Naming Conventions for Control System Devices

Note : this document is currently being updated. Notably, the examples are not yet finalized.

Contents:

Current Device Names

Click Here for a list of currently named devices.

Previous Versions

Defining a Naming Convention for devices in the LCLS Control System has been an iterative process. The first version was a variation on the existing SLAC SLC Naming Scheme. With the LCLS and the addition of X-Ray transport lines and experimental halls, we decided to extend the Original LCLS scheme to what is described here.

Format Summary

Devices are named with a sequence of characters in the following format:

DeviceType : Area : Position

An example of a device name looks like this:

QUAD : IN20 : 122 

There are functions and parameters associated with devices, which also need to be identified. An Attribute field provides that information:

DeviceType : Area : Position : Attribute 

The DeviceType and Position fields also have optional characters. We can denote optional symbols with [ and ], so the names can be described as:

[ DeviceType ] DeviceDetail : Area : [ PositionPrefix ] Position : Attribute 

To summarize:

  • A Device is named by 3 fields, separated by 2 colons.
  • A function or parameter of a device, known internally to the Control System as a Process Variable (PV) is named by the 3-field device name followed by another colon, and the Attribute field.

Constraints

  • All fields are required to be Upper Case characters the the exception of the Attribute field which is allowed to be mixed case with the following constraints.
    • There must be zero requirements for access to the PV from the SLC Control System (SCP). The SLC Control System is case insensitive and will be unable to read the mixed case PVs.
    • Is it strongly suggested that UpperCamelCase* be used for mixed case, however all uppercase still should be used as much as possible when creating new PV names. We realize that when we bring in support from other labs, the case may have a different format, but all PVs names that we create should either be all upper case or UpperCamelCase .
    • The attribute part of the name is the only part that is allowed to have mixed case, device, area, and unit number fields are still required to be all upper case.
    • It is not allowed to have different PVs which only differ in case.
  • The entire name is currently restricted to 28 characters or less.
  • The DeviceType is between 3 and 9 characters in length. The generic type of device is denoted by 3 or 4 characters, and may optionally be followed by an underscore with 3 or 4 more characters to indicate details of that device.
  • The Area field is 4 characters in length, and describes one of the 21 areas currently in the LCLS Accelerator.
  • The Position field can be up to 4 characters in length, which includes either an optional 1-character position prefix followed by 3 digits (for devices associated with the beam line) or 2-character prefix followed by an index for non-beam-line devices which are itemized.
  • The Attribute field must be 12 characters or less.
  • All PV names must be unique in the control system. This includes being unique across machines such as LCLS, SLC, FACET, FACET-II, and LCLS-II.

The optional fields are meant to accommodate the SLC-Aware IOC mechanism, which has even more restrictions placed on Device names. For more information, from the original Naming Convention plans, click here.

The Fields

The DeviceType, Area and Position fields together identify a specific, accessible device. The Attribute field identifies some function or parameter associated with that specific device. In general, all devices identified as type DeviceType will all have the same Attribute fields available.

Ideally, users will not have to type names into a computer system. The names can be selected from a list of options, or on a screen showing a representation of the device.

DeviceType

Device types are from 3 to 9 characters in length. The device type can be real or virtual, and describes only a general type of device, not a specific instance of a device. We often think of Device Types as large elements, such as Quadrupole magnets, BPMs, and so forth. These larger devices are typically accessed by Operators and Physicists, but they include smaller constituent devices which can also be accessed, perhaps for testing purposes.

These smaller components are not typically visible to the Operator. For example, ADC is a general device type which might have diagnostic information available. The ADC_SCAN refers to a more specific type of device, still with diagnostic information, but with perhaps more specialized functions.

Another category of DeviceType is virtual. This refers to a compound type of device that has no single piece of hardware associated with it. Instead, it is a value computed or derived from a set of other devices. The distinction between real or virtual device types are not typically represented in the name, but they are mentioned here for completeness.

Thus, DeviceType can represent either a compound or component device.

  • Compound devices are typically made available to the Operator, and may be thought of as being real or virtual.
  • Component devices are typically available to Engineers and technicians.

Any type of device can have more specific information associated with it. This information is a suffix which is appended to an underscore, after the base DeviceType field. For example, ADC indicates an ADC module, and ADC_SCAN represents a Scanning ADC. The name ADC_PEAK represents a Peak-sensing ADC.

Base Device Type

First, lets consider the base DeviceType values without the detail suffix.

