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300000

2 hr @100C

1 hr @125C

30 mins @150 C

120h @ 25 C

Gluemanufactureraitechnologyaitechnologyprimabondeg7655epoxypasteadhesive2-oz

https://www.aitechnology.com/product/prima-bond-eg7655/

Datasheet

Being tested by CERN. See pg 8

not good enough.PolytecTC418

Young modulus: 40 N/mm^2

Lap shear strength: 2.9 N/mm^2    tested up to fluence of  6 to 8×10^(15) MeVneq/cm2   
CompanyProduct Name

Viscosity (centipoise)

Water: 1cp

Thermal Conductivity

w/(m-K)

Cure Time @ Temp

Strength

(psi & N/mm^2)

Working HoursDensity

Electrical resistivity

ohm-cm

Radiation HardnessType?Link/Notes
Desired values 

<

20000

20 000

1

temp ~ 22C

time: ~1 day

See currently used glue: SE 4445 CV Kit  High

"10 MGy"

for For 2000 fb-1: 1.3E16 neq/cm2 and 1Grad1GRad = 10 MGy

Glue (epoxy), Gel, or Tape  
Candidate Glues

AI

Technology

Prima-Bond:

EG7655-LV1

70000 cp1.7 ± 10%4 hr @85 CLapShear > 800 psi"reworkable at 80-100 C" 

1E+14

CERN test:

prerad: 340 psi

Flexible epoxy adhesive

EG7655-LV also exists. It has viscosity 80k cp

We will ask if we can have the glue without the dopant loading.

AI Tech

ME7638-RC10k cp

Die Shear 2546-2795 psi

Push-off Strength >1500 psi

Lap Shear : 1000 psi

6.9 N/mm^2

skin irritant2.3 gm/cc

>1E+14

(150C/60 min)

KEK result:

Preradiation peel strength: 0.25 +- 0.15 N/mm

Post radiation: 0.35 +- 0.04 N/mm

3    1E+14   

AI Tech

CGR 7015 2    1E+14 Cool-Grease 

AI Tech

CoolBond

CP7138

 4    1E+14 Tape

Tape: Tack free dry film Preforms 3-12 mils (thick)

AI Tech

TackFilmRTK7659 11.4        

AI Tech

Tack Film 7755 1.7        

AI Tech

TP 7209 1.4    "good" thermal plastic film 

AI Tech

TP 8205 5.7    "good" thermal plastic film 
Polytec
TC418

40k-60k

1.6

48 h @ 23C

Young mod: 40 N/mm^2 Lap shear: 2.9 N/mm^2

   Tested at cern: before radiation: peel strength 350, after 325 psiGlue/ Epoxy (flexible)

Being tested as good options by John Matheson.

Also listed here:

https://indico.cern.ch/event/718423/contributions/3002853/attachments/1650032/2638799/20180515_MaterialQualification.pdf

PolytecTC 42345k3    1E+14  

Glass transition temp 64C

Epo‐TekT71101.4K-2k1    

≥ 2 E13

 

epoxyRT cure. Suggested by EpoTec
Epo‐Tek921-FL new 9-15k 1.1    >6E13  Smooth flowing paste Suggested by EpoTec.

Curing: 100°C / 20 Minutes 

Dow Corning3-675110k1.1

50hr @100C

40hr @125C

10hr @150C

555 psi

3.82 N/mm^2

--7.20E+13  

"Low modulus; low viscosity; heat curable; UL94 V-0 rating "

https://www.ellsworth.com/products/by-

market/

consumer-

products/thermally-conductive-materials/adhesives/

dow-

3-

6751-

thermally-

conductive-

adhesive-

gray-

1-

kg-kit/

 

AI

Technology

Prima-Bond:

EG7655-LV1

70000 cp1.7 ± 10%4 hr @85 CLapShear > 800 psi  

>1E+14

 

Flexible epoxy adhesive  
AI Technology

Prima-Bond:

EG7658

3050003.67 W/m C

4 hr @85 C

2 hr @100C

1 hr @125C

30 mins @150 C

 

Lap Shear: 1800 psi

6.9 N/mm^2

skin irritant   

KEK result:

