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1E+14https://www.aitechnology.com/uploads/pdf/products/dieattach/eg7658t.pdf

77.8 @ 0.5 rpm

33.4 @ 4.0 rpm

80.0 @ 24 C

30000

2 hr @100C

1 hr @125C

30 mins @150 C

>1E+14

(150C/60 min)    7-10 hrs room temp 17 1020
CompanyProduct Name

Viscosity (

Poise

centipoise)

Water: 1cp

Thermal Conductivity

w/(m-K)

Cure Time @ Temp

Strength

(psi & N/mm^2)

Working HoursToxic?Density

Electrical resistivity

ohm-cm

Radiation HardnessGelType?Link/Notes
Desired values 

< 20 000

1

temp ~ 22C

time: ~1 day

See currently used glue: SE 4445 CV Kit  HighHighNo  AITechnologyEG7655-LV

For 2000 fb-1: 1.3E16 neq/cm2 and 1GRad = 10 MGy

Glue (epoxy), Gel, or Tape 
Candidate Glues

AI

Technology

Prima-Bond:

EG7655-LV1

70000 cp1.7 ± 10%4 hr @85 CLapShear > 800 psi"reworkable at 80-100 C

Die Shear 2546-2795 psi

Push-off Strength >1500 psi

skin irritant2.3 gm/cc" 

1E+14

CERN test:

prerad: 340 psi

Flexible epoxy adhesive

EG7655-LV also exists. It has viscosity 80k cp

We will ask if we can have the glue without the dopant loading.

AI Tech

ME7638-RC10k cp3    1E+14   

AI Tech

CGR 7015 2    1E+14 Cool-Grease 

AI Tech

CoolBond

CP7138

 4    1E+14 Tape

Tape: Tack free dry film Preforms 3-12 mils (thick)

AI Tech

TackFilmRTK7659 11.4   AI TechnologyEG 76583050003.67 W/m C

4 hr @85 C

2 hr @100C

1 hr @125C

30 mins @150 C
  skin irritant     epoxynohttps://www.aitechnology.com/uploads/pdf/products/dieattach/eg7658t.pdf 

AI Tech

Tack Film 7755 1.7        

AI Tech

TP 7209 1.4    "good" thermal plastic film 

AI Tech

TP 8205 5.7    "good" thermal plastic filmEllsworth AdhesivesSE 4445 CV Kit141.26

45mins @ 125 C

 skin irritant2.4 gm/cc7E+15 Yes? SiliconEllsworth Adhesives 
Polytec
TC418

40k-60k mPa-S

1.6

48 h @ 23C

Young modulusmod: 40 N/mm^2 Lap shear strength: 2.9 N/mm^2

   being testedTested at cern: before radiation: peel strength 350, after 325 psiGlue/ Epoxy (flexible)flexible epoxy

Being tested as good options by John Matheson.

Also listed here:

https://indico.cern.ch/event/718423/contributions/3002853/attachments/1650032/2638799/20180515_MaterialQualification.pdf

PolytecTC 42345k3    1E+14  

Glass transition temp 64C

Epo‐TekT71101.4K-2k1    

≥ 2 E13

 

epoxyRT cure. Suggested by EpoTec
Epo‐Tek921-FL new 9-15k 1.1    >6E13  Smooth flowing paste Suggested by EpoTec.

Curing: 100°C / 20 Minutes 

Dow Corning3-675110k1.1

50hr @100C

40hr @125C

10hr @150C

555 psi

3.82 N/mm^2

--7.20E+13  

"Low modulus; low viscosity; heat curable; UL94 V-0 rating "

https://www.ellsworth.com/products/by-market/consumer-products/thermally-conductive-materials/adhesives/dow-3-6751-thermally-conductive-adhesive-gray-1-kg-kit/

Dow Corning3-675311k1.4

50hr @100C

40hr@125C

10hr @150C

540 psi

3.72 N/mm^2

--7.20E+13  

"Low modulus; low viscosity; contains 7-mil (178 micron) glass beads for bond line control "

Dow Corning3-665132k"good"      EncapsulantTwo-part; grey;

Low modulus; low viscoisty; good thermal conducitivity; UL 94 V-0 rating 

Dow Corning3-665533k"good"      Encapsulant

Low viscosity; soft; excellent thermal conductivity; UL 94 V-0 

Dow Corning

Thermally Conductive Gel Gray: SE 4445 CV Kit140001.26

45mins @ 125 C

-skin irritant2.4 gm/cc7E+15

conflicting results

KEK result:

Preradiation strength: 0.1 N/mm

Post radiation: 0.025 N/mm (cracked)

Gel (silicone based)

Ellsworth Adhesives

IBL current glue

            
Ruled out: (reason for being ruled out is in Red)
Epo‐Tek
T 7109‐19

40k-70k cPS

1.3

"sets harder than SE4445"

Lap Shear 1434 psi

  

> 5E+12

being testedCern peel strength tested: before rad: 1400 psi, after: 600 psiEpoxy (flexible)flexible epoxyBeing tested as good options by John Matheson
Stycast2850FT

64000 for Catalyst 9 and 23 LV

1.25 for Catalyst 9

1.02 for 23 LV

 lhcb tested up to 10 N   tested up to fluence of  6 to 8×10^(15) MeVneq/cm2 

https://lartpc-docdb.fnal.gov/0000/000059/001/stycas2850.pdf

Adhesive tested by LHCb

Masterbond
Supergel
9A0
         
epoxy
gel
could be used in combination with something stronger (J Matheson) 
Thermally Conductive Adhesives          
Dow CorningSE44861919k1.53120 hr @ 24C200

