Daughter Board Requirements:

• Board + cables needs to fit within must fit into a 7.8cm (3.071") wide x 4.6cm (1.811") high x 10cm (3.937") deep cavity
  
  • Drawing of the cavity
  • No cabling requiring
• Mounting hole requirements:
  • ??? 4x non-plated mounting holes
• Board Material:
  
  • FR4
    
  • same as CHESS1
    
• Board Thickness:  
  • standard 1.6mm thickness
    
  • same as CHESS1 
    
• Allow board components:
  
  • ASIC, resistors, capacitor (ceramic only) , wire bonds
• Not allow board components:
  • Resistors, HV LEMOplastic/metal connector
• HV through the connector
• ASIC-to-board epoxy material:  
  • ???
• Resistor Type:
  
  • Thin film only
• Capacitor Type:
  
  • Ceramics only
• • Arldite
• Wire bonds Material:
  
  • aluminum wedge wiring bonding???
    
• ASIC Thermal Management Plan:  
  • ???
  HV LEMO:
  
  • Needs to be able to add cold plate
     
  • Need to assign a mech. eng. to design the cold plate  (Action Item for Su Dong)
  • Standard LEMO
  • But positioned as far as possible from the ASIC
• Board Connector:
  
  • Gold Hard gold finger edge connector??? 
• Able to test the daughter board before and after radiation without unsoldering/soldering any component:
  
  • Achieved via the edge connector
• Convenient HV and LV powering scheme:
  • HV through LEMO
  • LV through daughter-to-carrier cabling
• Only implement the high speed digital signals???
  • Off load the test structure testing to the CHESS1 carrier board???
    • No right side wiring bonding pads
  • Requires a different CHESS2 daughter card design for CHESS1 board???
• Add cutout in the PCB board
  • (Action Item for JJJ to define this)

Carrier Board Requirements:

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