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Design Properties

Property

Specified Value

Comment

Vacuum Pressure

10E-6 Torr

 

Maximum Radiation Dose

1E14 2 GeV electrons (~3E13 1MeV NEQ)

 

Maximum Magnetic Field

0.55T

 

Target

0.125% X0 Tungsten (approx. 4 microns thickness)

 

# tracking planes

5

two modules per plane, one above and one below the dead zone

Sensors per module

2, in small angle stereo configuration

 

Stereo angles L1; L2; L3; L4; L5 (mrad)

(0/100); (0,100); (0,50); (0,50); (0,50)

stereo sensors dip away from dead zone on electron side. Stereo sensors rotated about centers.

Nominal dead zone between non-bend sensors w.r.t. photon line

+/- 15 mrad

 

z-positions from target (mm)

100, 200, 300, 500, 700

 

x-positions w.r.t. photon line

0 in all layers

 

y-positions w.r.t. photon line

 

 

QA Specifications

Specification

Allowed Value

Comment

Material

<1% X0 per measurement pair averaged over tracking volume

 

Sensor Temperature

<0C over entire sensor before irradiation

 

APV25 Temperature

<30C for all chips

 

APV25 Temperature Stability

constant within 3C during physics running

does not include chip to chip variations, which can be larger

Flatness

all sensors planar within 50 microns total

includes thermal deformation

Non-bend Alignment of planes

within 0.5 mrad for all modules on each side of dead zone

means strips are projective to within 1 strip over entire solid angle

Stereo Angle Consistency

within 0.5 mrad of nominal in all layers

 

Bend-plane alignment stability

within 10 microns over all sensor surfaces on each side of dead zone during all running

 

Non-bend alignment stability

within 25 microns over all sensor surfaces on each side of dead zone during all running

 

Z alignment stability

within 50 microns over all sensor surfaces on each side of dead zone during all running

 

Materials and Techniques

  • Wirebonds shall be encapsulated with Sylgard 186, vacuum permitting
  • Back of detector shall be passivated from any conductive support to 1000V test
  • Conductive supports shall have low impedance connection to AVDD (<5? ohms to entire support)
  • Bias voltage shall be supplied to back side directly by wirebonds
  • Sensor modules shall be removable from base plates
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