dow CorningSE4440-LP    
Dow CorningSE4446CV    
Dow Corning Sylgard 186    
      
Stycast2850FT    
HuntsmanAraldite 2011    
HuntsmanAraldite 2020    
3M (goes to space with NASA)Scotch-Weld Epoxy Adhesive (2216)    
3MVHB Tape 5909    
3MHigh Temperature Acrylic Adhesive 100 (9461P)    
AMEC ThermasolMPC 25 Thermal Insulator, Phase Change Material    
AMEC ThermasolMPC 801    
AMEC ThermasolMPC 315    
      
Viscosity (centipoise)

Thermal Conductivity

w/(m-K)

Cure Time @ Temp

Strength

(psi & N/mm^2)

Working HoursDensity

Electrical resistivity

ohm-cm

Radiation HardnessType?LinkNotes
< 200001

temp ~ 22C

time: ~1 day

See currently used glue: SE 4445 CV Kit  HighHighGlue (epoxy) , Gel, or Tape  

300000 cp

1.7 ± 10%

4 hr @85 C

2 hr @100C

1 hr @125C

30 mins @150 C

Die Shear 2546-2795 psi

Push-off Strength >1500 psi

Lap Shear : 1000 psi

6.9 N/mm^2

skin irritant2.3 gm/cc

>1E+14

(150C/60 min)

 Glue

https://www.aitechnology.com/product/prima-bond-eg7655/

Datasheet

 
3050003.67 W/m C

4 hr @85 C

2 hr @100C

1 hr @125C

30 mins @150 C

 

Lap Shear: 1800 psi

6.9 N/mm^2

skin irritant    Gluehttps://www.aitechnology.com/uploads/pdf/products/dieattach/eg7658t.pdf 
140001.26

45mins @ 125 C

-skin irritant2.4 gm/cc7E+15not good enoughGel (silicone based)Ellsworth Adhesives 

40k-60k

1.6

48 h @ 23C

Young modulus: 40 N/mm^2

Lap shear strength: 2.9 N/mm^2

   being testedGlue/ Epoxy (flexible)Being tested as good options by John Matheson 

40k-70k

1.3

"sets harder than SE4445"

Lap Shear 1434 psi

  

> 5E+12

being testedEpoxy (flexible)Being tested as good options by John Matheson 
        
epoxy
gel
could be used in combination with something stronger (J Matheson) 
191.53120 hr @ 24C

240 psi

1.65 N/mm^2

--2.00E+14--Dow CorningSE4445 
4.70.77

60hr @100C

30hr @150C

-- 1.00E+13  Dow CorningSE4445 
101.1

50hr @100C

40hr @125C

10hr @150C

555 psi

3.82 N/mm^2

--7.20E+13  Dow CorningSE4445 
111.4

50hr @100C

40hr@125C

10hr @150C

540 psi

3.72 N/mm^2

--7.20E+13  Dow CorningSE4445 
3.50.9230hr @150C370--1.00E+15 EncapsulantsDow CorningSE4445 
4.70.77

60hr @125C

30hr @150C

NA--1.00E+13 EncapsulantsDow CorningSE4445 
3.60.8330min @120CNA--1.00E+15 GelDow CorningSE4445 
220.95

7hr @RT

3.5hr @100C

2.5hr @125

1.9hr @150C

NA--1.00E+15 GelDow CorningSE4445 
66.70.2125min@100C 15min@125C  15min@150C305--5.00E+15  Sylgard® 186 Silicone Elastomer 
           

64000 for Catalyst 9 and 23 LV

1.25 for Catalyst 9

1.02 for 23 LV

 lhcb tested up to 10 N   tested up to fluence of  6 to 8×10^(15) MeVneq/cm2 

https://lartpc-docdb.fnal.gov/0000/000059/001/stycas2850.pdf

Adhesive tested by LHCb

 
30-45k cp0.22 W/m*K @23C7-10 hrs room temp

Avg lap shear strength: 1) 17-25 MPa (metal-metal)

2) 10-20 (plastic-plastic)

   tested up to fluence of  6 to 8×10^(15) MeVneq/cm2 Adhesive tested by LHCb 
150 cp 16 hrs @23C, 3 hrs @ 40C

Avg lap shear strength: 1) 13-25 MPa (metal-metal)

2) 2-7 (plastic-plastic)

       
800000.0326 W/mK

90 min @ 24 C

 

Overlap Shear: 464 E 3 psi @ 24 C

3200 N/mm^2

 

 

    Glue (epoxy)  
- 

Temperature Resistance:

Short Term: 121 C

Long Term : 82 C

Peel Adhesion:

N/100mm

  720 kg/m3 Tape3M VHB Tape 5909 
   

Peel Adhesion:

LHC-b tested up to 10N

   tested up to fluence of  6 to 8×10^(15) MeVneq/cm2Epoxy3M 9461P 
 4 W/mKTemperature Resistance: 4     Wax

AMEC Thermasol MPC25

Datasheet

 
  Temperature Resistance: 8.0     Wax  
  Temperature Resistance: 5.0     Elastomer  
           
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