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• Wirebonds shall be encapsulated with Sylgard 186, vacuum permitting
• Back of detector shall be passivated from any conductive support to 1000V test
• Conductive supports shall have low impedance connection to AVDD AGND (<5? ohms to entire support)
• Bias voltage shall be supplied to back side directly by wirebonds
• Sensor modules shall be removable from base plates