You are viewing an old version of this page. View the current version.
Compare with Current
View Page History
« Previous
Version 18
Next »
Daughter Board Requirements:
- Board must fit into a 7.8cm (3.071") wide x 4.6cm (1.811") high x 10cm (3.937") deep cavity
- Mounting hole requirements:
- 4x non-plated mounting holes
- 2x in-line ASIC
- 2x in-line with mating connector (to stabilize)
- Board Material:
- Board Thickness:
- standard 1.6mm thickness
- same as CHESS1
- Allow board components:
- ASIC, capacitor (ceramic only) , wire bonds
- Not allow board components:
- Resistors, plastic/metal connectors
- HV through the connector
- ASIC-to-board epoxy material:
- Wire bonds Material:
- aluminum wedge wiring bonding
- ASIC Thermal Management Plan:
- Needs to be able to add cold plate
- Need to assign a mech. eng. to design the cold plate (Action Item for Su Dong)
- Board Connector:
- Hard gold finger edge connector
- Able to test the daughter board before and after radiation without unsoldering/soldering any component:
- Achieved via the edge connector
- Only implement the high speed digital signals
- Off load the test structure testing to the CHESS1 carrier board
- No right side wiring bonding pads
- Requires a different CHESS2 daughter card design for CHESS1 board
- Place the chip 1mm from the edge of the board
- Metal pad underneath to the chip?
- Hole for laser from the backside?
Carrier Board Requirements:
Support full 3+1, Pair only, 1+Test chip configurations
- Support cabling of the high speed digital, SACI control, LV power, and HV control to/from the daughter board
- Socketed connector for an daughter card with an edge connector.
Flexible timing control for multi-chip operation
Interface to backend readout with just one SFP fiber link should be the most flexible generic form for evolution
Generic control/data interface for compatibility with main backend readout schemes of RCE and NEXYS video
- RCE via SFP
- NEXY via SFP (and FMC???)