Page History

...

The main goal of the 3D sensor collaboration in 2009 is to validate the 3D sensor for the Insertable B Layer (IBL). The choice of the pixel technology for the IBL shall be made by the end of 2009 or early 2010. For most 2009 tests, the front end chip will be the FE-I3. FE-I4 chips are expected by fall. 

General documentation:

ATLAS 3D sensor homepage:

http://atlas-highlumi-3dsensor.web.cern.ch/atlas-highlumi-3dsensor/Default.htm 

Project status at Nov. 2008 Nihkef Workshop, slides from Cinzia Di Via:

http://indico.cern.ch/getFile.py/access?contribId=83&sessionId=12&resId=0&materialId=slides&confId=32084 

3D sensor Collaboration Meeting (09 January 2009):

http://indico.cern.ch/conferenceDisplay.py?confId=47654 

General presentations:

1. Colloqium by Sherwood Parker
2. SLAC instrumentation seminar: Cinzia Di Via (21 January 2009)