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77.8 @ 0.5 rpm

33.4 @ 4.0 rpm

80.0 @ 24 C

30000

2 hr @100C

1 hr @125C

30 mins @150 C

noaitechnologyuploadspdfproducts/dieattach/eg7658t.pdfYes? SiliconPolytecTC418

Young modulus: 40 N/mm^2

Lap shear strength: 2.9 N/mm^2   lhcb tested up to 10 N7-10 hrs room temp 17 1020 tested up to fluence of  6 to 8×10^(15) MeVneq/cm2150 cp
CompanyProduct Name

Viscosity (centipoise)

Water: 1cp

Thermal Conductivity

w/(m-K)

Cure Time @ Temp

Strength

(psi & N/mm^2)

Working HoursToxic?Density

Electrical resistivity

ohm-cm

Radiation HardnessGelType?Link/Notes
Desired values 

<

20000

20 000

1

temp ~ 22C

time: ~1 day

See currently used glue: SE 4445 CV Kit  HighHighNo  AITechnologyEG7655-LV

For 2000 fb-1: 1.3E16 neq/cm2 and 1GRad = 10 MGy

Glue (epoxy), Gel, or Tape 
Candidate Glues

AI

Technology

Prima-Bond:

EG7655-LV1

70000 cp1.7 ± 10%4 hr @85 CLapShear > 800 psi"reworkable at 80-100 C

Die Shear 2546-2795 psi

Push-off Strength >1500 psi

skin irritant2.3 gm/cc

>1E+14

(150C/60 min)

    AI TechnologyEG 76583050003.67 W/m C

4 hr @85 C

2 hr @100C

1 hr @125C

30 mins @150 C

 

 skin irritant    epoxy" 

1E+14

CERN test:

prerad: 340 psi

Flexible epoxy adhesive

EG7655-LV also exists. It has viscosity 80k cp

We will ask if we can have the glue without the dopant loading.

AI Tech

ME7638-RC10k cp3    1E+14   

AI Tech

CGR 7015 2    1E+14 Cool-Grease 

AI Tech

CoolBond

CP7138

 4    1E+14 Tape

Tape: Tack free dry film Preforms 3-12 mils (thick)

AI Tech

TackFilmRTK7659 11.4        

AI Tech

Tack Film 7755 1.7        

AI Tech

TP 7209 1.4    "good" thermal plastic film 

AI Tech

TP 8205 5.7    "good" thermal plastic film 
Polytec
TC418

40k-60k

1.6

48 h @ 23C

Young mod: 40 N/mm^2 Lap shear: 2.9 N/mm^2

   Tested at cern: before radiation: peel strength 350, after 325 psiGlue/ Epoxy (flexible)

Being tested as good options by John Matheson.

Also listed here:

https://indico.cern.ch/event/718423/contributions/3002853/attachments/1650032/2638799/20180515_MaterialQualification.pdf

PolytecTC 42345k3    1E+14  

Glass transition temp 64C

Epo‐TekT71101.4K-2k1    

≥ 2 E13

 

epoxyRT cure. Suggested by EpoTec
Epo‐Tek921-FL new 9-15k 1.1    >6E13  Smooth flowing paste Suggested by EpoTec.

Curing: 100°C / 20 Minutes 

Dow Corning3-675110k1.1

50hr @100C

40hr @125C

10hr @150C

555 psi

3.82 N/mm^2

--7.20E+13  

"Low modulus; low viscosity; heat curable; UL94 V-0 rating "

https://www.

ellsworth.com/

products/

by-market/

 

consumer-products/thermally-conductive-materials/adhesives/dow-3-6751-thermally-conductive-adhesive-gray-1-kg-kit/

Dow Corning3-675311k1.4

50hr @100C

40hr@125C

10hr @150C

540 psi

3.72 N/mm^2

--7.20E+13  

"Low modulus; low viscosity; contains 7-mil (178 micron) glass beads for bond line control "

Dow Corning3-665132k"good"      EncapsulantTwo-part; grey;