The following table lists magnet and magnet power supply Compound DeviceTypes:

Table 1.0

Value

Device Type

Controllable

BEND

Bend (Large Dipole) Magnet

Y

BTRM

Bend Magnet Trim Windings

Y

KICK

Kicker Magnet

Y

MGNT

General Magnet

N

QTRM

Quad Magnet Trim Windings

Y

QUAD

Quadrupole Magnet

Y

SOLN

Solenoid Magnet

Y

XCOR

Horizontal Steering Corrector Magnet

Y

YCOR

Vertical Steering Corrector Magnet

Y

USEG

Undulator Magnet Segment

Y

WIGG

 Wiggler Magnet

Y

The following is a list of power supplies

Table 1.0.1

Value

Device Type

Controllable

HVPS

High Voltage Power Supply

Y

LGPS

Large Power Supply

Y

SMPS

Small Power Supply

Y

PS

Generic Power Supply

Y

The following table lists RF system Compound DeviceTypes:

Table 1.1

Value

Device Type

Controllable

ACCL

Accelerating Section

Y

KLYS

Klystron

Y

LLRF

Low Level RF

Y

PCAV

Beam Phasing Cavity

Y

TCAV

Transverse Deflecting Cavity

Y

REFS

Machine Parameters Set Points

Y

The following table lists vacuum Compound DeviceTypes:

Table 1.2

Value

Device Type

Controllable

VGBA

Vacuum Gauge Baratron

N

VGCM

Vacuum Capacitance Manometer

Y

VGKL

Vacuum Gauge associated with a Klystron

N

VGPR

Vacuum Pirani Gauge

N

VGCC

Vacuum Cold Cathode Gauge

Y

VGEX

Vacuum Extractor Gauge

Y

VGTC

Vacuum ThermoCouple Gauge

N

VGCP

Vacuum Convection-enhanced Pirani Gauge

N

VGHF

Vacuum Hot Filament Gauge

Y

VGOS

Vacuum Overpressure Switch

N

VGXX

Combination Vacuum Gauge

N

VVKL

Vacuum Valve associated with a Klystron

Y

VVPG

Vacuum Pneumatic Gate Valve

Y

VVMG

Vacuum Manual Gate Valve

N

VVPR

Vacuum Pneumatic Roughing Valve

Y

VVMR

Vacuum Manual Roughing Valve

N

VVPF

Vacuum Pneumatic Fore Valve

Y

VVMF

Vacuum Manual Fore Valve

N

VVPV

Vacuum Pneumatic Vent Valve

Y

VVMV

Vacuum Manual Vent Valve

N

VVFS

Vacuum Valve Fast Shutter

Y

VVFV

Vacuum Valve Fast Valve

Y

VVFL

Vacuum (Mass) Flow Valve

Y

VPKL

Vacuum Pump associated with a Klystron

Y

VPDF

Diffusion Pump

N

VPCR

Cryo Pump

Y

VPIO

IOn Pump

Y

VPTM

TurboMolecular Pump

Y

VPTS

Ti Sublimation Pump

Y

VPNI

Vacuum Pump NEG Ion Combination

Y

VPNG

Vacuum Pump NEG (Non-Evaporable Getter)

sometimes Y

VPFO

Fore Pump

Y

VPRO

Roughing Pump

Y

The following table lists system Compound DeviceTypes:

Table 1.3

Value

Device Type

Controllable

AIR

Compressed Air System for Pneumatic Control

N

AMS

Air Monitoring System for measuring radiation levels from intake samples

N

NITR

Process Nitrogen Gas for Attenuator/Detector

Y

ARGO

Process Argon Gas for Attenuator/Detector

Y

BCS

Beam Containment System

N

HVAC

Heating, Ventilation, and AC System

N

LASR

Laser System

N

WATR

Water System

N

MPS

MPS (Machine Protection System)

N

PPS

PPS (Personel Protection System)

N

The following table lists Compound DeviceTypes for beam synchronous acquisition:

Table 1.4

Value

Device Type

Controllable

ARRY

Group of BSA Channels for SLC-Aware only

N

APD

Avalanche Photo Diode

N

BLEN

Bunch Length Monitor

N

BPMS

Beam Position Monitor

N

CAMR

Camera for Optics and Beam Profile

Y

CRAD

Cerenkov Radiator

N

FARC

Faraday Cup

N

FREQ

Frequency Counter

N

JMTR

Joule Meter (for Laser)