Preradiation strength: 0.55 +- 0.05 N/mm

Post radiation: 0.4 +- 0.08 N/mm

Gluehttps://www.aitechnology.com/uploads/pdf/products/dieattach/eg7658t.pdf 

Dow Corning3-675311k1.4

50hr @100C

40hr@125C

10hr @150C

540 psi

3.72 N/mm^2

--7.20E+13  

"Low modulus; low viscosity; contains 7-mil (178 micron) glass beads for bond line control "

Dow Corning3-665132k"good"      EncapsulantTwo-part; grey;

Low modulus; low viscoisty; good thermal conducitivity; UL 94 V-0 rating 

Dow Corning3-665533k"good"      Encapsulant

Low viscosity; soft; excellent thermal conductivity; UL 94 V-0 

Dow Corning

Ellsworth AdhesivesThermally Conductive Gel Gray: SE 4445 CV Kit140001.26

45mins @ 125 C

-skin irritant2.4 gm/cc7E+15

conflicting results

KEK result:

Preradiation strength: 0.1 N/mm

Post radiation: 0.025 N/mm (cracked)

Gel (silicone based)

Ellsworth Adhesives

IBL current glue

  (question)  

40k-60k

1.6

48 h @ 23C        being testedGlue/ Epoxy (flexible)

Being tested as good options by John Matheson.

Also listed here:

https://indico.cern.ch/event/718423/contributions/3002853/attachments/1650032/2638799/20180515_MaterialQualification.pdf

  
Ruled out: (reason for being ruled out is in Red)
Epo‐Tek
T 7109‐19

40k-70k

1.3

"sets harder than SE4445"

Lap Shear 1434 psi

  

> 5E+12

being testedCern peel strength tested: before rad: 1400 psi, after: 600 psiEpoxy (flexible)Being tested as good options by John Matheson
Stycast2850FT

64000 for Catalyst 9 and 23 LV

1.25 for Catalyst 9

1.02 for 23 LV

 lhcb tested up to 10 N   tested up to fluence of  6 to 8×10^(15) MeVneq/cm2 

https://lartpc-docdb.fnal.gov/0000/000059/001/stycas2850.pdf

Adhesive tested by LHCb

Masterbond
Supergel
9A0
         
epoxy
gel
could be used in combination with something stronger (J Matheson) 
Dow CorningSE448619k1.53120 hr @ 24C

240 psi

1.65 N/mm^2

--2.00E+14--https://www.ellsworth.com/products/by-market/consumer-products/thermally-conductive-materials/adhesives/dow-corning-se4486-cv-thermally-conductive-adhesive-white-330-ml-cartridge/

AI

Dow Corning

Technology

Q3-3600 4.7k0.77

60hr @100C

30hr @150C

-- 1.00E+13  Dow CorningSE4445 
Dow Corning3-675110k1.1

50hr @100C

40hr @125C

10hr @150C

555 psi

3.82 N/mm^2

--7.20E+13  

"Low modulus; low viscosity; heat curable; UL94 V-0 rating "

 

Prima-Bond:

EG7655

300000 cp

1.7 ± 10%

4 hr @85 C

2 hr @100C

1 hr @125C

30 mins @150 C

120h @ 25 C

Die Shear 2546-2795 psi

Push-off Strength >1500 psi

Lap Shear : 1000 psi

6.9 N/mm^2

skin irritant2.3 gm/cc

>1E+14

(150C/60 min)

KEK result:

Preradiation peel strength: 0.25 +- 0.15 N/mm

Post radiation: 0.35 +- 0.04 N/mm

Glue

https://www.ellsworth.com/products/by-manufacturer/ai-technology/thermally-conductive-materials/adhesives/ai-technology-prima-bond-eg7655-epoxy-paste-adhesive-2-oz-kit/

https://www.aitechnology.com/product/prima-bond-eg7655/

Datasheet

Being tested by CERN. See pg 8

Dow CorningQ3-3600 4.7k0.77

60hr @100C

30hr @150C

-- 1.00E+13  Dow CorningSE4445Dow Corning3-675311k1.4

50hr @100C

40hr@125C

10hr @150C

540 psi

3.72 N/mm^2

--7.20E+13  

"Low modulus; low viscosity; contains 7-mil (178 micron) glass beads for bond line control "

Dow CorningSE44103.5k0.9230hr @150C370--1.00E+15 Encapsulants

Two-part; low viscosity;

