Daughter Board Requirements:

• Board + cables needs to fit within a ??? x ??? x ??? boxmust fit into a 7.8cm (3.071") wide x 4.6cm (1.811") high x 10cm (3.937") deep cavity
  
  • Drawing of the cavity
• Board Material: ???
• • No cabling requiring
• Mounting hole requirements:
  •  4x non-plated mounting holes
    • 2x in-line ASIC
      • Herve will provide the dimensions for TCT
        
    • 2x in-line with mating connector (to stabilize)
      
• Board Material:
  
  • FR4
    
  • same as CHESS1
    
• Board Thickness:  Board Thickness: ???
  • standard 1.6mm thickness
    
  • same as CHESS1 
  • 
    
• Allow board components:
  
  • ASIC,
  resistors, capacitor, wire bonds, HV LEMO
  • capacitors (wire bond only) , 100 ohm LVDS termination resistors (wire bond only)
    • (Action Item for JJJ to get part number of wire bonded discretes)
• Not allow board components:
  • Non-LVDS termination resistors, plastic/metal connectors
• HV through the connector
• ASIC-to-board epoxy material: ???
• Resistor Type: thin film only
• Capacitor Type: ceramics only
•  
  • Arldite
• Wire bonds Material: ???
  
  • aluminum wedge wiring bonding
    
• ASIC Thermal Management Plan: ???  
  • Needs to be able to add cold plate
    
  • Need to assign a mech. eng. to design the cold plate  (Action Item for Su Dong)
  HV LEMO: Standard LEMO
  
  • But positioned as far as possible from the ASIC
• Board Connector:
  
  • Hard gold finger edge connector 
• Able to test the daughter board before and after radiation without unsoldering/soldering any component:
  
  • Achieved via the edge connector
• Convenient HV and LV powering scheme
  • HV through LEMO
  • LV through daughter-to-carrier cabling
• Only implement the high speed digital signals???
  • Off load the test structure testing to the CHESS1 carrier board and
    • No right side wiring bonding pads
  • Requires a different CHESS2 daughter card design for CHESS1 board
• Place the chip 1mm from the edge of the board
• Able to support a hole underneath the ASIC by machining out the PCB board
• PCB plating:
  
  • Connectors are hard gold
  • Wire bonding pads soft gold
• Add test points for the digital test structure signals
  

Carrier Board Requirements:

• Support full 3+1, Pair only, 1+Test chip configurations
• Detachable passive daughter card for irradiation
• (digital only)
• Socketed connector for an daughter card with an edge connector
  • High speed digital, SACI control, LV power, and HV control to/from the daughter board
  Flexible connection scheme to support edge TCT, test beam setups (in particular cold daughter board regime)
• Flexible timing control for multi-chip operation
• Interface to backend readout with just one SFP fiber link should be the most flexible generic form for evolution.     
  Ideally, also allow easy extension to ABCN’, HCC* and GBT emulation.   
  • Primarily PGP
  • Capable of supporting 1 GigE  (1000BASE-SX)
• Generic control/data interface for compatibility with main backend readout schemes of RCE and NEXYS video
  • RCE via SFP
  • NEXY via SFP (and FMC???)