N

MDEF

SLC Measurement Definition

Y

EDEF

EPICS Event Measurement Definition

Y

OTRS

OTR screen

Y

PD

Photo Diode

N

PHOS

Phosphor screen

Y

PMT

Photo Multiplier Tube

N

TORO

Toroid

N

YAGS

YAG screen

Y

PATT

Timing Pattern

N

WPM

Wire Position Monitor

N

The following table lists other Compound DeviceTypes:

Table 1.5

Value

Device Type

Controllable

APC

All Purpose Controller (e.g. Beckhoff raw signals)

Y

BMLN

Beam Line

N

CAMW

Web Cam

N

CATH

Cathode

N

COLL

Collimator

Y

DIAG

Diagnostic

Y

DUMP

Beam Dump

N

ECAT

Ethercat

Y

EXPT

Experiment

Y

FAN

Fan

Y



FARC



Faraday Cup

N

FREQ

Frequency Counter

N

FOIL

Diagnostic Foils, Slotted Foil

N

GATT

Gas Attenuator

Y

GDET

Gas Detector

Y

GJET

Gas Jet

Y

GUN

Gun

Y

HLS

Hydrostatic Leveling Sensor

N

KMON

K-monochromator

Y

LHTR

Laser Heater

N

LION

Long ION chamber

N

LVDT

Linear Variable Differential Transformer

N

MASK

Mask

N

MIRR

Optical Mirror

Y

PICS

Protection Ion Chamber Signal

N

PICM

MPS Protection Ion Chamber Signal

N

PLIC

Panofsky Long Ion Chamber

N

PKLS

Pockels Cell (photon attenuation)

Y

RADF

RADFET (radiation dose sensor)

Y

RADM

Radiation dose sensor

Y

ROOM

Room, vault, or tunnel

N

RTD

Resistive temperature detector

N

SATT

Solid Attenuator

Y

SBST

Sub-Booster

Y

SBI

Sub-Booster Interface Chassis

Y

SHUT

Shutter (mechanical, optical shutter)

Y

SLIT

Slit (mechanical, 2- or 4-jaw)

Y

STPR

Beam Stopper

Y

SPLR

Beam Spoiler

Y

TRGT

Target

Y

TANK

Diagnostic Tank

Y

THZR

THz Radiator

Y

UTIC

Universal Time Interval Counter

Y

TIU

Tone Interrupt Unit (for MPS)

N

WIRE

Wire Scanner

Y

WKFL

Wakefield Shield

Y

XTAL

Crystal Monochromator

Y

BKHF

Beckhoff coupler

Y

SCTR

Beam Scatterer

Y

The following table lists what are currently considered Component DeviceTypes that are either controllers or control modules:

Table 1.6

Value

Device Type

Controllable

EIOC

Embedded Input/Output Controller

Y

MOC

Motor Controller

Y

MCOR

MCOR Controller

Y

PAC

Phase and Amplitude Controller

Y

PLC

Programmable Logic Controller

Y

PSC

Ethernet PS Controller

Y

VGC

Vacuum Gauge Controller

Y

VPC

Vacuum Pump Controller

Y

VVC

Vacuum Valve Controller

Y

VFC

Vacuum Flow Controller

Y

The following table lists Component DeviceTypes for control system modules and instruments:

Table 1.7

Value

Device Type

Controllable

ADC

Analog-to-Digital Conversion Module

N

AFG

Arbitrary Function Generator

Y

DAC

Digital-to-Analog Conversion Module

Y

BPMP

Beam Position Module

N

DTIZ

Digitizer

N

CHAS

Input/Output chassis

N

CRAT

Input/Output (VME) Crate

Y

CV

CrateVerifier Module (CAMAC)

Y

DI

Digital Input Module

N

DIAG

Diagnostics

N

DIO

Digital Input/Output Module

N

DO

Digital Output Module

N

DMM

Digital MultiMeter

Y

DVM

Digital Voltmeter

Y

IDIM

16-bit Digital Input Module (CAMAC)

Y

IDOM

16-bit Digital Ouput Module (CAMAC)

Y

LDIM

32-bit Digital Input Module (CAMAC)

Y

EVG

Event Generator for Timing

Y

EVR

Event Receiver for Timing

Y

MODU

Non-specific Module

Y

MPG

Master Pattern Generator

Y

PAD

Phase and Amplitude Detector

N

PDU

Pulsed Delay Unit Module (CAMAC)

Y

PMTR

Power Meter

Y

PMGR

Power Management Module

Y

PNET

Pnet Module

N

SAM

SmartAnalog Module (CAMAC)