240 psi

1.65 N/mm^2

--2.00E+14--Dow CorningSE4445 
Dow CorningQ3-3600 4.70.77

60hr @100C

30hr @150C

-- 1.00E+13  Dow CorningSE4445 
Dow Corning3-6751101.1

50hr @100C

40hr @125C

10hr @150C

555--7.20E+13  Dow CorningSE4445 
https://www.ellsworth.com/products/by-market/consumer-products/thermally-conductive-materials/adhesives/dow-corning-se4486-cv-thermally-conductive-adhesive-white-330-ml-cartridge/

AI

Technology

Prima-Bond:

EG7655

300000 cp

1.7 ± 10%

4 hr @85 C

2 hr @100C

1 hr @125C

30 mins @150 C

120h @ 25 C

Die Shear 2546-2795 psi

Push-off Strength >1500 psi

Lap Shear : 1000 psi

6.9 N/mm^2

skin irritant2.3 gm/cc

>1E+14

(150C/60 min)

KEK result:

Preradiation peel strength: 0.25 +- 0.15 N/mm

Post radiation: 0.35 +- 0.04 N/mm

Glue

https://www.ellsworth.com/products/by-manufacturer/ai-technology/thermally-conductive-materials/adhesives/ai-technology-prima-bond-eg7655-epoxy-paste-adhesive-2-oz-kit/

https://www.aitechnology.com/product/prima-bond-eg7655/

Datasheet

Being tested by CERN. See pg 8

Dow CorningQ3-3600 4.7k0.77

60hr @100C

30hr @150C

-- 1.00EDow Corning3-6753111.4

50hr @100C

40hr@125C

10hr @150C

540--7.20E+13  Dow CorningSE4445
Thermally Conductive Encapsulants          
Dow CorningSE44103.55k0.9230hr @150C370--1.00E+15  Dow CorningSE4445Encapsulants

Two-part; low viscosity;

Heat cure; moderate thermal conductivity; UL 94 V-0 rating 

Dow CorningQ3-36004.77k0.77

60hr @125C

30hr @150C

NA--1.00E+13  Dow CorningSE4445 Thermally Conductive Gels        Encapsulants  
Dow CorningSE4440-LP3.66k0.8330min @120CNA--1.00E+15  Dow CorningSE4445Gel 
Dow CorningSE4446CV2222k0.95

7hr @RT

3.5hr @100C

2.5hr @125

1.9hr @150C

NA--1.00E+15 Gel 
Dow CorningSE4445 Adhesives tested by LHCb   Corning Sylgard 18666.7(k)0.2125min@100C 15min@125C  15min@150C305--5.00E+15      

Sylgard® 186 Silicone Elastomer

Being tested at CERN

HuntsmanAraldite 201130-45k cp0.22 W/m*K @23C7-10 hrs room temp

Avg lap shear strength: 1) 17-25 MPa (metal-metal)

2) 10-20 (plastic-plastic)

Peel: 0.2 N/mm

Stycast2850FT   

   

tested up to fluence of  6 to 8×10^(15) MeVneq/cm2.


   
Araldite2011           
 3M9461P           

Adhesive tested by LHCb.

Also on the CERN list for testing

AI Technology

Prima-Bond:

EG7658

3050003.67 W/m C

4 hr @85 C

2 hr @100C

1 hr @125C

30 mins @150 C

 

Lap Shear: 1800 psi

6.9 N/mm^2

skin irritant   

KEK result:

Preradiation strength: 0.55 +- 0.05 N/mm

Post radiation: 0.4 +- 0.08 N/mm

Gluehttps://www.aitechnology.com/uploads/pdf/products/dieattach/eg7658t.pdf
HuntsmanAraldite 2020150k cp 16 hrs @23C, 3 hrs @ 40CHuntsmanAraldite 201130-45k cp0.22 W/m*K @23C

Avg lap shear strength: 1)

13-25 MPa (metal-metal)

2)

2-

7 (plastic-plastic)

     Being tested at cern
3M (goes to space with NASA)Scotch-Weld Epoxy Adhesive (2216)800000.0326 W/mK

90 min @ 24 C

 

Overlap Shear: 464 E 3 psi @ 24 C

3200 N/mm^2

 

 

    Glue (epoxy)

Used by nasa for mars missions

Also used by FERMI LAT

AMEC ThermasolMPC 25 Thermal Insulator, Phase Change Material 4 W/mKTemperature Resistance: 4     Wax

AMEC Thermasol MPC25

Datasheet

AMEC ThermasolMPC 801  Temperature Resistance: 8.0     Wax 
AMEC ThermasolMPC 315  Temperature Resistance: 5.0     Elastomer 
3MHigh Temperature Acrylic Adhesive 100 (9461P) 

0.18 

 

Peel Adhesion:

LHC-b tested up to 10N

   tested by LHCb up to fluence of  6 to 8×10^(15) MeVneq/cm2Epoxy

3M 9461P

Adhesive tested by LHCb

3MVHB Tape 5909-bad. 0.08

Temperature Resistance:

Short Term: 121 C

Long Term : 82 C

72 hr to set

Peel Adhesion:

N/100mm

  720 kg/m3tested at cern: 60 psi before and after radiationTape3M VHB Tape 5909. Being tested at CERN
      HuntsmanAraldite 2020150 cp 16 hrs @23C, 3 hrs @ 40C

Avg lap shear strength: 1) 13-25 MPa (metal-metal)

2) 2-7 (plastic-plastic)
      

 

List of adhesives being irradiated and tested by CERN group: https://indico.cern.ch/event/718423/contributions/3002853/attachments/1650032/2638799/20180515_MaterialQualification.pdf

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