Page History

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• Board + cables needs to fit within a ??? x ??? x ??? box
  • Drawing of the cavity
• Board Material:
  
  • FR4
    
  • same as CHESS1
    
• Board Thickness:  
  • standard 1.6mm thickness
    
  • same as CHESS1 
    
• Allow board components:
  
  • ASIC, resistors, capacitor, wire bonds, HV LEMO
• ASIC-to-board epoxy material:  
  • ???
• Resistor Type: thin
  
  • Thin film only
• Capacitor Type: ceramics
  
  • Ceramics only
• Wire bonds Material:
  
  • ???
• ASIC Thermal Management Plan:  
  • ???
• HV LEMO:
  
  • Standard LEMO
  • But positioned as far as possible from the ASIC
• Board Connector: gold
  
  • Gold finger edge connector???
• Able to test the daughter board before and after radiation without unsoldering/soldering any component:
  
  • Achieved via the edge connector
• Convenient HV and LV powering scheme:
  • HV through LEMO
  • LV through daughter-to-carrier cabling
• Only implement the high speed digital signals???
  • Off load the test structure testing to the CHESS1 carrier board and different
  • Different CHESS2 daughter card design

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