Y

SCLR

Scaler Module

N

TRIG

Spare Timing Trigger

Y

The following table lists Component DeviceTypes for the network:

Table 1.8

Value

Device Type

Controllable

ACSW

AC Switch

Y

CSWH

aTCA Carrier Switch

Y

GPIB

GPIB/LAN Gateway

Y

RTR

Router

N

SWH

Ethernet Switch

N

SCOP

Scope

N

TS

Terminal Server

Y

UPS

Uninterruptible Power Supply

N

WKUP

Walk-up ethernet connection

N

ICS

Intercom System

N

IOC

EPICS IOC

Y

PLC

Programmable Logic Controller

Y

PNA

Phase Noise Analyzer

Y

PSC

Power Supply Controller

Y

CAMR

Camera for Beam Line Optics

Y

CRAT

Intelligent VME Crates

Y

PC

Computer that is not an IOC

Y

WB

Wireless Bridge

N

Certain parameters or functions associated with a component device might be accessible from the compound device. For example, we might consider a water flow value as an independent, measurable quantity associated with a water line; it might be a transducer which produces pulses which are connected to a computer-readable counter. That value might be retrieved using a name like SCLR : IN20 : K701 : COUNT which indicates a scaler module in a VME crate in the klystron gallery at sector 20.

However, if the water is being used to dissipate heat from a Faraday Cup, then one would retrieve a value using a name like FARC : IN20 : IS998 : FLOW, which is a value based on the scaler measurement described above. The scaler must be accessible on its own since it might have some built-in diagnostic tests that are required for maintenance. The compound device will typically give the component's measurement in more appropriate engineering units.

Device Detail Code

The optional characters that come after the underscore provide detail. The following table lists the Detail Codes associated with specific device types.

Table 1.9

DeviceType Name

Purpose

ADC_SCAN

Scanning ADC

ADC_PEAK

Peak-sensing ADC

ADC_CHRG

Charge Integrating ADC

The Area Field

The Area field is 4 characters in length. The following diagram and table lists the approved area names. A larger version of the diagram, can be found at the end of this page.

Table 1.10


Area

Physical Location

Access Buildings

ACR0

Accelerator Control Room (B052)

B005

Building 5

B24

Building 24  (development)

B25

Building 25  (development)

B34

Building 34  (development)

B44

Building 44 - Klystron Test Lab

B81

Building 81 - MMF 

B106

Building 106

B106

Building 136

B911

Building 911

B911

Building 911

B911

Building 911

B921

Building 921

ASTA-UED Facility Area

AS01

Accelerator Structure Test System

Injector Machine Areas

LR10

FACET-II Laser Room (Upstairs, near sector 10)

LR20

LCLS Laser Room (Upstairs, near sector 20)

LA20

FACET Laser Room (Upstairs, near Sector 20)

IN10

FACET-II Injector

IN20

LCLS Injector

LINAC Areas

LI00

LINAC Sector 0

LI20

LINAC Sector 20

LI21

LINAC Sector 21

LI22

LINAC Sector 22

LI23

LINAC Sector 23

LI24

LINAC Sector 24

LI25

LINAC Sector 25

LI26

LINAC Sector 26

LI27

LINAC Sector 27

LI28

LINAC Sector 28

LI29

LINAC Sector 29

LI30

LINAC Sector 30

Beam Switch Yard

For the entire beam switch yard area spanning from the wooden door to the Muon Shield, the device

positions shall range from 100-999, consistently across all beam lines, such that the unit numbers

 match up in Z-position across all beam lines.

MCC0

Main Control Center (B005) OBSOLETE. Replaced with ACR0

CLTH

Copper LINAC to Hard Line

CLTS

Copper LINAC to Soft Line

BSYH

Beam Switch Yard Hard Line

BSYS

Beam Switch Yard Soft Line

BSYA

Beam Switch Yard A-Line

SLTH

Superconducting LINAC to Hard Line

SLTS

Superconducting LINAC to Soft Line

SLTD

Superconducting LINAC to Dump Line

BSYS

Beam Switch Yard South Arc

LINAC to Undulator Machine Areas

LTU0

LINAC-to Undulator directly after BSY

LTU1

LINAC-to-Undulator Line 1

Undulator

UND1

Undulator on Line 1

Dump

DMP1

Beam Dump on Line 1

Photon Areas

FEE1

Front End Enclosure on Line 1

NEH1

Near Experimental Hall on Line 1

XRT1

X-Ray Tunnel on Line 1

FEH1

Far Experimental Hall on Line 1

XTA Facility Area

XT01

X-Band Test Area

Global Areas 

SYS0

LCLS-I System

SYS1

FACET and FACET-II System

SYS2

LCLS-II System

SYS3

LCLS-III System

SYS4

NLCTA System

SYS5

SPEAR Systems

SYS6

X-Band Test Area

SYS7

ASTA Test Area

SYS8

 Klystron Test Lab (B44)

