Confluence will be down for maintenance June 14 2024 at 6AM PT.
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- Board must fit into a 7.8cm (3.071") wide x 4.6cm (1.811") high x 10cm (3.937") deep cavity
- Mounting hole requirements:
- 4x non-plated mounting holes
- 2x in-line ASIC
- 2x in-line with mating connector (to stabilize)
- Board Material:
- Board Thickness:
- standard 1.6mm thickness
- same as CHESS1
- Allow board components:
- ASIC, capacitor (ceramic only) , wire bonds
- Not allow board components:
- Resistors, plastic/metal connectorconnectors
- HV through the connector
- ASIC-to-board epoxy material:
- Wire bonds Material:
- aluminum wedge wiring bonding
- ASIC Thermal Management Plan:
- Needs to be able to add cold plate
- Need to assign a mech. eng. to design the cold plate (Action Item for Su Dong)
- Board Connector:
- Hard gold finger edge connector
- Able to test the daughter board before and after radiation without unsoldering/soldering any component:
- Achieved via the edge connector
- Only implement the high speed digital signals
- Off load the test structure testing to the CHESS1 carrier board
- No right side wiring bonding pads
- Requires a different CHESS2 daughter card design for CHESS1 board
- Place the chip 1mm from the edge of the board
- Metal pad underneath to the chip?
- Add cutout in the PCB board (Action Item for JJJ to define this)Hole for laser from the backside?
Carrier Board Requirements:
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{"serverDuration": 53, "requestCorrelationId": "d9eb4d69c38d4653"}