Low modulus; low viscoisty; good thermal conducitivity; UL 94 V-0 rating 

Dow Corning3-665533k"good"      Encapsulant

Low viscosity; soft; excellent thermal conductivity; UL 94 V-0 

Dow Corning

Thermally Conductive Gel Gray: Ellsworth Adhesives SE 4445 CV Kit140001.26

45mins @ 125 C

 -skin irritant2.4 gm/cc7E+15not good enough

conflicting results

KEK result:

Preradiation strength: 0.1 N/mm

Post radiation: 0.025 N/mm (cracked)

Gel (silicone based)

Ellsworth Adhesives

IBL current glue

    

40k-60k

1.6

48 h @ 23C        being testedflexible epoxyBeing tested as good options by John Matheson 
Ruled out: (reason for being ruled out is in Red)
Epo‐Tek
T 7109‐19

40k-70k

1.3

"sets harder than SE4445"

Lap Shear 1434 psi

  

> 5E+12

being testedCern peel strength tested: before rad: 1400 psi, after: 600 psiEpoxy (flexible)flexible epoxyBeing tested as good options by John Matheson
Stycast2850FT

64000 for Catalyst 9 and 23 LV

1.25 for Catalyst 9

1.02 for 23 LV

 lhcb tested up to 10 N   tested up to fluence of  6 to 8×10^(15) MeVneq/cm2 

https://lartpc-docdb.fnal.gov/0000/000059/001/stycas2850.pdf

Adhesive tested by LHCb

Masterbond
Supergel
9A0
         
epoxy
gel
could be used in combination with something stronger (J Matheson) Thermally Conductive Adhesives          
Dow CorningSE44861919k1.53120 hr @ 24C200

240 psi

1.65 N/mm^2

--2.00E+14--Dow CorningSE4445 
Dow CorningQ3-3600 4.70.77

60hr @100C

30hr @150C

-- 1.00E+13  Dow CorningSE4445 
Dow Corning3-6751101.1

50hr @100C

40hr @125C

10hr @150C

555--7.20E+13  Dow CorningSE4445 
https://www.ellsworth.com/products/by-market/consumer-products/thermally-conductive-materials/adhesives/dow-corning-se4486-cv-thermally-conductive-adhesive-white-330-ml-cartridge/

AI

Technology

Prima-Bond:

EG7655

300000 cp

1.7 ± 10%

4 hr @85 C

2 hr @100C

1 hr @125C

30 mins @150 C

120h @ 25 C

Die Shear 2546-2795 psi

Push-off Strength >1500 psi

Lap Shear : 1000 psi

6.9 N/mm^2

skin irritant2.3 gm/cc

>1E+14

(150C/60 min)

KEK result:

Preradiation peel strength: 0.25 +- 0.15 N/mm

Post radiation: 0.35 +- 0.04 N/mm

Glue

https://www.ellsworth.com/products/by-manufacturer/ai-technology/thermally-conductive-materials/adhesives/ai-technology-prima-bond-eg7655-epoxy-paste-adhesive-2-oz-kit/

https://www.aitechnology.com/product/prima-bond-eg7655/

Datasheet

Being tested by CERN. See pg 8

Dow CorningQ3-3600 4.7k0.77

60hr @100C

30hr @150C

-- 1.00EDow Corning3-6753111.4

50hr @100C

40hr@125C

10hr @150C

540--7.20E+13  Dow CorningSE4445 Thermally Conductive Encapsulants         
Dow CorningSE44103.55k0.9230hr @150C370--1.00E+15  Dow CorningSE4445Encapsulants

Two-part; low viscosity;

Heat cure; moderate thermal conductivity; UL 94 V-0 rating 

Dow CorningQ3-36004.77k0.77

60hr @125C

30hr @150C

NA--1.00E+13  Dow CorningSE4445 Thermally Conductive Gels      Encapsulants    
Dow CorningSE4440-LP3.66k0.8330min @120CNA--1.00E+15 YesGelDow CorningSE4445 
Dow CorningSE4446CV2222k0.95