SYS9

Site - HE Cryo Test Facility (IR4, etc.) and Radiation Monitoring outside gate

SYSW

Global System West

SYSE

Global System East

SITE

Remote SLAC Location, not associated with a service building

GBL0

Global to multiple Machines (decommissioned)

Special IN20 and BSY area Alarm Summary names   * * Please note that these areas are special for alarms ONLY and not for general use.*

The Position Field for Devices associated with the Beam Line

The Position Field contains an optional 1-character Position Prefix, followed by a 3-digit Position Code. The Prefix designates a major location within the device's area, and the Code indicates a sub-location within that Area. An example of a Position Field might be K120.

Position Prefix

Examples of Position Prefixes for the LCLS Injector area are B for Beam Line, K for Klystron Gallery, or L for Laser Room. An example of a Position Code is 900, which might indicate an instance of a device that is approximately 90% along the distance of the associated area.

If the prefix is missing, it is assumed to be B, which indicates Beam Line. Thus, a Position Field of 420 is identical to B420. This works to support the SLC-Aware IOC, since the Position Prefix is not sent from the SLC Control System.

Each Area has its own set of Position Prefixes. For example, there is no Klystron Gallery associated with the Undulator area. The following table indicates Position Prefix Codes for each of the LCLS Areas.

For the X-ray areas, the prefix is a digit representing the _branch _ line, ie, a situation where the beam line has two or more forks in the X direction; typically it is the final or primary destination Hutch number. Then, the leading digit in the 3-digit position in the Near and Far Experimental Halls is rounded to 1..6 to represent Hutch 1..6, respectively. Note that on the path to a final destination, a branch can pass through other Hutches. Also, the "through" line eventually disappears at the last branch point.

Table 1.11



Area

Position Prefix Codes

Physical Position

LR20

L

Laser Room (Upstairs, near sector 20)




IN20

B

Beam Line


K

Klystron Gallery


W

Waveguide


R

RF Equipment Hut


L

Laser Line


M

Manifold




LI20

B

Beam Line


W

Waveguide


K

Klystron Gallery


M

Manifold


E

Instrumentation Equipment Alcove




LI21

B

Beam Line


W

Waveguide


K

Klystron Gallery


M

Manifold


E

Instrumentation Equipment Alcove




LI22

B

Beam Line


W

Waveguide


K

Klystron Gallery


M

Manifold


E

Instrumentation Equipment Alcove




LI23

B

Beam Line


W

Waveguide


K

Klystron Gallery


M

Manifold


E

Instrumentation Equipment Alcove




LI24

B

Beam Line


W

Waveguide


K

Klystron Gallery


M

Manifold


E

Instrumentation Equipment Alcove




LI25

B

Beam Line


W

Waveguide


K

Klystron Gallery


M

Manifold


E

Instrumentation Equipment Alcove




LI26

B

Beam Line


W

Waveguide


K

Klystron Gallery


M

Manifold


E

Instrumentation Equipment Alcove




LI27

B

Beam Line


W

Waveguide


K

Klystron Gallery


M

Manifold


E

Instrumentation Equipment Alcove




LI28

B

Beam Line


W

Waveguide


K

Klystron Gallery


M

Manifold


E

Instrumentation Equipment Alcove




LI29

B

Beam Line


W

Waveguide


K

Klystron Gallery


M

Manifold


E

Instrumentation Equipment Alcove




LI30

B

Beam Line


W

Waveguide


K

Klystron Gallery


M

Manifold


E

Instrumentation Equipment Alcove




BSY0

B

Beam Line


E

Surface Equipment Building (Bldg 136, 106, 106, 5)


P

BSY Pump Station (P0, P1, P2, P3, P5)







BSYA

B

Beam Line


E

Surface Equipment Building (Bldg 136, 106, 106, 5)


P

BSY Pump Station (P0, P1, P2, P3, P5)







BSYB

B

Beam Line


E

Surface Equipment Building (Bldg 136, 106, 106, 5)


P

BSY Pump Station (P0, P1, P2, P3, P5)







