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Specifications

Property

Specified Value

Comment

Material

<1% X0 per measurement pair averaged over tracking volume

 

Sensor Temperature

<0C over entire sensor before irradiation

 

APV25 Temperature

<30C

 

APV25 Temperature Stability

constant within 3C during physics running

does not include chip to chip variations, which can be larger

Flatness

all sensors planar within 50 microns total

includes thermal deformation

Non-bend Alignment of planes

within 0.5 mrad for all modules on each side of dead zone

strips are projective to within 1 strip over entire solid angle

Stereo Angle Consistency

within 0.5 mrad of nominal in all layers

 

Bend-plane alignment stability

within 10 microns over all sensor surfaces during all running

 

Non-bend alignment stability

within 25 microns over all sensor surfaces during all running

 

Z alignment stability

within 50 microns over all sensor surfaces during all running

 

Materials and Techniques

  • Wirebonds shall be encapsulated with Sylgard 186, vacuum permitting
  • Back of detector shall be passivated from any conductive support
  • Conductive supports shall have low impedance connection to AVDD (<5? ohms to entire support)
  • Bias voltage shall be supplied to back side directly by wirebonds
  • Sensor modules shall be removable from base plate
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