You are viewing an old version of this page. View the current version.

Compare with Current View Page History

« Previous Version 12 Next »

Design Properties

Property

Specified Value

Comment

Vacuum Pressure

10-6 Torr

 

Maximum Radiation Dose

1X1014 2 GeV electrons (~3X1013 1MeV NEQ)

 

Maximum Magnetic Field

0.55 Tesla

 

Target

0.125% X0 Tungsten (approx. 4 microns thickness)

 

# tracking planes

5

two modules per plane, one above and one below the dead zone

Sensors per module

2, in small angle stereo configuration

 

Stereo angles L1; L2; L3; L4; L5 (mrad)

(0/100); (0,100); (0,50); (0,50); (0,50)

stereo sensors dip away from dead zone on electron side. Stereo sensors rotated about centers.

Nominal dead zone between non-bend sensors w.r.t. photon line (y positions)

+/- 15 mrad

between sensitive regions

z-positions from target (mm)

100, 200, 300, 500, 700

 

x-positions w.r.t. photon line

0 in all layers

 

y movement (motorized)

top and bottom halves move separately in y with +/- 20 mm range

for nominal positions see dead zone specification above

pitch movement (motorized)

+/- 20 mrad

implied by y adjustability above at both ends in z

yaw movement (manual)

+/- 20 mrad

 

nominal bias voltage

150V

 

maximum bias voltage

500V

 

QA Specifications

Specification

Allowed Value

Comment

Material

<1% X0 per measurement pair averaged over tracking volume

 

Sensor Temperature

<0C over entire sensor before irradiation

 

APV25 Temperature

<30C for all chips

 

APV25 Temperature Stability

constant within 3C during physics running

does not include chip to chip variations, which can be larger

Flatness

all sensors planar within 50 microns total

includes thermal deformation

Non-bend Alignment of planes

within 0.5 mrad for all modules on each side of dead zone

means strips are projective to within 1 strip over entire solid angle

Stereo Angle Consistency

within 0.5 mrad of nominal in all layers

 

Bend-plane alignment stability

within 10 microns over all sensor surfaces on each side of dead zone during all running

 

Non-bend alignment stability

within 25 microns over all sensor surfaces on each side of dead zone during all running

 

Z alignment stability

within 50 microns over all sensor surfaces on each side of dead zone during all running

 

Materials and Techniques

  • Wirebonds shall be encapsulated with Sylgard 186, vacuum permitting
  • Back of detector shall be passivated from any conductive support to 1000V test
  • Conductive supports shall have low impedance connection to AVDD (<5? ohms to entire support)
  • Bias voltage shall be supplied to back side directly by wirebonds
  • Sensor modules shall be removable from base plates
  • No labels