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1. irradiate bare sensors and bump-bond afterwards. The problem is to deal with activated sensors (and surrounding equipment) and to do the bump-bonding while keeping the sensor cool 
2. the second solution would be to irradiate assemblies and shield the FE-I3 chip from the proton beam. Cinzia and Steve have proposed a shielding idea. There
   are several issues to be worked out: how to build a fast removal setup of the sensor assembly from the shielding that could be significantly activated, how to increase the bias during the irradiation, how to measure the dose, how to align the beam wrt to the assemblies and shielding. It was suggested that SLAC would design and build the shielding. Simulation is required.   

The second solution would be the default plan, but we should think of better alternatives.

Shielding for proton irradiation:

here is a drawing of principle for shielding the FE-I3 chips under proton irradiation:
Image Added

Design of a cool box for testing the sensors

Los Alamos irradiation facility

 Proton irradiation can be performed at the Los Alamos National Laboratory:

 http://www.lansce.lanl.gov/^{Image Added}

 The deadline for submitting proposal for beam time is end of February. Information on how to submit proposals can be found here:

 https://wnr-proposals.lanl.gov/index.shtml^{Image Added}