7hr @RT

3.5hr @100C

2.5hr @125

1.9hr @150C

NA--1.00E+15 GelYes 
Dow CorningSE4445 Adhesives tested by LHCb    Corning Sylgard 18666.7(k)0.2125min@100C 15min@125C  15min@150C305--5.00E+15     Stycast2850FT

Sylgard® 186 Silicone Elastomer

Being tested at CERN

HuntsmanAraldite 201130-45k cp0.22 W/m*K @23C7-10 hrs room temp

Avg lap shear strength: 1) 17-25 MPa (metal-metal)

2) 10-20 (plastic-plastic)

Peel: 0.2 N/mm

   

   

tested up to fluence of  6 to 8×10^(15) MeVneq/cm2

Tapehttps://lartpc-docdb.fnal.gov/0000/000059/001/stycas2850.pdf 3MVHB59090.3

Short Term:(minutes, hours) 121°C(250°F)

Long Term: (days, weeks)

82°C (180°F)

 210 720 kg/m3--

.


 

Adhesive tested by LHCb.

Also on the CERN list for testing

AI Technology

Prima-Bond:

EG7658

3050003.67 W/m C

4 hr @85 C

2 hr @100C

1 hr @125C

30 mins @150 C

 

Lap Shear: 1800 psi

6.9 N/mm^2

skin irritant   

KEK result:

Preradiation strength: 0.55 +- 0.05 N/mm

Post radiation: 0.4 +- 0.08 N/mm

Glue https://www.3maitechnology.com/3M/en_US/company-us/all-3m-products/~/3M-VHB-Tape-5909/?N=5002385+3291242868&rt=rud 
 3M9461P   lhcb tested up to 10 N   tested up to fluence of  6 to 8×10^(15) MeVneq/cm2Tape  
uploads/pdf/products/dieattach/eg7658t.pdf
HuntsmanAraldite 2020150k cp 16 hrs @23C, 3 hrs @ 40CHuntsmanAraldite 201130-45k cp0.22 W/m*K @23C

Avg lap shear strength: 1)

13-25 MPa (metal-metal)

2)

2-

7 (plastic-plastic)

     Being tested at cern
3M (goes to space with NASA)Scotch-Weld Epoxy Adhesive (2216)800000.0326 W/mK

90 min @ 24 C

 

Overlap Shear: 464 E 3 psi @ 24 C

3200 N/mm^2

 

 

    Glue (epoxy)

Used by nasa for mars missions

Also used by FERMI LAT

AMEC ThermasolMPC 25 Thermal Insulator, Phase Change Material 4 W/mKTemperature Resistance: 4Additional      Wax

AMEC Thermasol MPC25

Datasheet

AMEC ThermasolMPC 801  Temperature Resistance: 8.0    HuntsmanAraldite 2020 Wax 
AMEC ThermasolMPC 315  Temperature Resistance: 5.0     Elastomer 
3MHigh Temperature Acrylic Adhesive 100 (9461P) 

0.18 

 

Peel Adhesion:

LHC-b tested up to 10N

   tested by LHCb up to fluence of  6 to 8×10^(15) MeVneq/cm2Epoxy

3M 9461P

Adhesive tested by LHCb

3MVHB Tape 5909-bad. 0.08

Temperature Resistance:

Short Term: 121 C

Long Term : 82 C

72 hr to set

Peel Adhesion:

N/100mm

  720 kg/m3tested at cern: 60 psi before and after radiationTape3M VHB Tape 5909. Being tested at CERN
     16 hrs @23C, 3 hrs @ 40C

Avg lap shear strength: 1) 13-25 MPa (metal-metal)

2) 2-7 (plastic-plastic)
       

 

List of adhesives being irradiated and tested by CERN group: https://indico.cern.ch/event/718423/contributions/3002853/attachments/1650032/2638799/20180515_MaterialQualification.pdf

Image Added