Heat cure; moderate thermal conductivity; UL 94 V-0 rating 

Dow CorningQ3-36004.7k0.77

60hr @125C

30hr @150C

NA--1.00E+13 EncapsulantsDow CorningSE4445 
Dow Corning3-665132k      EncapsulantTwo-part; grey;

Low modulus; low viscoisty; good thermal conducitivity; UL 94 V-0 rating 

 
Dow Corning3-665533k       Encapsulant

Low viscosity; soft; excellent thermal conductivity; UL 94 V-0 

 
Dow CorningSE4440-LP3.6k0.8330min @120CNA--1.00E+15 GelDow CorningSE4445 
Dow CorningSE4446CV22k0.95

7hr @RT

3.5hr @100C

2.5hr @125

1.9hr @150C

NA--1.00E+15 GelDow CorningSE4445 
Dow Corning Sylgard 18666.7(k)0.2125min@100C 15min@125C  15min@150C305--5.00E+15  

Sylgard® 186 Silicone Elastomer

Being tested at CERN

 
           
Stycast2850FT

64000 for Catalyst 9 and 23 LV

1.25 for Catalyst 9

1.02 for 23 LV

 lhcb tested up to 10 N   

 

https://lartpc-docdb.fnal.gov/0000/000059/001/stycas2850.pdf

Adhesive tested by LHCb

 
HuntsmanAraldite 201130-45k cp0.22 W/m*K @23C7-10 hrs room temp

Avg lap shear strength: 1) 17-25 MPa (metal-metal)

2) 10-20 (plastic-plastic)

Peel: 0.2 N/mm

   

tested up to fluence of  6 to 8×10^(15) MeVneq/cm2.


 

Adhesive tested by LHCb.

Also on the CERN list for testing

AI Technology

Prima-Bond:

EG7658

3050003.67 W/m C

4 hr @85 C

2 hr @100C

1 hr @125C

30 mins @150 C

 

Lap Shear: 1800 psi

6.9 N/mm^2

skin irritant   

KEK result:

Preradiation strength: 0.55 +- 0.05 N/mm

Post radiation: 0.4 +- 0.08 N/mm

Gluehttps://www.aitechnology.com/uploads/pdf/products/dieattach/eg7658t.pdf
HuntsmanAraldite 2020150k cp 16 hrs @23C, 3 hrs @ 40C

Avg lap shear strength: 1) 13-25 MPa (metal-metal)

2) 2-7 (plastic-plastic)

     Being tested at cern
3M (goes to space with NASA)Scotch-Weld Epoxy Adhesive (2216)800000.0326 W/mK

90 min @ 24 C

 

Overlap Shear: 464 E 3 psi @ 24 C

3200 N/mm^2

 

 

    Glue (epoxy)

Used by nasa for mars missions

Also used by FERMI LAT

 
3MVHB Tape 5909- 

Temperature Resistance:

Short Term: 121 C

Long Term : 82 C

Peel Adhesion:

N/100mm

  720 kg/m3 Tape3M VHB Tape 5909. Being tested at CERN 
3MHigh Temperature Acrylic Adhesive 100 (9461P)   

Peel Adhesion:

LHC-b tested up to 10N

  

tested up to fluence of  6 to 8×10^(15) MeVneq/cm2Epoxy3M 9461P 
AMEC ThermasolMPC 25 Thermal Insulator, Phase Change Material 4 W/mKTemperature Resistance: 4     Wax

AMEC Thermasol MPC25

Datasheet

AMEC ThermasolMPC 801  Temperature Resistance: 8.0     Wax  
AMEC ThermasolMPC 315  Temperature Resistance: 5.0     Elastomer 
3MHigh Temperature Acrylic Adhesive 100 (9461P) 

0.18 

 

Peel Adhesion:

LHC-b tested up to 10N

   tested by LHCb up to fluence of  6 to 8×10^(15) MeVneq/cm2Epoxy

3M 9461P

Adhesive tested by LHCb

3MVHB Tape 5909-bad. 0.08

Temperature Resistance:

Short Term: 121 C

Long Term : 82 C

72 hr to set

Peel Adhesion:

N/100mm

  720 kg/m3tested at cern: 60 psi before and after radiationTape3M VHB Tape 5909. Being tested at CERN
  SE 4445           

 

List of adhesives being irradiated and tested by CERN group: https://indico.cern.ch/event/718423/contributions/3002853/attachments/1650032/2638799/20180515_MaterialQualification.pdf

...