BSYN

B

Beam Line


E

Surface Equipment Building (Bldg 136, 106, 106, 5)


P

BSY Pump Station (P0, P1, P2, P3, P5)




BSYS

B

Beam Line


E

Surface Equipment Building (Bldg 136, 106, 106, 5)


P

BSY Pump Station (P0, P1, P2, P3, P5)




LTU0

B

Beam Line


E

Surface Equipment Building (Bldg 5 or 911)




LTU1

B

Beam Line


E

Surface Equipment Building (Bldg 105 or Bldg 406 or


 P

Pump Line



Bldg 911 or Bldg 912 or Bldg 913)




MCC0

E

Equipment Rack Area (Bldg 5) OBSOLETE


C

Control Room




UND1

B

Beam Line


E

Surface Equipment Building (Bldg 913,921)




DMP1

B

Beam Line


E

Surface Equipment Building (Bldg B921)




FEE1

B

Beam Line



Hard (High-energy) through Branch (South) to Hutch 3 and beyond


1

Soft (Low-energy) Branch (North) to Hutch 1


2

Soft (Low-energy) Branch (Middle) to Hutch 2


E

Equipment Rack Alcove or Surface Equipment Building (Bldg 940)




NEH1

B

Beam Line



Hard (High-energy) Branch (South) to Hutch 3 and beyond


1

Soft (Low-energy) Branch (North) to Hutch 1


2

Soft (Low-energy) Branch (Middle) to Hutch 2


E

Surface Equipment Building (Bldg 950)




XRT1

B

Beam Line



Through Branch


4

North Branch to Hutch 4


5

Middle Branch to Hutch 5


6

South Branch to Hutch 6


E

Surface Equipment Building (Bldg 960)




FEH1

B

Beam Line


4

North Branch to Hutch 4


5

Middle Branch to Hutch 5


6

South Branch to Hutch 6


E

Surface Equipment Building (Bldg 999)

XT01

B

Beam Line



Surface Equipment Building (Bldb 062)

SYS0


LCLS-I System

SYS1


FACET and FACET-II System

SYS2


LCLS-II System

SYS3


LCLS-III System

SYS4


NLCTA System

SYS5


SPEAR System

SYS6


X-Band Test Area

SYS7


ASTA Test Area

SYS8


Klystron Test Lab (B44)

SYS9


Site - HE Cryo Test Facility (IR4,etc), Radiation Monitoring outside gate

SYSW


Global System West

SYSE


Global System East

GLB0


Global to all Machines

Position Code

The Position Code is intended to provide a quick locator of the instance of a given device type. The code is 3 digits representing a relative index of the device's location. A Position Code of 100 means that the associated device is roughly positioned in the first 10% of its Area. Likewise, a code of 900 indicates the device is near the end of its Area, roughly 90% along.

Some general notes:

  • As one might expect, the Position Code_s must be unique for the given _DeviceType in the given Area. For instance, if there are 2 Quadrupole magnets in the Injection area beamline, they might be named QUAD : IN20 : 600 and QUAD : IN20 : 605 respectively.
  • The Position Code is sequential if relating to a device in a Beam Line area. Larger numbers indicate they are physically further along in the area. There are exceptions to this rule with some legacy equipment, but the rule is always followed for new equipment. Furthermore, the code must be consistent with other devices sharing that same area. For example, the Quadrupole magnets from the previous example had Position fields of 600 and 605. If there was a Toroid to be positioned between them, it would have a Position field of 601 to 604. In situations where there is too much equipment in a small area, the numbers are allowed to overlap. So, it would be acceptable if the toroid was named TORO : IN20 : 600; the Position Code is intended to give an indication of the position, not an exact location. This is not necessarily the case for devices in Surface Buildings, the Klystron Gallery, or other areas. In those cases, many devices may be colocated in adjacent rack space, with no indication of the start or end of the area.
  • Numbering in certain Position Codes might follow other conventions as well. For instance, a vacuum pump located on a waveguide in Sector 23 might be named VPIO : LI23 : W420. This indicates that it is associated with the waveguide for Klystron 4, and is located roughly 20% of the way along that waveguide, measured from the Klystron. In this example, one could find the vacuum pump upstairs near Klystron 4, in sector 23. If the name was VPIO : LI23 : W480, then the pump is located on the same klystron's waveguide, but at roughly 80% the distance from the klystron. Thus, the last 2 digits would indicate whether the pump is on the upstairs or downstairs runs of the waveguide.
  • Note that using the Klystron number in this example is reasonable, since it is numerically close to the position as a percentage of the area length. Since each Linac sector has 8 klystron, using the digit 4 to indicate Klystron 4 is easier to remember than using the digit 5 to indicate 50% of the distance, which equates to the 4th klystron.

