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We will irradiate sensots in August, in order to test the irradiated sensors during the October TestBeam.
Use of a PCB between sensor and chip:
here the idea is not put a PCB between the sensor and the chip, which would allow to shield the chip. It requires two bump bondings: sensor+PCB and PCB+chip. See Chris's presentation here: Radiation test with PCB
A drawing of the irradiation set-up can be found here: Proton_Irradiation 
Simulation of the proposed LANL setup (by Heinz Vincke):
Los Alamos irradiation facility
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https://wnr-proposals.lanl.gov/index.shtml