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CompanyProduct NameViscosity (centipoise)

Thermal Conductivity

w/(m-K)

Cure Time @ Temp

Strength

(psi & N/mm^2)

Working HoursDensity

Electrical resistivity

ohm-cm

Radiation HardnessType?LinkNotes
Desired values < 200001

temp ~ 22C

time: ~1 day

See currently used glue: SE 4445 CV Kit  HighHighGlue (epoxy) , Gel, or Tape  

AI

Technology

Prima-Bond:

EG7655-LV

300000 cp

1.7 ± 10%

4 hr @85 C

2 hr @100C

1 hr @125C

30 mins @150 C

Die Shear 2546-2795 psi

Push-off Strength >1500 psi

Lap Shear : 1000 psi

6.9 N/mm^2

skin irritant2.3 gm/cc

>1E+14

(150C/60 min)

 Glue

https://www.aitechnology.com/product/prima-bond-eg7655/

Datasheet

 
AI Technology

Prima-Bond:

EG7658

3050003.67 W/m C

4 hr @85 C

2 hr @100C

1 hr @125C

30 mins @150 C

 

Lap Shear: 1800 psi

6.9 N/mm^2

skin irritant    Gluehttps://www.aitechnology.com/uploads/pdf/products/dieattach/eg7658t.pdf 
Ellsworth AdhesivesThermally Conductive Gel Gray: SE 4445 CV Kit140001.26

45mins @ 125 C

-skin irritant2.4 gm/cc7E+15not good enoughGel (silicone based)Ellsworth Adhesives 
PolytecTC418

40k-60k

1.6

48 h @ 23C

Young modulus: 40 N/mm^2

Lap shear strength: 2.9 N/mm^2

   being testedGlue/ Epoxy (flexible)Being tested as good options by John Matheson 
Epo‐TekT 7109‐19

40k-70k

1.3

"sets harder than SE4445"

Lap Shear 1434 psi

  

> 5E+12

being testedEpoxy (flexible)Being tested as good options by John Matheson 
Masterbond
Supergel
9A0
         
epoxy
gel
could be used in combination with something stronger (J Matheson) 
Dow CorningSE448619k1.53120 hr @ 24C

240 psi

1.65 N/mm^2

--2.00E+14--Dow CorningSE4445 
Dow Corning3-675110k1.1

50hr @100C

40hr @125C

10hr @150C

555 psi

3.82 N/mm^2

--7.20E+13  Dow CorningSE4445 
Dow Corning3-675311k1.4

50hr @100C

40hr@125C

10hr @150C

540 psi

3.72 N/mm^2

--7.20E+13  Dow CorningSE4445 
Dow CorningSE44103.5k0.9230hr @150C370--1.00E+15 EncapsulantsDow CorningSE4445 
Dow CorningQ3-36004.7k0.77

60hr @125C

30hr @150C

NA--1.00E+13 EncapsulantsDow CorningSE4445 
Dow CorningSE4440-LP3.6k0.8330min @120CNA--1.00E+15 GelDow CorningSE4445 
Dow CorningSE4446CV22k0.95

7hr @RT

3.5hr @100C

2.5hr @125

1.9hr @150C

NA--1.00E+15 GelDow CorningSE4445 
Dow Corning Sylgard 18666.77k0.2125min@100C 15min@125C  15min@150C305--5.00E+15  Sylgard® 186 Silicone Elastomer 
             
Stycast2850FT

64000 64k (for Catalyst 9) and 23 23k (for catalyst LV)

1.25 for Catalyst 9

1.02 for 23 LV

 lhcb tested up to 10 N   tested up to fluence of  6 to 8×10^(15) MeVneq/cm2 

https://lartpc-docdb.fnal.gov/0000/000059/001/stycas2850.pdf

Adhesive tested by LHCb

 
HuntsmanAraldite 201130-45k cp0.22 W/m*K @23C7-10 hrs room temp

Avg lap shear strength: 1) 17-25 MPa (metal-metal)

2) 10-20 (plastic-plastic)

   tested up to fluence of  6 to 8×10^(15) MeVneq/cm2 Adhesive tested by LHCb 
HuntsmanAraldite 2020150 cp 16 hrs @23C, 3 hrs @ 40C

Avg lap shear strength: 1) 13-25 MPa (metal-metal)

2) 2-7 (plastic-plastic)

       
3M (goes to space with NASA)Scotch-Weld Epoxy Adhesive (2216)800000.0326 W/mK

90 min @ 24 C

 

Overlap Shear: 464 E 3 psi @ 24 C

3200 N/mm^2

 

 

    Glue (epoxy)  
3MVHB Tape 5909- 

Temperature Resistance:

Short Term: 121 C

Long Term : 82 C

Peel Adhesion:

N/100mm

  720 kg/m3 Tape3M VHB Tape 5909 
3MHigh Temperature Acrylic Adhesive 100 (9461P)   

Peel Adhesion:

LHC-b tested up to 10N

   tested up to fluence of  6 to 8×10^(15) MeVneq/cm2Epoxy3M 9461P 
AMEC ThermasolMPC 25 Thermal Insulator, Phase Change Material 4 W/mKTemperature Resistance: 4     Wax

AMEC Thermasol MPC25

Datasheet

 
AMEC ThermasolMPC 801  Temperature Resistance: 8.0     Wax  
AMEC ThermasolMPC 315  Temperature Resistance: 5.0     Elastomer  
             

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