The Position Field for Itemized Control System Devices

For itemized control system devices such as IOCs, crates, and network switches, the Position Field contains a 2-character Subsystem Prefix, followed by a 2-digit Index from 01 to 99. (A description of the IOC naming convention is available here.) The Prefix designates a subsystem of the control system as follows in Table 1.12. The format of the control system devices is <ioc type>:<area>:<subsystem prefix>## The definition for each of the above field can be found in able 1.12.1.

For the S20-30 linac upgrade, some CAMAC modules (which have fixed slot location) have been give the Position <cratenumber><2-digit slot number>. For example, crate 1 slot 2 would have a Position value of 102.

For the entire beam switch yard area, spanning from the wooden door to the Muon Shield, the device positions shall range from 100-999, consistently across all beam lines, such that the unit numbers match up in Z-position across all beam lines.


Table 1.12

Subsystem Prefix for

Standard IOC

Alarm IOC

Subsystem Prefix for

Network Display and

Alarm Config Filenames



Subsystem Description

CD



Controls Department, for development only!!

LS

sioc-<area>-lasr00

lasr

Laser Steering

PM

sioc-<area>-prof00

prof

Profile Monitor

ID

n/a

id

Insertion Device

IM

sioc-<area>-gadc00

toro

Toroid

BL

n/a

blen

Bunch Length Monitor

BP

sioc-<area>-gadc00

bpm

Beam Position Monitor

MC

mc

mc

Motion Control

CV

sioc-<area>-rf00

camac

AM

n/a

align

Alignment Mirror

MG

sioc-<area>-mgnt00

mgnt

Magnet

EV

sioc-<area>-evnt00

evnt

Event (Timing) System

RF

sioc-<area>-rf00


Low-Level RF Master

RP

sioc-<area>-rf00


Low-Level RF PLL

RC

sioc-<area>-rf00


Low-Level RF PAC

RD

sioc-<area>-rf00


Low-Level RF PAD

KY

sioc-<area>-rf00

klys

High Power RF  (Klystron Solenoid PS and  Modulator ).

MP

sioc-<area>-mps00

mps

Machine Protection System

ML

n/a


Matlab IOC with Generic PVs

NW

sioc-<area>-ntwk00

ntwk

Network Device, terminal servers, switches routers, scopes, function generators, ...

PP

sioc-<area>-pps00

pps

Personnel Protection System

BC

sioc-<area>-bcs00

bcs

Beam Containment System

SP

 n/a

 sp

Shared platform

TM

sioc-<area>-temp

temp

Temperature Monitor

TR

sioc-<area>-fbck00


Fast Feedback Controller

VA

sioc-<area>-vac00

vac

Vacuum

WA

sioc-<area>-util00

watr,hvac,air,coll

Water, HVAC, Smoke Alarms, Air, scraper

WS

sioc-<area>-ws00

ws

Wire Scanner

FB

sioc-<area>-fbck00

fbck

Feedback

AD

n/a

align

Alignment Diagnostic System (Wire Position Monitors + Hydrostatic Leveling Sensors)

EX

n/a

n/a

Experimental Support.

UC


n/a

Undulator Motion Control

DU

 

n/a

Delta Undulator  (Should be merged in to undulator control application)

Table 1.12.1

IOC type

Description

eioc

Embedded IOCs

ioc

Hard IOCs

sioc

Soft IOCs running on linux

vioc

Soft IOCs running on linuxRT - new standard shall use sioc as of  June 2017

Area

IN20,LI20-LI30,BSY0,LTU0,LTU1,UND1,DMP1

System

Two character abbreviation for subsystem previx, see Table 1.12

##

Two digits, 01-99

The Attribute Field

The Attribute field consists of 12 or less alphanumeric symbols, which identify a function or parameter associated with a device.

Most devices have values which can be measured, but not all devices have values which can be controlled. Certain attributes are in place because of the SLC-Aware IOC, because the SLC Control System will transmit these attributes.

