• Created by Unknown User (phansson), last modified on May 02, 2014

 

Webex meeting for those not at SLAC: https://confluence.slac.stanford.edu/display/hpsg/Webex+connection+details

 

Agenda

 

  •  Temperature polling on new hybrids

  • Hybrid QA (Omar)

  • High-speed tests (Ben)

  • Reading data with FEB (Ben)

  • Grounding and shielding: document
    • Modifications to signal flange board
    • Modifications to FEB

  • Procurement checklist
    • Fibers 
  • Schedule feedback and discussion

  • AOB

 

Minutes

  • Temperature polling on new hybrids

    Ryan reported that they are getting closer to solving this problem. It seems related to a loss of sync due to the overlapping polling of temperature and ADC causing the APV25 to loose sync. For the new hybrids the cycle to poll temperature is longer which is why it's more pronounced this time. It probably exist on the old hybrids as well. Nothing points to that this is a problem with the new hybrid.

  • Hybrid QA (Omar)

    "Old firmware": used for the devboard in the test run
    "new firmware": prepared last year
    "latest firmware": as of this week

    Omar tested hybrids and observed:
    Channels missing in the data readout with the "new" and "latest" firmware. He also saw that in the new firmware, changing the flag to flip the chip ordering has no effect. The "old" firmware show things as expected and was used for the QA. Ryan and Ben have an idea on why this is happening and will apply a fix.

    H11 and H12 passed Q&A. He will go through H11-H16 today and drop them off at SLAC. 

    L4-6 half-module 2 I-V curve show low (~10's of nA) before bonding APV chips on both sides up to 500V. After bonding chips currents increase consistent with what we've seen for module 1 and L1-3 test run modules. It's not obvious what the cause of that current path is but we think it's not gonna affect our data quality. 

  • High-speed tests (Ben)

    Mostly ready, probably be able to run the tests late Monday or Tuesday.

  • Reading data with FEB (Ben)

    Mostly software work and pretty much ready beginning of next week. Need to coordinate with Omar/Sho/Pelle to take calibration runs, Ben will contact when ready.

  • Grounding and shielding: document
    • Modifications to signal flange board
    • Modifications to FEB

    Decided that we will only bind one single hole to support structure and add a jumpered connection to AGND (OFF by default). 
    Pelle will add these to the board pages.

  • Procurement checklist
    • Fibers 

    Ryan will take care of sending that order out.
  • Schedule feedback and discussion

    Discussed schedule risks and if we can outsource tasks in the DAQ. Flex cables is the most obvious candidate task and we'll think about it. We might be able to get help internally from SLAC to drive the layout and mechanical aspect (schematics are simple). 

  • AOB

 

  • No labels