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CompanyProduct NameViscosity (Poise)

Thermal Conductivity

w/(m-K)

Cure Time @ TempStrengthToxic?Density

Electrical resistivity

ohm-cm

Radiation HardnessGel?Link
Desired values < 201 w/(m-K)

temp ~ 22C

time: ~1 day

See currently used glue: SE 4445 CV Kit  HighHighNo 
AITechnologyEG7655-LV

77.8 @ 0.5 rpm

33.4 @ 4.0 rpm

80.0 @ 24 C

30000 cp

1.7 W/(m-C) +- ± 10%

4 hr @85 C

2 hr @100C

1 hr @125C  30 min @150 C

Die Shear 2546-2795 psi

Push-off Strength >1500 psi

skin irritant2.3 gm/cc

>1x10^{14} ohm-cm>1E+14

(150C/60 min)

   
Ellsworth AdhesivesSE 4445 CV Kit141.26 W/m-K

45mins

@ 125 C

 skin irritant2.4 gm/cc7x10^{15} ohm-cm7E+15 Yes? SiliconEllsworth Adhesives
Polytec
TC418

40k-60k mPa-S

1.6 W/mK

48 h @ 23C

Young modulus: 40 N/mm^2

Lap shear strength: 2.9 N/mm^2

   being testedflexible epoxyBeing tested as good options by John Matheson
Epo‐Tek
T 7109‐19

40k-70k cPS

thermal conductivity: 1.3 W/mK

"sets harder than SE4445"

Lap Shear 1434 psi

  

resistivity: > 5x10^(12) Ohm-cm5E+12

being testedflexible epoxyBeing tested as good options by John Matheson
Masterbond
Supergel
9A0
         
epoxy
gel
could be used in combination with something stronger (J Matheson)
Thermally Conductive Adhesives         
Dow CorningSE4486191.53120 hr @ 24C200--2.00E+14--Dow CorningSE4445
Dow CorningQ3-3600 4.70.7760hr @100C                                30hr @150C-- 1.00E+13  Dow CorningSE4445
Dow Corning3-6751101.150hr @100C     40hr@125C            10hr @150C555--7.20E+13  Dow CorningSE4445
Dow Corning3-6753111.450hr @100C     40hr@125C            10hr @150C540--7.20E+13  Dow CorningSE4445
Thermally Conductive Encapsulants         
Dow CorningSE44103.50.9230hr @150C370--1.00E+15  Dow CorningSE4445
Dow CorningQ3-36004.70.7760hr @125C    30hr @150CNA--1.00E+13  Dow CorningSE4445
Thermally Conductive Gels         
Dow CorningSE4440-LP3.60.8330min @120CNA--1.00E+15  Dow CorningSE4445
Dow CorningSE4446CV220.957hr @RT         3.5hr @100C   2.5hr @125    1.9hr @150CNA--1.00E+15  Dow CorningSE4445