Page History

...

• Board + cables needs to fit within a ??? x ??? x ??? box
  • Drawing of the cavity
• Board Material: ???Material: FR4
  
  • same as CHESS1
    
• Board Thickness: ??? 1.6mm
  • same as CHESS1 
    
• Allow board components: ASIC, resistors, capacitor, wire bonds, HV LEMO
• ASIC-to-board epoxy material: ???
• Resistor Type: thin film only
• Capacitor Type: ceramics only
• Wire bonds Material: ???
• ASIC Thermal Management Plan: ???
• HV LEMO: Standard LEMO
  
  • But positioned as far as possible from the ASIC
• Board Connector: gold finger edge connector
• Able to test the daughter board before and after radiation without unsoldering/soldering any component
  
  • Achieved via the edge connector
• Convenient HV and LV powering scheme
  • HV through LEMO
  • LV through daughter-to-carrier cabling
• Only implement the high speed digital signals???
  • Off load the test structure testing to the CHESS1 carrier board and different CHESS2 daughter card design

...