Table 1.13

Attribute

Function Affected or Parameter Described

Controllable

VOLT or V or VACT

Actual Voltage

N

VOLTSETPT or VSETPT

Voltage Setpoint

Y

VOLTRBCK or VRBCK

Voltage Setpoint Readback

N

VDES

Desired Voltage

Y

I or IACT

Current Readback

N

ISETPT

Current Setpoint

Y

IDES

Desired Current

Y

B or BACT

Magnetic Field Readback

N

BDES

Desired Magnetic Field

Y

AMPL or AACT

Amplitude Readback

N

AMPLSETPT

Amplitude Setpoint

Y

ADES

Desired Amplitude

Y

PHASE or PACT

Phase Readbask

N

PHASESETPT

Phase Setpoint

Y

PDES

Desired Phase

Y

MAD

Mad Name

N

Z

Z-Position

N

PRESS or P

Pressure, such as Vacuum

N

PRESSSETPT or PSETPT

Pressure, such as Vacuum

N

TEMP

Temperature

N

TEMPSETPT

Temperature

N

TMIT or Q

Bunch Charge

N

FLOW

Flow Rate

N

FLOWSETPT

Flow Rate

N

SPEED

Speed

N

RAMPRATE

Ramp Rate

N

LOSSRATE

Loss Rate

N

WIDTH

Pulse Width

N

WIDTHSETPT

Pulse Width

Y

DELAY

Pulse Delay

N

DELAYSETPT

Pulse Delay

Y

TDES

Pulse Delay

Y

TABS

Absolute Time

N

TIME

Delta Time

N

TIMESETPT

Delta Time

Y

TOD

Time-of-Day

N

COUNT or CNT

Count

N

COUNTSETPT or CNTSETPT

Count

Y

CENTER or CTR

Center

N

CENTERSETPT or CTRSETPT

Center

Y

ID or IDENT

Unique (Integer) Identifier

N

IDENTSETPT

Unique (Integer) Identifier

Y

NAME

Unique (String) Identifier

N

ENERGY

Energy

N

ENERGYSETPT

Energy

Y

POWER

Power

N

POWERSETPT

Power

Y

FREQ

Frequency

N

FREQSETPT

Frequency

Y

ANGLE

Angle

N

ANGLESETPT

Angle

Y

POSN

Position

N

POSNSETPT

Position

Y

GAP

Gap

N

GAPSETPT

Gap

Y

XAVG

Horizontal Value

N

YAVG

Vertical Value

N

ZAVG

Longitudinal Value

N

UAVG

Diagonal Value

N

SAVG

Beamline Position Value

N

XRMS

Horizontal Value

N

YRMS

Vertical Value

N

ZRMS

Longitudinal Value

N

URMS

Diagonal Value

N

SRMS

Beamline Position Value

N

XHIGH

Horizontal Value

N

YHIGH

Vertical Value

N

ZHIGH

Longitudinal Value

N

UHIGH

Diagonal Value

N

SHIGH

Beamline Position Value

N

XLOW

Horizontal Value

N

YLOW

Vertical Value

N

ZLOW

Longitudinal Value

N

ULOW

Diagonal Value

N

SLOW

Beamline Position Value

N

XSETPT

Horizontal Value

Y

YSETPT

Vertical Value

Y

ZSETPT

Longitudinal Value

Y

USETPT

Diagonal Value

Y

SSETPT

Beamline Position Value

Y

XHIST

Horizontal Value

N

YHIST

Vertical Value

N

ZHIST

Longitudinal Value

N

UHIST

Diagonal Value

N

SHIST

Beamline Position Value

N

CHECK

Check

Y

CTRL

Do a Specific Action

Y

GO

Do an Action

Y

RESET

Reset

Y

RESTART

Restart (stop and go)

Y

STOP

Stop doing an Action

Y

Examples

Here are a few examples of device names.

  • VVPG:IN20:155 Vacuum valve, pneumatic gate, near the start of the injection area beamline.
  • XCOR:IN20:811 X-axis corrector magnet, near the end of the Gun Spectrometer beamline.
  • YCOR:IN20:812 Y-axis corrector magnet, close to the X-axis corrector.
  • BPMS:IN20:821 Beam Position Monitor, near the end of the Gun Spectrometer beamline, and downstream of the Corrector magnets in the previous example.
  • BEND:IN20:931 Bending dipole magnet near the end of the injection area, in the Injection Spectrometer beam line.


  File Modified
PDF File SLAC-Naming-Conventions.pdf Feb 16, 2011 by Matt Boyes
File SLAC-Naming-Conventions.vsd Feb 16, 2011 by Matt Boyes
PNG File SLAC-Naming-Conventions.png Feb 16, 2011 by Matt Boyes

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